Patents by Inventor Chunning YANG
Chunning YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12381068Abstract: A radio frequency (RF) screen for a microwave powered ultraviolet (UV) lamp system is disclosed. In one example, a disclosed RF screen includes: a sheet comprising a conductive material; and a frame around edges of the sheet. The conductive material defines a predetermined mesh pattern of individual openings across substantially an operative area of the screen. Each of the individual openings has a triangular shape.Type: GrantFiled: May 17, 2024Date of Patent: August 5, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sheng-chun Yang, Po-Wei Liang, Chao-Hung Wan, Yi-Ming Lin, Liu Che Kang
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Publication number: 20250241903Abstract: Provided herein are methods, use, and compositions for treating systolic dysfunction such as heart failure with reduced ejection fraction.Type: ApplicationFiled: December 26, 2024Publication date: July 31, 2025Inventors: Jean-Francois Tamby, Chun Yang, Timothy Carlson
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Patent number: 12376226Abstract: Voids are introduced in a copper shape to reduce warpage experienced by a printed circuit board during a reflow process. Copper shapes on an outer layer of a printed circuit board may be used to connect large packages that include ball grid arrays to the printed circuit board. The copper shapes may induce warpage in the printed circuit board during the reflow process. Routing a mesh pattern of voids in the copper shapes may reduce solder ball joint cracking and pad cratering during reflow and make solder joints more reliable. The voids may make the copper shapes less ridged and change the copper heat dissipation profile to remove sharp warpage forces that cause solder joints to experience pad cratering. The voids may be 8 milĂ—8 mil cuts or indentations in the copper shape.Type: GrantFiled: May 5, 2021Date of Patent: July 29, 2025Assignee: Microsoft Technology Licensing, LLCInventors: Benito Joseph Rodriguez, Shu-Ming Chang, Dillip Kumar Dash, Po Chun Yang, Juan-Yi Wu
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Patent number: 12367795Abstract: An image display device is disclosed in which electrical connection to a rotary body is reliably maintained during rotation of the rotary body and supply of power and transmission and reception of a signal are stabilized. Since transmission and reception of a signal between a communication transmitter and a communication receiver are implemented through a cavity formed in a motor, introduction of an external signal is blocked, and thus security and control stability are ensured. Even when a rotary module rotates at a high speed, damage thereto due to friction is prevented, and thus the durability thereof is ensured. Rotation of the rotary module is stabilized through structural stabilization.Type: GrantFiled: November 21, 2023Date of Patent: July 22, 2025Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, SL CORPORATIONInventors: Joon Bo Shim, Yong Duk Bae, Cheol Chun Yang, Ji Hun Park, Hee Beom Park, Jung Hee Seo, Gyun Chae
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Publication number: 20250234602Abstract: A semiconductor device and a method of fabricating the semiconductor device are disclosed. The method includes forming a nanostructured layer on a substrate, forming a gate structure surrounding the nanostructured layer, forming a S/D region adjacent to the nanostructured layer, forming a contact opening on the S/D region, depositing a first conductive layer in the contact opening using a first deposition process, performing a plasma etch process on the first conductive layer, depositing a second conductive layer on the first conductive layer using a second deposition process different from the first deposition process, and depositing a metal layer on the second conductive layer.Type: ApplicationFiled: January 12, 2024Publication date: July 17, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chi-Cheng HUNG, Yen-Hsung HO, Shan Chun YANG, Yu-Ting LIN, Po-Wei WANG, Tai-Ting SU
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Publication number: 20250234793Abstract: A semiconductor structure includes a first electrode, a second electrode and a dielectric layer. The second electrode is disposed over the first electrode. The dielectric layer is disposed between the first electrode and the second electrode, and is configured to store information, wherein a bandgap at a first surface of the dielectric layer facing the first electrode is greater than a bandgap at a second surface of the dielectric layer facing the second electrode. A method of manufacturing the semiconductor structure is also provided.Type: ApplicationFiled: January 11, 2024Publication date: July 17, 2025Inventors: SHIH-FENG LIU, CHUN-YANG TSAI, KUO-CHING HUANG, HARRY-HAKLAY CHUANG
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Patent number: 12363945Abstract: A method includes forming a protruding semiconductor stack including a plurality of sacrificial layers and a plurality of nanostructures, with the plurality of sacrificial layers and the plurality of nanostructures being laid out alternatingly. The method further includes forming a dummy gate structure on the protruding semiconductor stack, etching the protruding semiconductor stack to form a source/drain recess, and forming a source/drain region in the source/drain recess. The formation of the source/drain region includes growing first epitaxial layers. The first epitaxial layers are grown on sidewalls of the plurality of nanostructures, and a cross-section of each of the first epitaxial layers has a quadrilateral shape. The first epitaxial layers have a first dopant concentration. The formation of the source/drain region further includes growing a second epitaxial layer on the first epitaxial layers. The second epitaxial layer has a second dopant concentration higher than the first dopant concentration.Type: GrantFiled: April 4, 2022Date of Patent: July 15, 2025Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsz-Mei Kwok, Yung-Chun Yang, Cheng-Yen Wen, Li-Li Su, Yee-Chia Yeo
