Patents by Inventor Chun Lin TU

Chun Lin TU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COOLING MODULE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220341677
    Abstract: A cooling module includes a thermally conductive plate and a heat pipe. The thermally conductive plate includes a groove having two inner walls that are opposite to each other, a first upper protrusion protrusively located on the plate body and the first inner wall, a second upper protrusion protrusively located on the plate body and the second inner wall, a first lower protrusion protrusively located on the first inner wall, and a second lower protrusion protrusively located on the second inner wall. The heat pipe is located in the groove, and cooperatively secured by the first upper protrusion, the second upper protrusion, the first lower protrusion and the second lower protrusion.
    Type: Application
    Filed: March 15, 2022
    Publication date: October 27, 2022
    Inventors: Chun Lin TU, I Chuan LAI, Wei Po CHEN, Chung Lin CHEN