Abstract: A lighting device having resettable over-current protection function includes a light source module, a power supplying module, a DC-to-DC converting module, an over-current short-circuit protection module, a reference voltage generating module and a self-locking protection module. The power supplying module generates an input voltage. The DC-to-DC converting module converts the input voltage into a driving voltage to drive the light source module. The over-current short-circuit protection module generates a voltage detecting by detecting a driving current passing through the light source module. The reference voltage generating module generates a reference voltage according to the input voltage and the voltage detecting signal.

Abstract: A semiconductor die is provided. The semiconductor die includes a substrate having a front surface, a rear surface opposite to the front surface, and a sidewall connected between the front surface and the rear surface. The sidewall includes a first primary segment immediately connected to the front surface, a second primary segment immediately connected to the rear surface, and a middle segment between the first primary segment and the second primary segment. The slope of the second primary segment is less than the slope of the first primary segment, and the slope of the middle segment is less than the slope of the second primary segment. Each of the first primary segment, the second primary segment, and the middle segment is a flat surface having a slope greater than 0 degrees relative to a line parallel to the front surface of the substrate.

Abstract: A method includes forming a fin protruding from a substrate, the fin including an epitaxial stack over a fin base and a hard mask layer over the epitaxial stack, the epitaxial stack including first and second semiconductor layers of different material compositions, performing a first etching process to etch the hard mask layer, the first etching process including applying a first combination of etchants, performing a second etching process to etch the epitaxial stack, the second etching process including applying a second combination of etchants, and performing a third etching process to etch the fin base, the third etching process including applying a third combination of etchants. The first, second, and third combinations of etchants are different from each other.

Abstract: A method for performing camera modality adaptation in a simultaneous localization and mapping (SLAM) device is provided. The SLAM device includes a camera sensor and a SLAM processor. The method includes acquiring data from the SLAM device, and determining, based on the acquired data, an operational condition of the SLAM device. The method also includes deciding, based on the determined operational condition, a camera modality for the SLAM device. The method further includes controlling, based on the decided camera modality, a camera modality of an image sequence inputted into the SLAM processor.

Abstract: An emergency lighting device includes a rechargeable battery module, a charging control module, a processing module and an indicator module. The charging control module is connected to the rechargeable battery module, and has a first monitoring point and a second monitoring point. A first monitoring resistor is disposed between the first monitoring point and the positive electrode of the rechargeable battery module. The second monitoring resistor is disposed between the first and second monitoring points. The processing module is connected to the charging control module, and has a first monitoring pin and a second monitoring pin used to detect the first voltage of the first monitoring point and the second voltage of the second monitoring point respectively to perform a battery level calculating mode and obtain the estimated battery level. The processing module controls the indicator module to perform a light-emitting mode according to the estimated battery level.

Abstract: A method for sawing a semiconductor wafer is provided. The method includes sawing the semiconductor wafer with a first dicing blade to form a first opening. The semiconductor wafer includes a dicing tape and a substrate attached to the dicing tape. The first opening is formed in the upper portion of the substrate. The method also includes sawing the semiconductor wafer with a second dicing blade from the first opening to form a second opening under the first opening and in the middle portion of the substrate. The method further includes sawing the semiconductor wafer with a third dicing blade from the second opening to form a third opening under the second opening and penetrating the lower portion of the substrate, so that the semiconductor wafer is divided into two dies. The first dicing blade, the second dicing blade, and the third dicing blade have different widths.

Abstract: A method for CMP includes following operations. A first metal layer and a second metal layer are formed in a dielectric structure. The second metal layer is formed over a portion of the first metal layer. A first composition is provided to remove a portion of the first metal layer. A second composition is provided to form a protecting layer over the second metal layer. The protecting layer is removed to expose the second metal layer. A CMP operation is performed to remove a portion of the first metal layer, a portion of the second metal layer and a portion of the dielectric structure.

