Patents by Inventor Chun-Yan Wu

Chun-Yan Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11647645
    Abstract: A cover plate used in an electronic device includes a glass layer and at least one transparent covering layer. The glass layer has a first surface and a second surface. The transparent covering layer contacts and is disposed on at least one of the first surface and the second surface, and the transparent covering layer is laminated with the glass layer. The cover plate has a Young's modulus of about 10 GPa to about 200 GPa.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: May 9, 2023
    Assignee: TPK Advanced Solutions Inc.
    Inventors: Chun Yan Wu, Lien-Hsin Lee, Shi Yuan Lian, Xian Bin Xu, Ming Qiang Fu, Ming Hsien Ko
  • Patent number: 11493794
    Abstract: An electronic device includes a cover plate, a touch sensing layer, and a display module. The cover plate includes a glass layer and at least one transparent covering layer. The glass layer has a first surface and a second surface. The transparent covering layer is disposed on and in contact with at least one of the first surface or the second surface of the glass layer and is laminated with the glass layer. The touch sensing layer is disposed under the cover plate. The display module is disposed under the touch sensing layer.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: November 8, 2022
    Assignee: TPK Advanced Solutions Inc.
    Inventors: Chun Yan Wu, Jen-Chang Liu, Tai-Shih Cheng, Lien-Hsin Lee
  • Patent number: 11460965
    Abstract: A touch panel includes a substrate, a first sensing electrode layer, and a second sensing electrode layer. The first sensing electrode layer is disposed on the substrate and includes a plurality of first-axis conductive units separated from each other. The second sensing electrode layer is disposed on the substrate and includes a plurality of second-axis conductive units separated from each other and crossing the first-axis conductive units. Each of the second-axis conductive units includes two first conductive layers and a second conductive layer laminated between the first conductive layers.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: October 4, 2022
    Assignee: TPK Advanced Solutions Inc.
    Inventors: Lien Hsin Lee, Chun Yan Wu, Tai Shih Cheng
  • Publication number: 20220223816
    Abstract: A cover plate used in an electronic device includes a glass layer and at least one transparent covering layer. The glass layer has a first surface and a second surface. The transparent covering layer contacts and is disposed on at least one of the first surface and the second surface, and the transparent covering layer is laminated with the glass layer. The cover plate has a Young's modulus of about 10 GPa to about 200 GPa.
    Type: Application
    Filed: January 13, 2021
    Publication date: July 14, 2022
    Inventors: Chun Yan Wu, Lien-Hsin Lee, Shi Yuan Lian, Xian Bin Xu, Ming Qiang Fu, Ming Hsien Ko
  • Publication number: 20220221749
    Abstract: An electronic device includes a cover plate, a touch sensing layer, and a display module. The cover plate includes a glass layer and at least one transparent covering layer. The glass layer has a first surface and a second surface. The transparent covering layer is disposed on and in contact with at least one of the first surface or the second surface of the glass layer and is laminated with the glass layer. The touch sensing layer is disposed under the cover plate. The display module is disposed under the touch sensing layer.
    Type: Application
    Filed: January 11, 2021
    Publication date: July 14, 2022
    Inventors: Chun Yan Wu, Jen-Chang Liu, Tai-Shih Cheng, Lien-Hsin Lee
  • Publication number: 20220147184
    Abstract: A touch sensing layer includes a first-axis conductive unit, a second-axis conductive unit, and at least one dummy electrode. The first-axis conductive unit substantially extends along a first axial direction. The second-axis conductive unit substantially extends along a second axial direction and includes two conductive electrodes and a conductive bridge. The two conductive electrodes are respectively located at opposite sides of the first-axis conductive unit. The conductive bridge crosses the first-axis conductive unit and is connected to the two conductive electrodes. The dummy electrode includes at least one part located in a gap formed between the first-axis conductive unit and one of the two conductive electrodes.
