Abstract: An insertion device includes an upper casing, an insertion module and a lower casing. The insertion module is disposed in the upper casing, and includes a main body assembly, an insertion seat, a first elastic member, a retraction seat and a second elastic member. When the upper casing is depressed, the insertion seat is driven by the first elastic member to perform an automatic-insertion operation, such that limiting structure between the insertion seat and the retraction seat collapses upon the collapse of another limiting structure between the insertion seat and the main body assembly, and that the retraction seat is driven by the second elastic member to perform an automatic-retraction operation.

Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.

Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.

Abstract: Provided are compounds having a tetradentate structure of that are useful as emitters in OLED applications.

Abstract: An elastic physiological patch includes a patch assembly and an implant assembly. The patch assembly includes an electronic device, and a soft patch body defining a chamber for receiving the electronic device. The implant assembly is mountable to the electronic device and includes an implant which is capable of being driven to partially pass through the patch body and which is adapted to be implanted in the skin of a subject. The implant and the patch body cooperatively seal the chamber.

Abstract: A striking practice device includes a striking body, a cover, a connecting rod and an outer fixing plate. The striking body includes a hollow portion inside, an assembly hole formed along a direction of the striking body and a cover bole formed along another direction of the striking body. The assembly hole has an inner junction at the hollow portion of the striking body and an outer junction outside the striking body; the cover has a shape corresponding to the cover hole for sealing the cover hole; the connecting rod is installed to the assembly hole and has an inner fixing plate at an end; the inner fixing plate is greater than the assembly hole and disposed at the inner junction; and the outer fixing plate is fixed to the connecting rod and the outer junction of the striking body.

Abstract: A key structure including a carrier, a keycap, a lifting member, and an elastic member is provided. The carrier includes a carrier body and multiple positioning hooks. The carrier body has multiple vias, and the positioning hooks are respectively disposed corresponding to the vias. Orthographic projection of each of the positioning hooks falls in the corresponding via. Each of the positioning hooks includes a first positioning portion and a second positioning portion respectively connected to two inner wall surfaces in the corresponding via. The keycap is disposed above the carrier body. The lifting member is disposed between the carrier body and the keycap. One end of the lifting member is connected to the keycap, and an other end of the lifting member is connected to the positioning hooks. The elastic member is disposed between the carrier body and the keycap.

Abstract: A sensing device including a substrate, a switching element, a sensing element and a common electrode is provided. The switching element is disposed on the substrate and includes a source electrode. The sensing element is disposed at one side of the switching element and includes a lower electrode, a photoelectric conversion layer and an upper electrode. The lower electrode is electrically connected to the source electrode. The photoelectric conversion layer is disposed on the lower electrode. The upper electrode is disposed on the photoelectric conversion layer. The common electrode is electrically connected to the upper electrode and belongs to the same film layer as the source electrode. A fabricating method of a sensing device is also provided.

Abstract: The invention relates to a method of manufacturing conjugated diene-based polymers. The conjugated diene-based polymers are obtained by polymerizing conjugated diene monomers or conjugated diene monomers and vinyl aromatic monomers using an initiator, wherein the initiator is obtained by reacting a divinylarene-like compound represented by the formula (1) with an organic alkali metal; A and B are CnH2n+1 or an aromatic ring, n is 0~5, A and B can be the same or different, and Q is an aromatic ring; wherein the molar ratio of the divinylarene-like compound to the effective active organic alkali metal is 1.3-5.0. The present invention further relates to a rubber comprising the conjugated diene-based polymers, and a tire comprising the rubber.

Abstract: A modular control system for controlling an AGV includes an interface, a processor, a memory, and a plurality of programs. The plurality of programs include a task scheduling module, a sensor fusion module, a mapping module, and a localization module. The interface receives a command signal from an AGV management system and sensor signals from a plurality of sensors. The memory stores a surrounding map and the plurality of programs to be executed by the processor. The task scheduling module converts the command signal to generate an enabling signal. The sensor fusion module processes the received sensor signals according to the enabling signal and generates an organized sensor data. The mapping module processes the organized sensor data and the surrounding map to generate an updated surrounding map. The localization module processes the organized sensor data and the updated surrounding map to generate a location and pose signal.

Abstract: A key module includes a base plate, a circuit layer and a lifting mechanism. The circuit layer is disposed on the base plate. The lifting mechanism is pivotally connected with the base plate relative to the circuit layer, and the lifting mechanism has an abutment element. The abutment element could interfere with the circuit layer to reduce the noise generated by the key module during operation.

