Abstract: A semiconductor manufacturing system includes: a nozzle including a first channel that allows a fluid to flow through; a light source configured to emit light; and a light sensor configured to receive light, the light source and the light sensor being disposed within the first channel and opposite to each other. The semiconductor manufacturing system is configured to: emit light, by the light source, from within the nozzle toward a surface while the nozzle is dispensing the fluid; receive the light reflected from the surface by the light sensor, the emitted light and the reflected light adapted to be contained within the fluid; and examine a status of the reflected light. The emitted light and the reflected light propagate in a direction parallel to a longitudinal axis of the first channel.

Abstract: A display may include an array of pixels such as light-emitting diode pixels. The pixels may include multiple circuitry decks that each include one or more circuit components such as transistors, capacitors, and/or resistors. The circuitry decks may be vertically stacked. Each circuitry deck may include a planarization layer formed from a siloxane material that conforms to underlying components and provides a planar upper surface. In this way, circuitry components may be vertically stacked to mitigate the size of each pixel footprint. The circuitry components may include capacitors that include both a high-k dielectric layer and a low-k dielectric layer. The display pixel may include a via with a width of less than 1 micron.

Abstract: An electronic device is disclosed. The electronic device includes a first electronic component and a first interposer. The first electronic component is disposed under the interposer and includes a logic circuit and a power delivery circuit disposed between the interposer and the logic circuit. The interposer and the power delivery circuit are collectively configured to function as a power delivery structure which is electrically connected to the logic circuit.

Abstract: A display method and a smart display device for collectively changing display contents of a shell body of a transportation vehicle are provided, including setting first display contents of the display element for normal display; setting second display contents of the display element being different from the first display contents; obtaining positioned locations of a plurality of the transportation vehicles by a central control system. When any transportation vehicle satisfies a predetermined condition, the central control system issues the display control signal to the transportation vehicle according to the positioned location, and the smart display device of the transportation vehicle automatically receives the display control signal for the display element to change the first display contents to the second display contents, so that one or more of the transportation vehicles can collectively change the display contents.

Abstract: A method for fabricating semiconductor device includes the steps of forming a magnetic tunneling junction (MTJ) stack on a substrate, performing an etching process to remove the MTJ stack for forming a MTJ, performing a deposition process to form a polymer on a sidewall of the MTJ, and removing the polymer to form a rough surface on the sidewall of the MTJ. Preferably, the MTJ could include a pinned layer on the substrate, a barrier layer on the pinned layer, and a free layer on the barrier layer, in which the rough surface could appear on sidewall of the pinned layer, sidewall of the barrier layer, and/or sidewall of the free layer.

Abstract: An electronic device includes a camera assembly, a function assembly, and a controller. The camera assembly is configured to capture a first depth image of a first user and a second depth image of the first user. The controller is configured to determine a first spatial position between the first user and the camera assembly according to the first depth image, and control the function assembly to execute a first action according to the first spatial position. The controller further configured to determine a relative displacement between the first user and the camera assembly according to the first depth image and the second depth image, and control the function assembly to execute a second action according to the relative displacement. The second action is an action to adjust a result of the function assembly based on the first action. A method and a non-transitory storage medium are also provided.

Abstract: A server for handling interaction in a live streaming platform, comprising one or a plurality of processors, wherein the one or plurality of processors execute a machine-readable instruction to perform: receiving a character data corresponding to a character; feeding the character data into a machine learning model to generate a virtual chatbot in a live streaming room; setting the virtual chatbot in the live streaming room; wherein the virtual chatbot is configured to provide assistance to a livestreamer or viewers in the live streaming room. According to the present disclosure, the AI chatbot with a character may increase the interaction and fun in the live streaming room. Moreover, the monitoring and handling of the atmosphere in the live streaming may also be partially or entirely entrusted to the AI chatbot. Therefore, the user experience may be improved.

Abstract: A cell module is provided. The cell module includes a first substrate; a second substrate disposed opposite to the first substrate; a cell unit disposed between the first substrate and the second substrate; a first thermosetting resin layer disposed between the cell unit and the first substrate; a crosslinked polymer layer disposed between the cell unit and the first thermosetting resin layer; and a second thermosetting resin layer disposed between the cell unit and the second substrate. The crosslinked polymer layer includes a crosslinked polymer, and the crosslinked polymer has a crosslinking degree of from 35.4 to 67.4%.

Abstract: The current disclosure describes techniques of protecting a metal interconnect structure from being damaged by subsequent chemical mechanical polishing processes used for forming other metal structures over the metal interconnect structure. The metal interconnect structure is receded to form a recess between the metal interconnect structure and the surrounding dielectric layer. A metal cap structure is formed within the recess. An upper portion of the dielectric layer is strained to include a tensile stress which expands the dielectric layer against the metal cap structure to reduce or eliminate a gap in the interface between the metal cap structure and the dielectric layer.

Abstract: A method for maintaining lamellar structure of cell, configured to manufacture a lamellar cell product, comprises the following steps of: seeding a predetermined number of cells in a culture device containing a first culture medium and culturing the predetermined number of cells for a predetermined time to form a cell planar structure; placing a mold in the culture device to cover at least an outer portion of the cell planar structure; adding a gel into the culture device with the mold to envelop the cell planar structure; and separating the gel and the cell planar structure enveloped therein from the culture device and the mold to form the lamellar cell product.