Abstract: A head-mounted display device includes a display, two brackets, two buckles, and a headband module. The display has two buckling parts respectively located on opposite sides of the display. The brackets are respectively pivotally connected to opposite sides of the display. The buckles are respectively pivotally connected to the brackets. When the buckles are buckled onto the buckling parts, an unfolding angle of each bracket is limited to be greater than a locked angle. When the unfolding angle of each bracket is greater than an unlocked angle, the buckles are separated from the buckling parts. The unlocked angle is greater than the locked angle. When the buckles are separated from the buckling parts, the unfolding angle of each bracket is smaller than the locked angle. Opposite sides of the headband module are respectively detachably assembled to an end of each bracket away from the display.

Abstract: A method for performing frame rate adaptation in a simultaneous localization and mapping (SLAM) device is provided. The SLAM device includes a SLAM processor. The method includes: acquiring data from the SLAM device; determining, based on the acquired data, an operative condition of the SLAM device; deciding, based on the determined operative condition, a target frame rate for the SLAM device; and controlling, based on the decided target frame rate, a frame rate of an image sequence inputted into the SLAM processor.

Abstract: A power module package structure includes a first substrate and a power component. The first substrate includes at least one conductive layer on a surface thereof. The power component includes a first chip and a first spacer. The first chip has at least one electrode. The first spacer in a heat dissipation space between the first substrate and the first chip includes an insulating heat dissipation layer in the heat dissipation space and multiple vertical conductive connectors, each of the vertical conductive connectors penetrates the insulating heat dissipation layer. The insulating heat dissipation layer surrounds the vertical conductive connectors and electrically isolates the vertical conductive connectors. The vertical conductive connector includes two opposite ends, one end electrically connected to the conductive layer, and the other end electrically connected to the electrode to form a conductive path and a heat dissipation path between the first chip and the first substrate.

Abstract: A lighting device having intelligent predicting function is provided, which includes a driving module, a light source and an intelligent predicting control module. The light source is connected to the driving module. The intelligent predicting control module is connected to the driving module and communicates with an intelligent predicting sensing device disposed at a position away from the intelligent predicting control module. The intelligent predicting sensing device detects a moving object to generate a first sensing signal and transmits the first sensing signal to the intelligent predicting control module, such that the intelligent predicting control module turns on the light source via the driving module.

Abstract: A first packet flow and a second packet flow support a first protocol, a third packet flow and a fourth packet flow support a second protocol, and a priority of the first protocol is lower than a priority of the second protocol. The first packet flow and the third packet flow are transmitted from a first ingress port to a first egress port. The second packet flow and the fourth packet flow are transmitted from a second ingress port to a second egress port. When the packet processing device is in a congested state, a bandwidth modulator performs a first suppression process on the first packet flow at the first ingress port, and the bandwidth modulator performs a second suppression process on the second packet flow at the second egress port or on the third packet flow at the first ingress port.

Abstract: The present invention relates to cereal grain comprising an aleurone, an embryo, a starchy endosperm and a reduced level and/or activity of a mitochondrial single-stranded DNA binding (mtSSB) polypeptide, a RECA3 polypeptide or a TWINKLE polypeptide. Grain of the invention, or aleurone therefrom, has improved nutritional properties, and hence is particularly useful for human and animal feed products.

Abstract: An intelligent lighting device control system includes a plurality of lighting devices and an intelligent lighting device controller. The intelligent lighting device controller includes a detecting module, a main power source module and an intelligent control module. The detecting module has a detecting circuit. The main power source module includes a plurality of first electrode connectors and a common electrode connector. The first electrode connectors are connected to the detecting circuit and connected to the first electrodes of the lighting devices via the detecting circuit. The common second electrode connector is connected to the second electrodes of the lighting devices and outputs an electricity signal to drive the lighting devices, such that the detecting circuit generates a plurality of detecting signals. The intelligent control module generates a feedback signal according to the detecting signals and the main power source module adjusts the electricity signal according to the feedback signal.