Abstract: A key assembly includes a bottom plate, a keycap disposed on the bottom plate, an elastic member disposed between the bottom plate and the keycap, a link member, and a protruding member. The keycap has an inner surface facing the bottom plate and includes a link member pivoting portion protruding from the inner surface. The link member pivoting portion has a pivot hole and an opening communicating with the pivot hole and away from the inner surface. A size of the opening is smaller than a size of the pivot hole. The link member is rotatably disposed in the pivot hole. The protruding member is disposed between the inner surface of the keycap and the link member. The link member is supported by the protruding member and contacts a part of the link member pivoting portion near the opening on a wall surface surrounding the pivot hole.

Abstract: A key module includes a base plate, a circuit layer and a lifting mechanism. The circuit layer is disposed on the base plate. The lifting mechanism is pivotally connected with the base plate relative to the circuit layer, and the lifting mechanism has an abutment element. The abutment element could interfere with the circuit layer to reduce the noise generated by the key module during operation.

Abstract: A key assembly includes a bottom plate, a keycap disposed on the bottom plate, an elastic member disposed between the bottom plate and the keycap, a link member, and a protruding member. The keycap has an inner surface facing the bottom plate and includes a link member pivoting portion protruding from the inner surface. The link member pivoting portion has a pivot hole and an opening communicating with the pivot hole and away from the inner surface. A size of the opening is smaller than a size of the pivot hole. The link member is rotatably disposed in the pivot hole. The protruding member is disposed between the inner surface of the keycap and the link member. The link member is supported by the protruding member and contacts a part of the link member pivoting portion near the opening on a wall surface surrounding the pivot hole.

Abstract: A keyboard device and an operating method thereof are provided. The keyboard device includes a microcontroller, a drive circuit, a backlight module, and a plurality of key units. The microcontroller is coupled to a computer device. A detection module of the computer device detects an input mode of the computer device. The plurality of key units is disposed on the backlight module. The plurality of key units each has a plurality of character symbols corresponding to different input modes. The microcontroller outputs a control signal to the drive circuit according to the input mode. The drive circuit drives the backlight module according to the control signal to selectively illuminate one of the plurality of character symbols of each of at least a portion of the plurality of key units.

Abstract: A gate oxide forming process includes the following steps. A substrate including a first area and a second area is provided. A first oxide layer, a silicon containing cap layer and a second oxide layer on the substrate of the first area and the second area are sequentially and blanketly formed. The silicon containing cap layer and the second oxide layer in the first area are removed. An oxidation process is performed to oxidize the silicon containing cap layer and a gate oxide layer is formed in the second area.

Abstract: A gate oxide forming process includes the following steps. A substrate including a first area and a second area is provided. A first oxide layer, a silicon containing cap layer and a second oxide layer on the substrate of the first area and the second area are sequentially and blanketly formed. The silicon containing cap layer and the second oxide layer in the first area are removed. An oxidation process is performed to oxidize the silicon containing cap layer and a gate oxide layer is formed in the second area.

Abstract: A key assembly including a base plate, a keycap, an elastic member, and a link member is provided. The base plate includes a body and a hook portion, the hook portion including a hole. The keycap is disposed on the base plate. The elastic member is disposed between the base plate and the keycap. The link member includes a connecting portion, a rod portion, and an end portion, the rod portion being assembled to the keycap, the connecting portion being connected between the rod portion and the end portion, and the end portion penetrating the hole, wherein an included angle between the end portion and the connecting portion is an obtuse angle.

Abstract: A key module includes a base plate, a circuit layer and a lifting mechanism. The circuit layer is disposed on the base plate. The lifting mechanism is pivotally connected with the base plate relative to the circuit layer, and the lifting mechanism has an abutment element. The abutment element could interfere with the circuit layer to reduce the noise generated by the key module during operation.

Abstract: The present invention provides a modified rubber containing silicon and phosphorus, and a composition and manufacturing method thereof. The present invention provides the modified rubber structured as formula (1), wherein X is selected from a C1-C12 alkylene group, a C2-C12 alkenylene group, a C3-C12 alicyclic group, and a C6-C12 aromatic group; and A1, A2, A3, Y, and Z are each independently selected from an alkyl group, an alkoxy group, a halide group, and a conjugated diene rubber, wherein the conjugated diene rubber is a polymer composed of a conjugated diene monomer or the conjugated diene monomer with a vinyl aromatic monomer, A1, A2, A3, Y, and Z are the same or different from each other, and at least one of A1, A2, A3, Y, and Z is the conjugated diene rubber.