Patents by Inventor Chun-Mei Zhang

Chun-Mei Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10171715
    Abstract: A camera module includes a circuit board, a camera device and an image processing chip. An image sensation chip of the camera device is directly integrated with the circuit board by means of chip-on-board (COB) manufacturing process to minify the total volume of the camera module, whereby the camera module can be disposed in a narrow space.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: January 1, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Wei-Chuan Wang, Xin-Lian Cheng, Ting-Yu Lin, Chun-Mei Zhang, Chin-Lian Yeh
  • Publication number: 20180213129
    Abstract: A camera module includes a circuit board, a camera device and an image processing chip. An image sensation chip of the camera device is directly integrated with the circuit board by means of chip-on-board (COB) manufacturing process to minify the total volume of the camera module, whereby the camera module can be disposed in a narrow space.
    Type: Application
    Filed: January 26, 2017
    Publication date: July 26, 2018
    Inventors: Wei-Chuan Wang, Xin-Lian Cheng, Ting-Yu Lin, Chun-Mei Zhang, Chin-Lian Yeh
  • Patent number: D670702
    Type: Grant
    Filed: December 30, 2011
    Date of Patent: November 13, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chun-Mei Zhang, Chiang-Kuo Tang, Yu-Hou Chyan, Te-Sheng Jan