Patents by Inventor Chunlin Jia

Chunlin Jia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6353234
    Abstract: The invention concerns a layered arrangement comprising at least one layer based on a high-temperature superconductive material with at least one unit cell having a CuO2 plane, the layer being connected to a non-supeconductive layer. A modified interface layer is provided between the two layers. Alternatively, at least one of the contacting layers can be modified in the interface region. Modification can be brought about by doping with metallic ions or implantation.
    Type: Grant
    Filed: February 11, 1999
    Date of Patent: March 5, 2002
    Assignee: Forschungszentrum Julich GmbH
    Inventors: Mikhail Faley, Ulrich Poppe, Chunlin Jia
  • Patent number: 6191073
    Abstract: The invention relates to a series of layers containing at least one layer on the basis of REBa2CU3O7-Z or with a comparable crystallographic structure, wherein said layer is connected to a non-superconductive layer. The only material chosen for the non-superconductive layer is material containing atomic components which are chemically compatible with the superconductive material of the high temperature superconductive layer. Such a series of layers enables a multilayer system or also a cryogenic component, e.g. a Josephson contact, to be formed.
    Type: Grant
    Filed: February 27, 1999
    Date of Patent: February 20, 2001
    Assignee: Forschungszentrum Julich GmbH
    Inventors: Ricardo Hojczyk, Ulrich Poppe, Chunlin Jia