Abstract: Disclosed is a method to fabricate a multifunctional collimator structure In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; and a plurality of via holes, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, wherein the substrate has a bulk impurity doping concentration equal to or greater than 1×1019 per cubic centimeter (cm?3) and a first thickness, and wherein the bulk impurity doping concentration and the first thickness of the substrate are configured so as to allow the optical collimator to filter light in a range of wavelengths.

Abstract: A liquid-cooling heat dissipation plate with unequal height pin-fins and an enclosed liquid-cooling cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of full-height pin-fins, and a plurality of non-full-height pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that face away from each other, the first heat dissipation surface is configured to be in contact with a plurality of heat sources, and the second heat dissipation surface is configured to be in contact with a cooling fluid. The full-height and non-full-height pin-fins are formed at the second heat dissipation surface of the heat dissipation plate body. A first heat dissipation region to an Nth heat dissipation region are defined on the heat dissipation plate body along a flowing direction of the cooling fluid.

Abstract: Disclosed is a method to fabricate a multifunctional collimator structure In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; and a plurality of via holes, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, wherein the substrate has a bulk impurity doping concentration equal to or greater than 1×1019 per cubic centimeter (cm?3) and a first thickness, and wherein the bulk impurity doping concentration and the first thickness of the substrate are configured so as to allow the optical collimator to filter light in a range of wavelengths.

Abstract: A semiconductor device includes a gate structure on a substrate, a first spacer on a sidewall of the gate structure, a second spacer on a sidewall of the first spacer, a third spacer on a sidewall of the second spacer, and first and second stacks of an epitaxial layer and a cap layer respectively disposed at first and second sides of the gate structure. Preferably, a part of the second spacer comprises an I-shape, the cap layer includes a planar top surface and an inclined sidewall, the cap layer contacts the second spacer and the third spacer directly, and the cap layer includes a vertical sidewall connected to the inclined sidewall.

Abstract: A method includes forming a multi-layer stack comprising dummy layers and semiconductor layers located alternatingly, and forming a plurality of dummy gate stacks on sidewalls and a top surface of the multi-layer stack. Two of the plurality of dummy gate stacks are immediately neighboring each other, and have a space in between. A first source/drain region and a second source/drain region are formed in the multi-layer stack, with the second source/drain region overlapping the first source/drain region. The method further includes replacing the plurality of dummy gate stacks with a plurality of replacement gate stacks, replacing a first one of the plurality of replacement gate stacks with a first dielectric isolation region, forming a deep contact plug in the space, forming a front-side via over the deep contact plug, and forming a back-side via under the deep contact plug, wherein the front-side via is electrically connected to the back-side via through the deep contact plug.

Abstract: A liquid-cooling heat dissipation structure having a nonlinear fin array and a method for manufacturing the same are provided. The liquid-cooling heat dissipation structure includes an upper plate, a lower plate, and a flow guide member. The upper plate has an accommodating groove of which an inner side has an upper joint area formed thereon. The lower plate has a lower joint area. The flow guide member disposed between the upper plate and the lower plate includes a heat dissipation plate body having a first surface and a second surface, and a plurality of heat dissipation columns integrally disposed on the second surface. The upper brazing area is connected to the lower brazing area, and two ends of the flow guide member are respectively connected to the upper joint area and the lower joint area to form an enclosed cavity for accommodating the heat dissipation columns.

Abstract: A cargo bracing device includes a fixing member and a driving member. Mainly the fixing member possesses a connecting plate easily fitted with one end of an elastic device, and a locking plate easily fitted with another end of the elastic device. So the locking plate can be restored with dynamic force provided by the elastic device deposited between the connecting plate and the locking plate. The driving member includes two wings respectively having one end formed as a hook collaborating with a latch of a driven plate to enable the driving member combined with or detached from the fixing member. Similar to the fixing member, an elastic device is easily installed between an actuating plate and a connecting bar of the driving member, providing dynamic force for restoring the actuating plate. Therefore the cargo bracing device can be easily assembled, even with automatic equipments.

Abstract: A method for burning MAC address is used to burn a MAC address into a network card in the course of making a network card. The method includes the following steps: Stores a plurality of MAC addresses in a burning platform. The burning platform sends a MAC address to a burning device, and then burns the MAC address to a network card through the burning device. When the burning process finishes, the burning platform reads the contents of the network card, and compares the reading contents to the burning contents. If the result is correct, the burning platform sends the MAC address and a serial number of the network card to a server, and compares them to serial numbers and MAC addresses being stored in the server to prevent the MAC address being reused.

Abstract: A method for burning a BIOS chip (108) and a network card chip (107) that are attached on a motherboard (106), includes the steps of: storing a plurality of MAC addresses in a burning device (102); loading a BIOS file and a network card file into the burning device; sending the BIOS file from the burning device to a burning card (104), and burning the BIOS file into the BIOS chip via the burning card; the burning device sending the network card file which includes a MAC address from the burning device to the burning card, and burning the network card file into the network card chip via the burning card; and verifying whether the BIOS chip and the network card chip have been burned correctly.

Abstract: A bike stem with angle adjustable includes a drum shaped inner insertion body contained in a linking base provide to a body of the stem; an accommodation portion disposed in the linking base to receive the drum shaped inner insertion body also indicates a drum shape; a spacing is defined between the drum shaped inner insertion body when received in the accommodation portion and a top of the linking base; the drum shaped inner insertion body is inserted and secured onto a fork; a cover is disposed externally to the linking base; a spacing defined between the drum shaped inner insertion body and the drum shaped accommodation portion of the linking base permits the stem to execute longitudinal swing for angular adjustment for the stem to achieve easy adjustment and provide more functionalities.

Abstract: A method for burning a BIOS chip (108) and a network card chip (107) that are attached on a motherboard (106), includes the steps of: storing a plurality of MAC addresses in a burning device (102); loading a BIOS file and a network card file into the burning device; sending the BIOS file from the burning device to a burning card (104), and burning the BIOS file into the BIOS chip via the burning card; the burning device sending the network card file which includes a MAC address from the burning device to the burning card, and burning the network card file into the network card chip via the burning card; and verifying whether the BIOS chip and the network card chip have been burned correctly.

Abstract: A method for burning BIOS comprises the steps of: (1) providing a corrupted motherboard with a corrupted BIOS attached; (2) providing a burning device for receiving the corrupted motherboard; (3) providing a BIOS burning card for receiving a burning instruction from the burning device to start burning; (4) the BIOS burning card detecting the corrupted BIOS whether the corrupted BIOS is blank, if the corrupted BIOS being not blank, erasing the corrupted BIOS; (5) the BIOS burning card sending information to the corrupted BIOS to burn the corrupted BIOS; and (6) verifying the corrupted BIOS.

Abstract: A method for burning MAC address is used to burn a MAC address into a network card in the course of making a network card. The method includes the following steps: Stores a plurality of MAC addresses in a burning platform. The burning platform sends a MAC address to a burning device, and then burns the MAC address to a network card through the burning device. When the burning process finishes, the burning platform reads the contents of the network card, and compares the reading contents to the burning contents. If the result is correct, the burning platform sends the MAC address and a serial number of the network card to a server, and compares them to serial numbers and MAC addresses being stored in the server to prevent the MAC address being reused.