Abstract: A body-wearable medical device has first and second housing portions. The first housing portion has a female portion and the second housing portion has a male portion. The male portion is at least partially inserted into the female portion, thereby defining a circumferential clearance gap. A circumferential sealing element is arranged in the circumferential clearance gap between the female portion and the male portion. In order to provide a body-wearable medical device with improved sealing that is less prone to failure by stress and forces exerted on the body-wearable medical device, the female portion and the male portion are fixed to each other by a circumferential fixation glue arranged in the circumferential clearance gap between the female portion and the male portion next to the circumferential sealing element.

Abstract: An endoscope device includes an operation processor and a detection module. The detection module is electrically connected with the operation processor. The detection module includes a tube, an optical transmission component, an optical detector, a signal transmission component, a first holder and a second holder. The optical transmission component has a first part and a second part bent to each other. The optical detector is located above the first part. The signal transmission component is coupled with the optical detector, and is parallel to the second part, and bent from a detection surface of the optical detector. The first holder includes a first accommodating structure adapted to accommodate the optical detector. The second holder includes a second accommodating structure adapted to accommodate the first part, and the optical transmission component and the optical detector are assembled between the first holder and the second holder to install inside the tube.

Abstract: An endoscopic device is provided and includes an insertion tube, an imaging assembly, a light guiding component and a light emitting component. The imaging assembly includes a lens set and an image sensor. The lens set is located adjacent to a distal end of the insertion tube. The image sensor is located inside the insertion tube and engaged with the lens set. The light guiding component is located adjacent to the distal end of the insertion tube and beside the lens set. The light guiding component includes an outer end adjacent to the distal end of the insertion tube and an inner end opposite to the outer end. A length of the light guiding component is greater than a length of the imaging assembly. The light emitting component is located inside the insertion tube and adjacent to the inner end of the light guiding component.

Abstract: A backlight module includes a housing, a diffuser plate, an optical film, a holder and a light source. The housing has a groove. The groove is arranged along a periphery of the housing. The diffuser plate is disposed in the housing and has an edge located in the groove. The optical film is disposed on the diffuser plate and has a thru-hole. The holder is disposed in the groove of the housing and includes a holding portion and a hanging portion. The holding portion engages the edge of the diffuser plate. The hanging portion is connected to the holding portion and extends through the thru-hole of the optical film. The light source is disposed in the housing.

Abstract: An endoscopy system including an insertion tube segment, a handle segment, at least one heat source, a heat pipe and a heat-conductive material is provided. The insertion tube segment has first and second end portions opposite to each other and is inserted in the handle segment. An inside of the insertion tube segment and an inside of the handle segment commonly have a connecting space. The at least one heat source is disposed in the first end portion. The heat pipe is disposed in the connecting space and at least extends from a portion of the connecting space of the insertion tube segment to a portion of the connecting space of the handle segment. The heat-conductive material is disposed between the at least one heat source and the first end portion, and the heat-conductive material is thermally coupled to the at least one heat source and the heat pipe, respectively.

Abstract: The present disclosure provides a contact structure and an electronic device having the same. The contact structure includes a substrate, a copper layer, an organic composite protective layer, and a silver nanowire layer. The copper layer is disposed on the substrate. The nanowire-distribution-promotion layer is disposed between the copper layer and the silver nanowire layer.

Abstract: The present disclosure provides a contact structure and an electronic device having the same. The contact structure includes a substrate, a copper layer, an organic composite protective layer, and a silver nanowire layer. The copper layer is disposed on the substrate. The nanowire-distribution-promotion layer is disposed between the copper layer and the silver nanowire layer.

Abstract: A backlight module includes a housing, a diffuser plate, an optical film, a holder and a light source. The housing has a groove. The groove is arranged along a periphery of the housing. The diffuser plate is disposed in the housing and has an edge located in the groove. The optical film is disposed on the diffuser plate and has a thru-hole. The holder is disposed in the groove of the housing and includes a holding portion and a hanging portion. The holding portion engages the edge of the diffuser plate. The hanging portion is connected to the holding portion and extends through the thru-hole of the optical film. The light source is disposed in the housing.

Abstract: A microelectronic device includes an accommodating housing, a circuit board, an electronic component, and a conducting wire. The accommodating housing has an accommodating space therein. The circuit board is disposed within the accommodating space, and has a first and a second end surface disposed opposite to each other. The first end surface includes a first conductive contact, and a lateral side of the circuit board includes a receiving hole being a half-open hole extending from the second end surface. A second conductive contact is disposed on the surface of the receiving hole and electrically connected to the first conductive contact via an internal power layer of the circuit board. The electronic component is disposed on the first end surface and electrically connected to the first conductive contact. One end of the conducting wire is disposed in the receiving hole and electrically connected to the second conductive contact.

Abstract: An endoscope device includes an insertion portion. The insertion portion includes a distal end. The distal end includes a lens holder, a lens disposed in the lens holder, an image sensor corresponding to the lens and a flexible circuit board electrically connected to the image sensor and a circuit board holder. The flexible circuit board is jointly clamped by the circuit board holder and the lens holder.