    Type: Application
    Filed: November 6, 2020
    Publication date: May 12, 2022
    Inventors: Caijin Ye, Chun Yan Wu, Tsai-Kuei Wei, Chen-Hsin Chang, Lien-Hsin Lee, Tai-Shih Cheng
  • Patent number: 11327620
    Abstract: A touch sensing layer includes a first-axis conductive unit, a second-axis conductive unit, and at least one dummy electrode. The first-axis conductive unit substantially extends along a first axial direction. The second-axis conductive unit substantially extends along a second axial direction and includes two conductive electrodes and a conductive bridge. The two conductive electrodes are respectively located at opposite sides of the first-axis conductive unit. The conductive bridge crosses the first-axis conductive unit and is connected to the two conductive electrodes. The dummy electrode includes at least one part located in a gap formed between the first-axis conductive unit and one of the two conductive electrodes.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: May 10, 2022
    Assignee: TPK Advanced Solutions Inc.
    Inventors: Caijin Ye, Chun Yan Wu, Tsai-Kuei Wei, Chen-Hsin Chang, Lien-Hsin Lee, Tai-Shih Cheng
  • Publication number: 20220066593
    Abstract: A touch panel includes a substrate, a first sensing electrode layer, and a second sensing electrode layer. The first sensing electrode layer is disposed on the substrate and includes a plurality of first-axis conductive units separated from each other. The second sensing electrode layer is disposed on the substrate and includes a plurality of second-axis conductive units separated from each other and crossing the first-axis conductive units. Each of the second-axis conductive units includes two first conductive layers and a second conductive layer laminated between the first conductive layers.
    Type: Application
    Filed: August 27, 2020
    Publication date: March 3, 2022
    Inventors: Lien Hsin Lee, Chun Yan Wu, Tai Shih Cheng
  • Patent number: 10990131
    Abstract: A manufacturing method of touch sensors is provided. A flexible touch sensing component can be formed on a first substrate by a release layer. Next, the flexible touch sensing component is transferred to a second substrate after a releasing step. Furthermore, by the support of the second substrate, the flexible touch sensing component can be processed and then adhered a desired cover. After releasing the second substrate from the flexible touch sensing component, the touch sensor is formed.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: April 27, 2021
    Assignee: TPK Touch Solutions (Xiamen) Inc.
    Inventors: Ching-Shan Lin, Chun-Yan Wu, Chung-Chin Hsiao, Hwai-Hai Chiang
  • Patent number: 10698516
    Abstract: A flexible touch-sensing component is formed on a release film by support provided from a first carrier substrate and a second carrier substrate. Then, the flexible touch-sensing component can be attached onto non-planar and curved cover plates through the reloading of a third carrier substrate, so that the touch panel can be lighter and thinner, and have a lower processing cost. In addition, the flexible touch-sensing component uses a film sensor that includes a metal nanowire conductive layer. Since the silver nanowire has flexibility, the touch sensor and the touch panel in the present disclosure can be used in flexible touch-sensing devices and curved-surface touch-sensing devices. Furthermore, based on application of an adhesive reactive ink, the released touch panel can be directly attached to target carrier substrate without adding an auxiliary layer of optical glue or hydrogel glue.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: June 30, 2020
    Assignee: TPK Touch Solutions (Xiamen) Inc.
    Inventors: Ching-Shan Lin, Chun-Yan Wu, Chung-Chin Hsiao, Hwai-Hai Chiang
  • Publication number: 20190196633
    Abstract: A flexible touch-sensing component is formed on a release film by support provided from a first carrier substrate and a second carrier substrate. Then, the flexible touch-sensing component can be attached onto non-planar and curved cover plates through the reloading of a third carrier substrate, so that the touch panel can be lighter and thinner, and have a lower processing cost. In addition, the flexible touch-sensing component uses a film sensor that includes a metal nanowire conductive layer. Since the silver nanowire has flexibility, the touch sensor and the touch panel in the present disclosure can be used in flexible touch-sensing devices and curved-surface touch-sensing devices. Furthermore, based on application of an adhesive reactive ink, the released touch panel can be directly attached to target carrier substrate without adding an auxiliary layer of optical glue or hydrogel glue.