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Publication number: 20250216046Abstract: Embodiments of the specification disclose a vehicle lamp optical element, a vehicle lamp module, and a vehicle, and belongs to the technical field of vehicle lamps. A solution may include: a vehicle lamp optical element, including one or more optical units, where a front end of the optical unit is provided with a light emitting surface, a rear end thereof is provided with a light receiving structure, the light receiving structure includes a light incident surface and a reflecting surface, the light receiving structure is configured to reflect light that is incident from the light incident surface through the reflecting surface and then form an intermediate light image at a focal plane of the light emitting surface, and the light emitting surface is configured to image the intermediate light image to a front of the vehicle lamp optical element.Type: ApplicationFiled: September 16, 2024Publication date: July 3, 2025Applicant: Anhui Senhai vision technology Co., LTDInventors: Chun YANG, Jianfeng DING
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Publication number: 20250217037Abstract: A data migration method includes, when a data migration request for a storage unit in a first storage medium is obtained, data in the storage unit is migrated to a storage unit that is in a second storage medium and does not participate in unified addressing. In a migration process, a data access request of an application is routed to the first storage medium or the second storage medium by querying a mapping relationship in a second unit mapping table and a migration state in a migration table. After the migration is completed, an address of a second storage unit is allocated to the application.Type: ApplicationFiled: March 21, 2025Publication date: July 3, 2025Inventors: Chun Yang, Xiao Lu, Guanhao Wang, Rui Yang, Xiaoping Zhu, Xingyu Luo
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Publication number: 20250208515Abstract: Provided is a painting method, adapted to a housing, and the housing includes a painting surface. The painting method includes: forming a primer layer on the painting surface; forming a contour material layer on the primer layer, and defining a pattern range on the contour material layer, and removing the contour material layer within the pattern range in a high temperature processing manner to form a contour layer with a 3D texture.Type: ApplicationFiled: April 4, 2024Publication date: June 26, 2025Inventors: Guo-Lin YANG, Po-Wen HUANG, Yu-Chun YANG, Er-Bao NIU, Tao CHEN
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Publication number: 20250208403Abstract: An ocular optical system, configuring to allow imaging rays from a display screen to enter an eye of an observer through the ocular optical system to form an image is provided. The ocular optical system comprises a first optical element and a second optical element sequentially arranged along an optical axis from an eye-side to a display-side, each of the first optical element and the second optical element comprising an eye-side surface and a display-side surface. The ocular optical system also comprises a reflective polarizing film and a quarter-wave plate, the eye-side surface of the first optical element and the display-side surface of the first optical element satisfy a conditional expression as follows: PV?160 ?m, wherein a PV is a peak to valley value of a surface. In addition, a mass production manufacturing method of the ocular optical system is also provided.Type: ApplicationFiled: December 22, 2023Publication date: June 26, 2025Applicant: GENIUS ELECTRONIC OPTICAL CO., LTD.Inventors: Matthew Francis Bone, Chun-Yang Huang
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Publication number: 20250205780Abstract: A method for manufacturing a heat conduction structure is provided, including: forming a porous metal structure by using a metal powder material; providing an electrolyte solution, where the electrolyte solution includes a high thermal conductivity nano material, and performing anodic oxidation treatment on the metal structure by using the electrolyte solution, to fill pores of the metal structure with the high thermal conductivity nano material; and performing hole sealing treatment on the metal structure.Type: ApplicationFiled: April 5, 2024Publication date: June 26, 2025Inventors: Tao CHEN, Po-Wen HUANG, Yu-Chun YANG, Guo-Lin YANG, Er-Bao NIU
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Patent number: 12342491Abstract: A server including a motherboard, a first connector, an expansion card, a second connector and an auxiliary assembly. The first connector is disposed on the motherboard. The second connector is disposed on the expansion card and plugged with the first connector. The auxiliary assembly includes a handle and a mounting protrusion. The handle is movably disposed on the motherboard, and the mounting protrusion is disposed on the expansion card. When the handle pushes the mounting protrusion, the handle facilitates the second connector and the first connector to be plugged with or detach from each other, so as to facilitate the motherboard to be electrically connected to or electrically disconnected from the expansion card.Type: GrantFiled: June 12, 2023Date of Patent: June 24, 2025Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventor: Chi-Chun Yang