Abstract: An LED lighting device with light spectrum adjustment function, which includes a light source group, a white light color temperature adjustment switch, a red/blue light ratio adjustment switch, a controller and a constant-current control circuit. The light source group includes a red LED, a blue LED, a first white LED and a second white LED. The white light color temperature adjustment switch generates a white light color temperature control signal. The red/blue light ratio adjustment switch generates a red/blue light ratio control signal. The controller receives the white light color temperature control signal and the red/blue light ratio control signal so as to generate an integrated control signal. The constant-current control circuit outputs a driving current according to the integrated control signal to control the above LEDs in order to generate a light having a target color temperature and a target light spectrum.

Abstract: A multi-function intelligent lighting device control system includes a plurality of lighting devices and an intelligent lighting device controller. The controller includes a detecting module, a main power source module, an intelligent control module and an intelligent dimming module. The detecting module includes a detecting circuit. The first electrode connectors of the main power source module are connected to the detecting circuit and connected to the first electrodes of the lighting devices via the detecting circuit. The common second electrode connector of the main power source module is connected to the second electrodes of the lighting devices and outputs an electricity signal to drive the lighting devices, such that the detecting circuit generates a plurality of detecting signals. The intelligent control module generates a feedback signal to perform the adaptive adjustment function accordingly. The intelligent dimming module receives a dimming signal to adjust the brightness of the lighting devices.

Abstract: An intelligent lighting device control system includes a plurality of lighting devices and an intelligent lighting device controller. The intelligent lighting device controller includes a detecting module, a main power source module and an intelligent control module. The detecting module has a detecting circuit. The main power source module includes a plurality of first electrode connectors and a common electrode connector. The first electrode connectors are connected to the detecting circuit and connected to the first electrodes of the lighting devices via the detecting circuit. The common second electrode connector is connected to the second electrodes of the lighting devices and outputs an electricity signal to drive the lighting devices, such that the detecting circuit generates a plurality of detecting signals. The intelligent control module generates a feedback signal according to the detecting signals and the main power source module adjusts the electricity signal according to the feedback signal.

Abstract: An intelligent lighting device controller includes a detecting module, a main power source module and an intelligent control module. The detecting module has a detecting circuit. The main power source module has a plurality of first electrode connectors and a common second electrode connector. The first electrode connectors are connected to the detecting circuit and connected to the first electrodes of a plurality of lighting devices respectively via the detecting circuit. The common second electrode connector outputs an electricity signal to drive the lighting devices. The intelligent control module is connected to the detecting module and the main power source module. The detecting circuit generates a plurality of detecting signals corresponding to the lighting devices respectively. The intelligent control module generates a feedback signal and transmits the feedback signal to the main power source module. The main power source module adjusts the electricity signal according to the feedback signal.

Abstract: Disclosed is a data flow classification device including a forwarding circuit and a configuring circuit. The forwarding circuit looks the classification of an input flow up in a lookup table according to the information of the input flow, tags the packets of the input flow with the classification, and outputs the packets to a buffer circuit. The configuring circuit receives and stores the identification and traffic information of multiple flows, and accordingly calculates the traffic of the multiple flows, wherein the multiple flows include the input flow. The configuring circuit further determines an elephant flow threshold according to a queue length of the buffer circuit and a target length, determines the classifications of the multiple flows according to the comparison between the traffic of the multiple flows and the elephant flow threshold, and stores these classifications in the lookup table.

Abstract: A high-durability tri-proof lamp with color temperature adjustment function is provided, which includes a lamp housing, a movable support plate, a circuit board and a driving power source. The lamp housing has two connection holes and a guiding groove. The lamp housing is hollow and has a chamber; the connection holes are disposed at the two ends of the lamp housing. The guiding groove includes two lateral guiding slots disposed at the two sides of the chamber. The movable support plate is disposed in the chamber. One side of the movable support plate and the other side thereof are inserted into the lateral guiding slots, such that the movable support plate is able to move along the guiding groove. The circuit board is disposed in the chamber and connected to the movable support plate. The driving power source is disposed on and electrically connected to the circuit board.