    Type: Application
    Filed: December 19, 2018
    Publication date: June 27, 2019
    Inventors: Ching-Shan Lin, Chun-Yan Wu, Chung-Chin Hsiao, Hwai-Hai Chiang
  • Publication number: 20190196549
    Abstract: A manufacturing method of touch sensors is provided. A flexible touch sensing component can be formed on a first substrate by a release layer. Next, the flexible touch sensing component is transferred to a second substrate after a releasing step. Furthermore, by the support of the second substrate, the flexible touch sensing component can be processed and then adhered a desired cover. After releasing the second substrate from the flexible touch sensing component, the touch sensor is formed.
    Type: Application
    Filed: December 21, 2018
    Publication date: June 27, 2019
    Inventors: Ching-Shan Lin, Chun-Yan Wu, Chung-Chin Hsiao, Hwai-Hai Chiang
  • Patent number: 7677878
    Abstract: A slide having a fixing mechanism of a slide insert includes a slide body, a slide insert and a slide core. The slide body has a connecting portion and an inserting portion. The connecting portion defines a locating hole which stretches through the top surface to bottom surface of the connection portion. The inserting portion defines an inserting hole passing through the front and back surface of the inserting portion. A core hole is defined at the junction of the connecting portion and the inserting portion. The slide insert is located in the inserting hole. One end of the slide insert protrudes around to form a preventing part. The slide core is inserted in the core hole to fix the preventing part between the back surface of the inserting portion and the slide core. Then the slide insert is fixed in the slide.
    Type: Grant
    Filed: March 26, 2007
    Date of Patent: March 16, 2010
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Chih-yu Chen, Jian-guang Huang, Yun-ging He, Chun-yan Wu
  • Publication number: 20090304845
    Abstract: A demolding mechanism of mold includes a male mold, a swingable block and an elastic element. The male mold defines a receiving groove therein. The swingable block mounted in the receiving groove of the male mold has a pressing arm and a shaping arm connected with the pressing arm. The shaping arm defines a shaping portion for shaping a part of a product to be molded in the mold. The elastic element is resiliently disposed between the bottom of the pressing arm of the swingable block and the male mold for causing the swingable block to swing, which makes the product be disengaged from the shaping portion of the swingable block.
    Type: Application
    Filed: June 5, 2008
    Publication date: December 10, 2009
    Applicant: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Chih-Yu Chen, Jian-Guang Huang, Chun-Yan Wu
  • Publication number: 20090304849
    Abstract: An injection mold includes a stationary mold section, a movable mold section and an up-down sliding side core. The movable mold section and the stationary mold section define a molding cavity capable of receiving liquefied molding material for forming an article. The sliding side core is received between the stationary mold section and the movable mold section and adjacent to the molding cavity, a side of the sliding side core defines a fixing portion for engaging and further moving upwardly the expected product out of the molding cavity. The injection mold can mold the expected product and conveniently guide the product out of the mold, the injection mold is easy to be manufactured, the cost for manufacturing the injection mold is lower.
    Type: Application
    Filed: June 4, 2008
    Publication date: December 10, 2009
    Applicant: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Chih-Yu Chen, Jian-Guang Huang, Chun-Yan Wu
  • Publication number: 20090263526
    Abstract: The present invention provides a position mechanism including a locating body. The locating body defines a locating cavity and a receiving chamber communicating with the locating cavity. A locating stopper is received in the receiving chamber of the locating body with an end thereof toward the locating cavity, and an elastic component is received in the receiving chamber of the locating body and resiliently biases the locating stopper into the locating cavity.