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Publication number: 20250178372Abstract: A manufacturing method for a housing is provided. The manufacturing method includes: providing a substrate, where the substrate includes a metal member and a plastic member combined with the metal member, the substrate includes an appearance surface, and the appearance surface extends from the metal member to the plastic member; cleaning the appearance surface, and performing surface treatment on the appearance surface to form an oxide film; forming a colored pattern on a heat-insulating film by using a color material; and placing the heat-insulating film on the appearance surface, and transferring the colored pattern to the appearance surface by dye sublimation.Type: ApplicationFiled: July 1, 2024Publication date: June 5, 2025Inventors: Er-Bao NIU, Po-Wen HUANG, Yu-Chun YANG, Tao CHEN, Guo-Lin YANG
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Patent number: 12320468Abstract: A communication apparatus and a bracket device thereof are provided. The bracket device includes a base, a rotary shaft, a connecting member, and an elastic member. The base includes a bottom portion, a connecting portion, and a base engaging portion. The rotary shaft is rotatably disposed in the connecting portion and includes a base wall and a connecting section. The connecting member connects to the rotary shaft. The elastic member includes a body and an elastic member engaging portion. The body connects to the base wall of the rotary shaft, and the elastic member engaging portion is positioned at the body. In an engagement state, the elastic member engaging portion is engaged to the base engaging portion.Type: GrantFiled: July 12, 2021Date of Patent: June 3, 2025Assignee: WISTRON NEWEB CORPORATIONInventors: Lan-Chun Yang, Chun-Hung Huang, Li-Han Hsu, Yi-Chieh Lin
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Patent number: 12289853Abstract: The invention provides a mounting assembly and a server. The mounting assembly includes fixed base, adjustable base, first protrusion and second protrusion. Adjustable base is rotatably disposed on fixed base. When adjustable base is at first mounting position, first protrusion protrudes from adjustable base along protruding direction and is configured for horizontal installation and removal of first expansion card with respect to motherboard. When adjustable base is at second mounting position, second protrusion protrudes from adjustable base along protruding direction and is configured for vertical installation and removal of second expansion card with respect to motherboard. A position at which first protrusion is located when protruding along protruding direction is different from position at which second protrusion is located when protruding along protruding direction.Type: GrantFiled: June 12, 2023Date of Patent: April 29, 2025Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventor: Chi-Chun Yang
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Patent number: 12283514Abstract: The present disclosure provides a method and a system therefore for processing wafer. The method includes: extracting a first gas from a chamber via a first route; blocking a second route used to be pumped down to chuck a wafer placed in the chamber, wherein the second route connects the chamber and the first route; and providing a second gas via a third route to purge a junction of the first route and the second route.Type: GrantFiled: August 30, 2021Date of Patent: April 22, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Sheng-Chun Yang, Chih-Lung Cheng, Yi-Ming Lin, Po-Chih Huang, Yu-Hsiang Juan, Xuan-Yang Zheng, Ren-Jyue Wang, Chih-Yuan Wang
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Publication number: 20250121104Abstract: Compounds, e.g., radioimmunoconjugates, including a chelating moiety or a metal complex thereof, a linker, and an antibody or antigen-binding fragment thereof targeting both EGFR and cMET. Pharmaceutical compositions of such compounds and methods of treatment for conditions, e.g., cancer, using such compounds or pharmaceutical compositions.Type: ApplicationFiled: December 20, 2022Publication date: April 17, 2025Inventors: Sadaf AGHEVLIAN, Natalie GRINSHTEIN, Ian R. DUFFY, Thomas I. KOSTELINK, Andrew Grier BUCHANAN, Yariv MAZOR, Srinath KASTURIRANGAN, Qun DU, Chunning YANG, Frank Irvine COMER
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Patent number: 12276824Abstract: A light guide element includes first and second surfaces, a light-incident surface, and microstructure groups arranged on the first surface. Each microstructure group includes a first microstructure and a second microstructure separated from and being mirror image structures of each other. A first intersection line is provided between a first light-receiving surface of the first microstructure and the first surface. A first distance is provided between the first intersection line and a light-incident intersection line in a first direction. A second intersection line is provided between a second light-receiving surface of the second microstructure and the first surface. A second distance is provided between the second intersection line and the light-incident intersection line in the first direction. A variation trend of the first distance in a second direction is opposite to a variation trend of the second distance in the second direction.Type: GrantFiled: May 12, 2024Date of Patent: April 15, 2025Assignee: Coretronic CorporationInventors: Tzeng-Ke Shiau, Ying-Shun Syu, Wei-Chun Yang, Yi-Cheng Lin
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Publication number: 20250088392Abstract: The present disclosure provides a receiver circuit, which includes: a first comparator circuit, a second comparator circuit, and an inverter circuit. The inverter circuit has a first input terminal and a second input terminal. A first output terminal of the first comparator circuit is electrically connected to the first input terminal of the inverter circuit, and a second output terminal of the second comparator circuit is electrically connected to the second input terminal of the inverter circuit.Type: ApplicationFiled: September 12, 2023Publication date: March 13, 2025Inventors: SHU-CHUN YANG, WEI CHIH CHEN