Abstract: A memory device includes a memory array and a peripheral circuit coupled to the memory array. The memory array includes a first memory cell and a second memory cell coupled to a same bit line and being adjacent. The peripheral circuit includes a page buffer circuit. The page buffer circuit includes: a sensing node coupled to the bit line; a first latch circuit coupled to the sensing node, and configured to latch a programmed state of first memory cell; a charge and discharge circuit coupled to the sensing node, and configured to: charge the sensing node, and discharge the sensing node, wherein discharge duration of the sensing node is related to the programmed state; and a second latch circuit coupled to the sensing node, and configured to latch, according to a voltage value of the sensing node after the discharge duration, information of whether second memory cell passes program verification.

Abstract: Implementations of the present disclosure provide a memory device, an operation method thereof, and a memory system. The memory device may include a memory cell array including a plurality of blocks. The memory device may include a peripheral circuit coupled to the memory cell array. The peripheral circuit may be configured to apply a plurality of different erasure verification voltages to a selected block among the plurality of blocks after applying a first effective erasure voltage to the selected block. The peripheral circuit may be configured to determine a second effective erasure voltage applied to the selected block according to a plurality of erasure verification results corresponding to the plurality of different erasure verification voltages. The second effective erasure voltage may be greater than the first effective erasure voltage.

Abstract: A memory device includes a first substrate, a first memory array, a second substrate, and at least one first vertical transistor. The first memory array is disposed on the first substrate. The first memory array includes at least one first word line structure. The first memory array is disposed between the first substrate and the second substrate in a vertical direction. The first vertical transistor is electrically connected with the first word line structure. At least a part of the at least one first vertical transistor is disposed in the second substrate.

Abstract: Examples of the present application disclose a memory, a storage system and an electronic product, and belong to the technical field of storage. The memory comprises a control circuit, a voltage loading circuit, a first driver and a second driver. The voltage loading circuit is configured to load a first voltage to a control terminal of the first driver through a first output terminal to start the first driver, and load a second voltage to a control terminal of the second driver through a second output terminal to start the second driver, in response to a block selection signal received by a control terminal. Since starting voltages may be loaded by different output terminals of the voltage loading circuit to different drivers, all the drivers do not share the same starting voltage any longer; instead, different drivers can use different starting voltages, thereby avoiding performance degradation of some drivers caused by a tunneling effect due to the use of the same starting voltage.

Abstract: A semiconductor device includes a bit line unit, a word line unit, a bit line drive unit, and a word line drive unit. The bit line unit is configured to divide the word line unit into a first word line unit and a second word line unit. The distance between the second word line unit and the word line drive unit is greater than that the distance between the first word line unit and the word line drive unit. The word line drive unit is configured to provide the driving voltage for programming to the word line unit. The bit line drive unit is configured to apply the first bias voltage to the bit line unit that performs the dividing to obtain the first word line unit in the charging phase of programming, and to apply the second bias voltage to the bit line unit that performs the dividing to obtain the second word line unit in the discharging phase of programming.

Abstract: The present disclosure provides a three-dimensional NAND memory device, comprising a first NAND string including a first channel corresponding to a first cell to be inhibited to program, and a controller configured to control a word line driver and a bit line driver to do the following operations: prior to applying a program voltage to a selected word line, charging a first bit line electrically coupling with the first channel to a first voltage level for charging the first channel to the first voltage level, charging an array common source electrically coupling with the first bit line for further charging the first channel to a second voltage level higher than the first voltage level, and cutting off the electrical coupling between the first bit line and the first channel for preparing to apply the program voltage to the selected word line.

Abstract: In certain aspects, a memory device includes a memory cell array having rows of memory cells, word lines respectively coupled to the rows of memory cells, and a peripheral circuit coupled to the memory cell array through the word lines. The peripheral circuit is configured to program a row of memory cells using a first program voltage and verify the programmed row of memory cells using a verify voltage and a sample voltage smaller than the verify voltage. The peripheral circuit is also configured to obtain a first number of memory cells of the programmed row of memory cells based on the sample voltage. The peripheral circuit is further configured to predict, based on the first number of memory cells and the sample voltage, a second number of memory cells of the programmed row of memory cells that fail to pass the verification.

Abstract: A memory device includes a first substrate, a first memory array, a second substrate, and at least one first vertical transistor. The first memory array is disposed on the first substrate. The first memory array includes at least one first word line structure. The first memory array is disposed between the first substrate and the second substrate in a vertical direction. The first vertical transistor is electrically connected with the first word line structure. At least a part of the at least one first vertical transistor is disposed in the second substrate.

Abstract: Semiconductor structure, comprising a memory-array unit comprising: a substrate, a memory array disposed on the substrate, and a first bonding region disposed around the memory array. The memory array comprises multiple word lines, multiple bit lines, and multiple source lines. The first bonding region comprises a first substrate-connecting bonding region, a first bit-line bonding region, a first word-line bonding region, and a first source-line bonding region. The first substrate-connecting bonding region is configured to connect the substrate electrically to a surface of the memory-array unit, the first bit-line bonding region is configured to connect the bit lines electrically to the surface of the memory-array unit, the first word-line bonding region is configured to connect the word lines electrically to the surface of the memory-array unit, and the first source-line bonding region is configured to connect the source lines electrically to the surface of the memory-array unit.

