Abstract: A method of applying a riblet structure coating on the internal surface of a pipe includes coating the internal surface of a pipe with a resin layer and applying a cavity mold having a reverse riblet pattern structure to the coated internal surface of the pipe. A flexible air bag is inserted into the interior of the pipe and charged with air to hold the mold against the coated internal surface of the pipe. The air bag may be charged with air for a sufficient amount of time to allow the coating to cure in the riblet shape of the mold. Afterwards, the air bag and the mold are removed from the pipe to yield a pipe coated with an internal riblet structure.

Abstract: A method of applying a riblet structure coating on the internal surface of a pipe includes coating the internal surface of a pipe with a resin layer and applying a cavity mold having a reverse riblet pattern structure to the coated internal surface of the pipe. A flexible air bag is inserted into the interior of the pipe and charged with air to hold the mold against the coated internal surface of the pipe. The air bag may be charged with air for a sufficient amount of time to allow the coating to cure in the riblet shape of the mold. Afterwards, the air bag and the mold are removed from the pipe to yield a pipe coated with an internal riblet structure.

Abstract: A structure for packaging a radio frequency identification (RFID) device is disclosed, which comprises a substrate, an antenna formed on the substrate, a RFID chip with a first side attached to the substrate and a second side having at least one signal pin exposed, at least one conductive contact plate placed on the substrate in contact with both the exposed signal pin and a portion of the antenna, and a protective film over the contact plate to secure the same to the substrate, wherein an electrical connection between the signal pin and the portion of the antenna is made through the contact plate.

Abstract: A packaging structure for a radio frequency identification (RFID) device is disclosed which comprises a substrate, an antenna with a plurality of terminals formed on the substrate, a RFID chip with a plurality of signal pins electrically coupled to the plurality of terminals, respectively, and a plurality of thermally activated binding pads being electrically conductive and in contact with the plurality of signal pins, respectively, wherein the RFID chip is adhered to the substrate by the plurality of binding pads after a thermo-pressing process.