Abstract: An interferometer system may include a stage assembly configured to receive and secure a sample, an illumination source configured to generate an illumination beam, a half-wave plate, one or more shearing prisms to shear the illumination beam into two beamlets along a shearing direction, a reference flat disposed proximate to the sample, a detector assembly, and a controller. The controller may cause the illumination source to generate an illumination beam and sweep the illumination beam across a plurality of wavelengths, and determine both a surface height measurement and a surface slope measurement of the sample based on the illumination received by the detector assembly.

Abstract: A beam shaper for an optical inspection tool includes a focal lens to focus an optical beam onto a target at an oblique angle of incidence and a phase modulator to substantially flatten a top of the optical beam in the plane of the target when the optical beam is focused onto the target at the oblique angle of incidence.

Abstract: The inspection system includes an illumination source, a TDI-CCD sensor, and a dark field/bright field sensor. A polarizer receives the light from the light source. The light from the polarizer is directed at a Wollaston prism, such as through a half wave plate. Use of the TDI-CCD sensor and the dark field/bright field sensor provide high spatial resolution, high defect detection sensitivity and signal-to-noise ratio, and fast inspection speed.

Abstract: An interferometer system may include a stage assembly configured to receive and secure a sample, an illumination source configured to generate an illumination beam, a half-wave plate, one or more shearing prisms to shear the illumination beam into two beamlets along a shearing direction, a reference flat disposed proximate to the sample, a detector assembly, and a controller. The controller may cause the illumination source to generate an illumination beam and sweep the illumination beam across a plurality of wavelengths, and determine both a surface height measurement and a surface slope measurement of the sample based on the illumination received by the detector assembly.

Abstract: A beam shaper for an optical inspection tool includes a focal lens to focus an optical beam onto a target at an oblique angle of incidence and a phase modulator to substantially flatten a top of the optical beam in the plane of the target when the optical beam is focused onto the target at the oblique angle of incidence.

Abstract: Methods and systems for reducing illumination intensity while scanning over large particles are presented herein. A surface inspection system determines the presence of a large particle in the inspection path of a primary measurement spot using a separate leading measurement spot. The inspection system reduces the incident illumination power while the large particle is within the primary measurement spot. The primary measurement spot and the leading measurement spot are separately imaged by a common imaging collection objective onto one or more detectors. The imaging based collection design spatially separates the image of the leading measurement spot from the image of the primary measurement spot at one or more wafer image planes. Light detected from the leading measurement spot is analyzed to determine a reduced power time interval when the optical power of the primary illumination beam and the leading illumination beam are reduced.

Abstract: A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.

Abstract: Methods and systems for reducing illumination intensity while scanning over large particles are presented herein. A surface inspection system determines the presence of a large particle in the inspection path of a primary measurement spot using a separate leading measurement spot. The inspection system reduces the incident illumination power while the large particle is within the primary measurement spot. The primary measurement spot and the leading measurement spot are separately imaged by a common imaging collection objective onto one or more detectors. The imaging based collection design spatially separates the image of the leading measurement spot from the image of the primary measurement spot at one or more wafer image planes. Light detected from the leading measurement spot is analyzed to determine a reduced power time interval when the optical power of the primary illumination beam and the leading illumination beam are reduced.

Abstract: A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.

Abstract: A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.

Abstract: An interferometer system is disclosed. The interferometer system includes two spaced apart reference flats having corresponding reference surfaces forming a cavity therebetween for placement of a polished opaque plate. The surfaces of the plate are approximately 2.5 millimeters or less from the corresponding reference surfaces when the plate is placed in the cavity. The interferometer system also includes two interferometer devices located on diametrically opposite sides of the cavity to map the surfaces of the plate. A light source is optically coupled to the interferometer devices. The light source includes an illuminator configured for producing light of multiple wavelengths and an optical amplitude modulator configured for stabilizing power of the light produced by the illuminator. The interferometer system further includes two interferogram detectors, and at least one computer coupled to receive the outputs of the interferogram detectors for determining thickness variations of the plate.

Abstract: A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.

Abstract: A metrology device produces broadband illumination, e.g., an illumination line, that is incident on a substrate at an oblique angle of incidence and which is scanned across the substrate. A first detector collects a darkfield image, while a second detector collects the spectrally reflected light. The angle of incidence of the illumination is variable so that the darkfield image is received by the first detector without interference from diffracting structures on the substrate. Alternatively, the position of the first detector may be varied to receive the darkfield image, or a filter may be used to filter out light from any non-defect diffracting structures on the substrate. A processor uses the darkfield data from the first detector to determine if a defect is present on the substrate and uses the spectral data from the second detector to identify the material composition of the defect.

Abstract: An ellipsometer with a variable retarder, which introduces a spatial dependence in the beam, includes a polarizing beam splitter to produce two beams with orthogonal polarization states. The beam splitter may be, e.g., a polarizing displacer or polarizing beam splitter. The intensities of the two beams are measured, e.g., using separate detectors or separate detector elements in an array. The intensity from the two beams may be summed and used as a reference to normalize intensity of the produced beam.

Abstract: A metrology instrument is calibrated using two reference locations with different optical properties designed to produce different measurement results, e.g., different thicknesses. The metrology instrument, for example, may be an ellipsometer with a variable phase retarder. By comparing initial measurements of the two reference locations with later measurements of the two reference locations, the amount of calibration error can be easily determined. In addition, an ellipsometer having a spatially or temporally variable phase retarder may also be calibrated with a single reference location.

Abstract: A Fizeau interferometer (10) producing spherical test and reference wavefronts (34 and 36) is operated with a linear translator (50) for making a sequence of subaperture measurements of an aspherical test surface (40). Separate phase maps (88 and 90) are assembled at different focus positions (54 and 56) along a common optical axis (52) of the interferometer (10) and aspherical test surface (40). Respective null zones (92 and 94) are isolated from the phase maps (88 and 90) and are combined to form a composite phase map (100) defining differences between the aspherical test surface (40) and a family of spheres.