    Type: Application
    Filed: April 17, 2008
    Publication date: October 22, 2009
    Applicant: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Chih-Yu CHEN, Jian-Guang HUANG, Chun-Yan WU, Guo-Ning LIANG
  • Publication number: 20090238914
    Abstract: A feed mechanism of mold includes a top plate, an injection body and two slides. The top plate defines a recess in the bottom for receiving the two slides. The injection body is disposed in the top of the top plate and defines a sprue at the top thereof, a first pouring runner and a second runner both connecting with the sprue. The bottom of the first pouring runner penetrates through the injection body. The slide has a mating surface. The two mating surfaces of the two slides match each other. A shaping recess is defined between the mating surfaces for receiving a core insert. An injection runner is defined between the mating surfaces and connects with the first pouring runner to define a first runner. Two molding cavities are defined among the slides, the core insert and the injection body and connect with the first runner and the second runner respectively.
    Type: Application
    Filed: March 18, 2008
    Publication date: September 24, 2009
    Applicant: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Chih-Yu CHEN, Jian-Guang HUANG, Chun-Yan WU
  • Publication number: 20090230281
    Abstract: A mold with unloading mechanism includes an upper insert embedded in an upper plate, a lower insert embedded in a lower plate and matching the upper insert to define a cavity therebetween for molding the product, a bottom clamping plate located under the lower plate via a padding plate, a pusher penetrating through the bottom clamping plate to push an ejector plate assembly movably received in the padding plate, two unloading pins, a stroke pin and an elastic element. The bottom of the unloading pin is fixed in the ejector plate assembly and the bottom of the stroke pin is movably configured in the ejector plate assembly. The top of the unloading pin and the stroke pin movably penetrates through the lower plate and the lower insert to push the product. The elastic element is against the bottom clamping plate and the bottom of the stroke pin.
    Type: Application
    Filed: March 17, 2008
    Publication date: September 17, 2009
    Applicant: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Chih-Yu CHEN, Jian-Guang HUANG, Chun-Yan WU, Guo-Ning LIANG
  • Publication number: 20090028983
    Abstract: The injection mold with a tie bar includes an upper stationary board, a stripping plate, a female board, a male board and a lower stationary plate from top to bottom. The upper stationary plate extends outward to form a projection plate, an accepting hole opened in the projection plate and having a step therein. A tie bar is arranged on the outside of the injection mold and includes a stud, a connecting head and a pole. The stud passes through the accepting hole and is fixed on the top of the pole. The stud is slidable along the accepting hole and against the step. The top of the pole is located the outside of the stripping plate while the bottom extends outward to form at least one block. The connecting head has a gap for encircling the pole and is slidable along the pole and against the block of the pole.
    Type: Application
    Filed: July 23, 2007
    Publication date: January 29, 2009
    Inventors: Chih-Yu Chen, Jian-Guang Huang, Yun-Ging He, Chun-Yan Wu, Luan-Guang Li
  • Patent number: 7481648
    Abstract: A side mold working mechanism includes a cavity plate defining a mounting groove forming a receiving hole. Bilateral sides of the mounting groove hollow toward bilateral sides of the cavity plate to form two hollow grooves. Two guide blocks disposed in the hollow grooves have a leading track. The guide block defines a locating recess communicating with the leading track. Two locating blocks fixedly mounted in the locating recesses have a preventing portion placed on the leading track. A slide is movably assembled in the mounting groove. Bilateral sides of the top of the slide protrude outward to form two shoulders slidably supported by the leading tracks and capable of being blocked by the preventing portions. The top of the slide defines an inclined groove and an angular pin has an inclined bottom end for being inserted into or withdrawn out of the inclined groove from the receiving hole.
    Type: Grant
    Filed: November 16, 2007
    Date of Patent: January 27, 2009
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Chih-yu Chen, Jian-guang Huang, Chun-yan Wu, Yuan-ru Sun