Patents by Inventor Chunlin C. Xia

Chunlin C. Xia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for fabricating sensor device package using a sealing structure
    Patent number: 8476087
    Abstract: Fabrication methods are provided for a sensor device packages. An exemplary fabrication method involves bonding a sensor structure and another structure using a sealing structure. The sealing structure surrounds a diaphragm region of the sensor structure and provides an airtight seal between the sensor structure and the other structure to establish a fixed reference pressure on one side of the diaphragm region.
    Type: Grant
    Filed: April 21, 2011
    Date of Patent: July 2, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Stephen R. Hooper, Dwight L. Daniels, James D. MacDonald, William G. McDonald, Chunlin C. Xia
  • Sensor device with sealing structure
    Patent number: 8384168
    Abstract: Apparatus and related fabrication methods are provided for a sensor device. The sensor device includes a sensor structure including a first portion having a sensing arrangement formed thereon and a second structure. A sealing structure is interposed between the sensor structure and the second structure, wherein the sealing structure surrounds the first portion of the sensor structure. The sealing structure establishes a fixed reference pressure on a first side of the first portion, and an opposing side of the first portion is exposed to an ambient pressure.
    Type: Grant
    Filed: April 21, 2011
    Date of Patent: February 26, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Stephen R. Hooper, Dwight L. Daniels, James D. MacDonald, William G. McDonald, Chunlin C. Xia
  • SENSOR DEVICE WITH SEALING STRUCTURE
    Publication number: 20120266684
    Abstract: Apparatus and related fabrication methods are provided for a sensor device. The sensor device includes a sensor structure including a first portion having a sensing arrangement formed thereon and a second structure. A sealing structure is interposed between the sensor structure and the second structure, wherein the sealing structure surrounds the first portion of the sensor structure. The sealing structure establishes a fixed reference pressure on a first side of the first portion, and an opposing side of the first portion is exposed to an ambient pressure.
    Type: Application
    Filed: April 21, 2011
    Publication date: October 25, 2012
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Stephen R. Hooper, Dwight L. Daniels, James D. MacDonald, William G. McDonald, Chunlin C. Xia
  • METHODS FOR FABRICATING SENSOR DEVICE PACKAGE USING A SEALING STRUCTURE
    Publication number: 20120270354
    Abstract: Fabrication methods are provided for a sensor device packages. An exemplary fabrication method involves bonding a sensor structure and another structure using a sealing structure. The sealing structure surrounds a diaphragm region of the sensor structure and provides an airtight seal between the sensor structure and the other structure to establish a fixed reference pressure on one side of the diaphragm region.
    Type: Application
    Filed: April 21, 2011
    Publication date: October 25, 2012
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Stephen R. Hooper, Dwight L. Daniels, James D. MacDonald, William G. McDonald, Chunlin C. Xia