Patents by Inventor Chunlong Hu

Chunlong Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240148180
    Abstract: The disclosure provides a coffee machine. The machine includes a main housing, wherein the main housing has: a coffee bean silo; a bean grinding assembly, wherein the bean grinding assembly is connected with a bean outlet of the coffee bean silo; a boiler piston assembly including a coffee machine boiler, a bag pressing mechanism and an ejector mechanism, wherein the coffee machine boiler is connected with a material outlet of the bean grinding assembly, the bag pressing mechanism includes a bag pressing block that is connected with a piston assembly, wherein the piston assembly can drive the bag pressing block to perform bag pressing on coffee in the coffee machine boiler, the ejector mechanism can eject a coffee cake in the coffee machine boiler after the coffee extraction is completed; a coffee grounds box; water tank; a waterway switching mechanism; and a coffee dispensing spout.
    Type: Application
    Filed: April 20, 2023
    Publication date: May 9, 2024
    Inventors: MING CHENG, XINWU WANG, CHUNLONG HU
  • Patent number: 8302840
    Abstract: A method of applying bonding energy to form a bond between a portion of a wire and a contact of a bonding location using a wire bonding machine is provided. The method includes: (1) moving a bonding tool towards the contact; (2) detecting when a portion of the contact (100a) is pressed against a device supporting surface (112) of the wire bonding machine; and (3) applying bonding energy to the portion of the contact such that a bond is formed between the contact and the portion of wire.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: November 6, 2012
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Wei Qin, Ziauddin Ahmad, John David Molnar, Deepak Sood, E. Walter Frasch, Chunlong Hu
  • Publication number: 20100108744
    Abstract: A method of applying bonding energy to form a bond between a portion of a wire and a contact of a bonding location using a wire bonding machine is provided. The method includes: (1) moving a bonding tool towards the contact; (2) detecting when a portion of the contact (100a) is pressed against a device supporting surface (112) of the wire bonding machine; and (3) applying bonding energy to the portion of the contact such that a bond is formed between the contact and the portion of wire.
    Type: Application
    Filed: October 5, 2007
    Publication date: May 6, 2010
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Wei Qin, Ziauddin Ahmad, John David Molnar, Deepak Sood, E. Walter Frasch, Chunlong Hu