Abstract: The disclosure provides a local stretch packaging structure, including a substrate, a flexible electronic element, a plurality of light-emitting display elements, and a packaging layer. The flexible electronic element is disposed on the substrate. These light-emitting display elements are disposed on the flexible electronic element. The packaging layer includes a packaging area and a non-packaging area. The packaging area covers the upper surface and sidewalls of these light-emitting display elements. The non-packaging area is directly covered the flexible electronic element that is not disposed with these light-emitting display elements.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: The present disclosure discloses method and device for prompting program uninstallation and belongs to the field of the Internet. The method comprises: performing a security assessment of an application program installed on a mobile terminal, thereby obtaining a security assessment result; obtaining security identification information corresponding to the security assessment result based on pre-stored correlations between security assessment results and security identification information; establishing a correlation between the obtained security identification information and the application program, and displaying the correlation to a user.

Abstract: The present disclosure discloses method and device for prompting program uninstallation and belongs to the field of the Internet. The method comprises: performing a security assessment of an application program installed on a mobile terminal, thereby obtaining a security assessment result; obtaining security identification information corresponding to the security assessment result based on pre-stored correlations between security assessment results and security identification information; establishing a correlation between the obtained security identification information and the application program, and displaying the correlation to a user.

Abstract: This discloses a software-sharing method among terminals. The method includes: receiving a request transmitted by a second terminal to obtain a second shared software installation package; obtaining, in accordance with the shared software ID, a default software installation package corresponding to the shared software ID; generating the second shared software installation package in accordance with the default software installation package and an sharing party ID; transmitting the second installation package to the second terminal, allowing installation at the second terminal the shared software using the second installation package. Also disclosed is a server including: a software installation package acquisition request obtaining module, a shared software installation package transmitting module, a shared software installation package generating module, and a default software installation package obtaining module.

Abstract: The present invention relates to a chip-type protection device having an enclosed micro-gap between electrodes. The invention includes a substrate on which a pair of discharge electrodes extend towards each other by a micro-gap. A wall is disposed in a manner spaced apart from the micro-gaps by a predetermined distance, on which a cover portion is mounted in a straddling manner across the micro-gaps. The wall and the cover portion are integrated under a predetermined gaseous environment to form a hermectic chamber on which an outer protective layer is coated. End electrodes are subsequently formed on the substrate in a manner connected to conductive portions of the discharge electrodes. The invention provides a protection device against over-voltage.

Abstract: The present invention relates to a chip-type protection device having an enclosed micro-gap between electrodes. The invention includes a substrate on which a pair of discharge electrodes extend towards each other by a micro-gap. A wall is disposed in a manner spaced apart from the micro-gaps by a predetermined distance, on which a cover portion is mounted in a straddling manner across the micro-gaps. The wall and the cover portion are integrated under a predetermined gaseous environment to form a hermectic chamber on which an outer protective layer is coated. End electrodes are subsequently formed on the substrate in a manner connected to conductive portions of the discharge electrodes. The invention provides a protection device against over-voltage.