Abstract: In STEP 1, a mapping operation is carried out by a mapping device. In STEP 2, based on position information for the wafer (W) detected by the mapping operation, it is determined whether or not a wafer (W) position is in an abnormal state or not. When the wafer position is determined to be in the abnormal state (Yes), a closing/opening operation, in which a FOUP door (19c) is temporarily closed and then opened, is carried out in STEP 3. In STEP 4, the number of times the FOUP door (19c) is closed/opened (in other words, the number of times a port door (62) is closed/opened) is counted, and in STEP 5, it is determined whether or not this count value is less than a preset value. If the count value is less than the preset value (Yes), the processing in STEP 1-STEP 5 is repeated once again.

Abstract: A semiconductor manufacturing system includes circuitry configured to execute: displaying a screen for selecting an inspection set including inspection items having a manipulation item and/or a check item; retrieving the inspection items, arranging the inspection items in the order of workflow, and displaying each inspection item on a screen with an execution attribute indicating whether each inspection item is “automatic” or “manual” execution; receiving an inspection start command and reading the first inspection item from a storage unit. The circuitry also executes steps corresponding to the following cases (a) to (d) until there are no more inspection items: (a) the read-out inspection item being the manipulation item and “automatic”; (b) the read-out inspection item being the manipulation item and “manual”; (c) the read-out inspection item being the check item and “automatic”; and (d) the read-out inspection item being the check item and “manual”.

Abstract: In STEP 1, a mapping operation is carried out by a mapping device. In STEP 2, based on position information for the wafer (W) detected by the mapping operation, it is determined whether or not a wafer (W) position is in an abnormal state or not. When the wafer position is determined to be in the abnormal state (Yes), a closing/opening operation, in which a FOUP door (19c) is temporarily closed and then opened, is carried out in STEP 3. In STEP 4, the number of times the FOUP door (19c) is closed/opened (in other words, the number of times a port door (62) is closed/opened) is counted, and in STEP 5, it is determined whether or not this count value is less than a preset value. If the count value is less than the preset value (Yes), the processing in STEP 1-STEP 5 is repeated once again.

Abstract: A semiconductor manufacturing system includes a program for inspecting a device of the system executing: displaying a screen for selecting an inspection set including inspection items having a manipulation item and/or a check item; retrieving the inspection items, arranging the inspection items in the order of workflow, and displaying each inspection item on a screen with an execution attribute indicating whether each inspection item is “automatic” or “manual” execution; receiving an inspection start command and reading the first inspection item from a storage unit. The program also executes steps corresponding to the following cases (a) to (d) until there are no more inspection items: (a) the read-out inspection item being the manipulation item and “automatic”; (b) the read-out inspection item being the manipulation item and “manual”; (c) the read-out inspection item being the check item and “automatic”; and (d) the read-out inspection item being the check item and “manual”.