Patents by Inventor Chunxia HUANG

Chunxia HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240158880
    Abstract: A micro-molybdenum-type weathering bridge steel plate disclosed by the present invention is characterized in that the steel plate is smelted from the following components by weight: C: 0.05-0.08%, Si: 0.30-0.50%, Mn: 1.25-1.35%, P: 0.010-0.014%, S?0.003%, Nb: 0.020-0.030%, Ti: 0.010-0.020%, V: 0.040-0.050%, Cu: 0.25-0.40%, Ni: 0.25-0.35%, Cr: 0.45-0.55%, Mo: 0.03-0.08%, Alt: 0.020-0.040%, and the balance from Fe and impurities. Less content of molybdenum reduces the production cost of the steel plate, the yield strength of the steel plate is 500-600 MPa, the yield strength ratio is ?0.85, and the maximum thickness of the steel plate can reach 80 mm.
    Type: Application
    Filed: November 17, 2021
    Publication date: May 16, 2024
    Applicant: NANJING IRON & STEEL CO., LTD.
    Inventors: Yixin HUANG, Mingliang QIAO, Baijie ZHAO, Chunxia TANG, Jun WANG, Qiang CUI, Linheng CHEN, Yuqun YIN, Tao LIU, Yurong QIN, Lingming MENG
  • Patent number: 11970523
    Abstract: The present invention discloses a polypeptide and application thereof. By modifying oxyntomodulin (OXM), hybridizing OXM with a peptide sequence of Exenatide, including enabling the polypeptide to be resistant to DPP-4 enzyme degradation through amino acid modification, and conjugating fatty acid chains at the same time, an OXM hybrid peptide having longer pharmacologic action time and better weight losing effects is obtained. Synthesis of a target polypeptide is fast realized by an orthogonal protection strategy solid-phase synthesis method, and a crude product is purified and freeze-dried to obtain the OXM hybrid peptide.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: April 30, 2024
    Assignee: CHINA PHARMACEUTICAL UNIVERSITY
    Inventors: Hai Qian, Wenlong Huang, Xingguang Cai, Chengye Li, Chunxia Liu, Yuxuan Dai
  • Publication number: 20240097454
    Abstract: Disclosed are an emergency control method and system based on source-load-storage regulation and cutback. According to the method, output power of power generating sources is regulated according to a power regulating quantity and a frequency regulation requirement, an output power compensation and output frequency of each power generating source are maintained within permissible ranges, so that a balance between power supply and demand of a power distribution network is maintained; and standby energy-storage power stations are used to make up a power gap, and an external power supply system is used to assist in making up a power deficiency, so that large load disturbance can be handled make up the power gap.
    Type: Application
    Filed: July 30, 2021
    Publication date: March 21, 2024
    Applicants: NANJING UNIVERSITY OF POASTS AND TELECOMMUNICATIONS, STATE GRID ELECTRIC POWER RESEARCH INSTITUTE CO. LTD
    Inventors: Dong YUE, Chunxia DOU, Zhijun ZHANG, Wenbin YUE, Xiaohua DING, Jianbo LUO, Yanman LI, Kun HUANG, Tao HAN
  • Patent number: 10276418
    Abstract: A wafer pre-alignment device is disclosed, including a first unit configured to drive a wafer to rotate or move upward or downward, a second unit configured to drive the wafer to translate, and a position detector including a light source, a lens and an image sensor. A light beam from the light source passes through the wafer and the lens and thereby provides information indicating a position of the wafer to the image sensor. The first unit and the second unit are able to adjust the position of the wafer based on the information obtained by the image sensor. A method for pre-aligning a TSV wafer is also disclosed.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: April 30, 2019
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Weiwang Sun, Gang Wang, Chunxia Huang, Songli Hu, Jie Jiang, Ruzhan Lu, Jiyuan Mou
  • Publication number: 20160329229
    Abstract: A wafer pre-alignment device is disclosed, including a first unit configured to drive a wafer to rotate or move upward or downward, a second unit configured to drive the wafer to translate, and a position detector including a light source, a lens and an image sensor. A light beam from the light source passes through the wafer and the lens and thereby provides information indicating a position of the wafer to the image sensor. The first unit and the second unit are able to adjust the position of the wafer based on the information obtained by the image sensor. A method for pre-aligning a TSV wafer is also disclosed.
    Type: Application
    Filed: December 26, 2014
    Publication date: November 10, 2016
    Inventors: Weiwang SUN, Gang WANG, Chunxia HUANG, Songli HU, Jie JIANG, Ruzhan LU, Jiyuan MOU