Patents by Inventor Chun-Ping Wu

Chun-Ping Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240132330
    Abstract: Motor control architecture including a travel, a hoist, and a controller is disclosed. The travel disposed on a main rail having an auxiliary-encoder includes a master-driver and a slave-driver for driving two motors. Each motor has a main-encoder. The hoist drives a rope and calculates a rope length continuously. The controller calculates an anti-sway position command based on the rope-length and a position command. The two drivers perform a full closed-loop computation based on a feedback of one main-encoder, a feedback of the auxiliary-encoder, and the anti-sway position command. Wherein, the master-driver controls one motor based on a speed command generated by the full closed-loop computation and the slave-driver follows the speed command and a torque command of the master-driver to drive another motor; or the two drivers compensate the torque command based on an error value between the feedback of one main-encoder and the feedback of the auxiliary-encoder.
    Type: Application
    Filed: October 18, 2023
    Publication date: April 25, 2024
    Inventors: Huan-Chang CHEN, Po-Jen KO, Chun-Ju WU, Lon-Jay CHENG, Wan-Ping CHEN, Chih-Yuan CHANG
  • Publication number: 20240066313
    Abstract: An electronic device includes a light emitting layer, a light conversion layer and an adjustable structure. The light emitting layer has a plurality of light emitting units for emitting light. The light conversion layer converts the wavelength of the light emitted by at least one light emitting unit to provide converted light. The adjustable structure is controlled to adjust a light penetrating area to correspond to the affected part to be treated, wherein at least one of the light and the converted light passes through the light penetrating area to irradiate the affected part.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 29, 2024
    Inventors: Jih-Ping LIN, Chun-Kai LEE, Fang-Iy WU, Cheng-Hsu CHOU
  • Patent number: 10322436
    Abstract: A method of applying a riblet structure coating on the internal surface of a pipe includes coating the internal surface of a pipe with a resin layer and applying a cavity mold having a reverse riblet pattern structure to the coated internal surface of the pipe. A flexible air bag is inserted into the interior of the pipe and charged with air to hold the mold against the coated internal surface of the pipe. The air bag may be charged with air for a sufficient amount of time to allow the coating to cure in the riblet shape of the mold. Afterwards, the air bag and the mold are removed from the pipe to yield a pipe coated with an internal riblet structure.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: June 18, 2019
    Assignee: NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
    Inventors: Su Ping Bao, Lei Gao, Man Lung Sham, Chun Ping Wu, Chi Wai Li
  • Publication number: 20180099312
    Abstract: A method of applying a riblet structure coating on the internal surface of a pipe includes coating the internal surface of a pipe with a resin layer and applying a cavity mold having a reverse riblet pattern structure to the coated internal surface of the pipe. A flexible air bag is inserted into the interior of the pipe and charged with air to hold the mold against the coated internal surface of the pipe. The air bag may be charged with air for a sufficient amount of time to allow the coating to cure in the riblet shape of the mold. Afterwards, the air bag and the mold are removed from the pipe to yield a pipe coated with an internal riblet structure.
    Type: Application
    Filed: October 6, 2017
    Publication date: April 12, 2018
    Inventors: Su Ping BAO, Lei GAO, Man Lung SHAM, Chun Ping WU, Chi Wai LI
  • Publication number: 20070159340
    Abstract: A structure for packaging a radio frequency identification (RFID) device is disclosed, which comprises a substrate, an antenna formed on the substrate, a RFID chip with a first side attached to the substrate and a second side having at least one signal pin exposed, at least one conductive contact plate placed on the substrate in contact with both the exposed signal pin and a portion of the antenna, and a protective film over the contact plate to secure the same to the substrate, wherein an electrical connection between the signal pin and the portion of the antenna is made through the contact plate.
    Type: Application
    Filed: January 9, 2007
    Publication date: July 12, 2007
    Inventors: Kuo-Tung Chiang, Shun-Chi Chang, Chun-Ping Wu, Mei-Yi Wu, Cheng-Hsien Chou, Mong-Tai Yang, Min Wu
  • Publication number: 20070159341
    Abstract: A packaging structure for a radio frequency identification (RFID) device is disclosed which comprises a substrate, an antenna with a plurality of terminals formed on the substrate, a RFID chip with a plurality of signal pins electrically coupled to the plurality of terminals, respectively, and a plurality of thermally activated binding pads being electrically conductive and in contact with the plurality of signal pins, respectively, wherein the RFID chip is adhered to the substrate by the plurality of binding pads after a thermo-pressing process.
    Type: Application
    Filed: January 9, 2007
    Publication date: July 12, 2007
    Inventors: Shun-Chi Chang, Guo-Tung Chiang, Chun-Ping Wu, Mei-Yi Wu, Cheng-Hsien Chou