Abstract: A memory device includes a first substrate, a first memory array, a second substrate, and at least one first vertical transistor. The first memory array is disposed on the first substrate. The first memory array includes at least one first word line structure. The first memory array is disposed between the first substrate and the second substrate in a vertical direction. The first vertical transistor is electrically connected with the first word line structure. At least a part of the at least one first vertical transistor is disposed in the second substrate.

Abstract: In certain aspects, a memory device includes an array of memory cells including a plurality of rows of memory cells, a plurality of word lines respectively coupled to the plurality of rows of memory cells, and a peripheral circuit coupled to the plurality of word lines and configured to perform an erase operation on a selected row of memory cells of the plurality of rows of memory cells. The selected row of memory cells is coupled to a selected word line. To perform the erase operation, the peripheral circuit is configured to discharge an unselected word line coupled to an unselected row of memory cells of the plurality of rows of memory cells from an initial voltage to a discharge voltage in a first time period, and float the unselected word line in a second time period after the first time period.

Abstract: The present disclosure provides a three-dimensional NAND memory device, comprising a first NAND string including a first channel corresponding to a first cell to be inhibited to program, and a controller configured to control a word line driver and a bit line driver to do the following operations: prior to applying a program voltage to a selected word line, charging a first bit line electrically coupling with the first channel to a first voltage level for charging the first channel to the first voltage level, charging an array common source electrically coupling with the first bit line for further charging the first channel to a second voltage level higher than the first voltage level, and cutting off the electrical coupling between the first bit line and the first channel for preparing to apply the program voltage to the selected word line.

Abstract: In certain aspects, a memory device includes an array of memory cells including a plurality of rows of memory cells, a plurality of word lines respectively coupled to the plurality of rows of memory cells, and a peripheral circuit coupled to the plurality of word lines and configured to perform an erase operation on a selected row of memory cells of the plurality of rows of memory cells. The selected row of memory cells is coupled to a selected word line. To perform the erase operation, the peripheral circuit is configured to discharge an unselected word line coupled to an unselected row of memory cells of the plurality of rows of memory cells from an initial voltage to a discharge voltage in a first time period, and float the unselected word line in a second time period after the first time period.

Abstract: In certain aspects, a memory device includes a memory cell array having rows of memory cells, word lines respectively coupled to the rows of memory cells, and a peripheral circuit coupled to the memory cell array through the word lines. The peripheral circuit is configured to program a row of memory cells using a first program voltage and verify the programmed row of memory cells using a verify voltage and a sample voltage smaller than the verify voltage. The peripheral circuit is also configured to obtain a first number of memory cells of the programmed row of memory cells based on the sample voltage. The peripheral circuit is further configured to predict, based on the first number of memory cells and the sample voltage, a second number of memory cells of the programmed row of memory cells that fail to pass the verification.

Abstract: A memory device includes a plurality of memory cells. Each row of the plurality of memory cells is coupled to a respective one of a plurality of wordlines. A method of programming the memory device includes applying a program voltage to a selected wordline of the plurality of wordlines. The method also includes applying a series of incremental verifying voltages to the selected wordline in a first time period after applying the program voltage. The method further includes floating an unselected wordline of the plurality of wordlines in a second time period at least partially overlapping the first time period. The unselected wordline is adjacent to the selected wordline.

Abstract: Apparatuses and methods for protecting transistors through charge sharing are disclosed herein. An example apparatus includes a transistor comprising a gate node and a bulk node, a charge sharing circuit coupled between the gate and bulk nodes, and logic. The charge sharing circuit is configure to equalize charge differences between the gate and bulk nodes, and the logic is configured to enable the charge sharing circuit based at least in part on a combination of first and second signals, which indicate the presence of a condition.

Abstract: A memory device includes a first substrate, a first memory array, a second substrate, and at least one first vertical transistor. The first memory array is disposed on the first substrate. The first memory array includes at least one first word line structure. The first memory array is disposed between the first substrate and the second substrate in a vertical direction. The first vertical transistor is electrically connected with the first word line structure. At least a part of the at least one first vertical transistor is disposed in the second substrate.

Abstract: A sense circuit of a memory cell includes a first switch, a sense node, a third switch, a connection node, a fourth switch, and a memory cell coupled in series. A boost driver is coupled to the sense node. A second switch and the connection node are coupled in series. The boost driver outputs a first voltage when the first, second, third, fourth switches are turned on. The third switch is then turned off and the boost driver outputs a second voltage higher than the first voltage such that the voltage level at the sense node is not higher than a system voltage. The third switch is turned on, then turned off and the boost driver outputs an intermediate voltage between the first voltage and the second voltage. A state of the memory cell is determined during output of the intermediate voltage.

Abstract: A storage array includes multiple wordlines of storage cells that can be selectively charged to an erase voltage or an inhibit voltage. Control logic associated with the storage array can perform erase verify in stages. On a first erase verify pass, the control logic can set wordlines of an erase block or subblock to a first erase voltage. On a second erase verify pass, the control logic can trigger a second erase verify pulse and set passing wordlines to an inhibit voltage, and failing wordlines to a second erase voltage higher than the first voltage. Inhibiting the already passing wordlines can reduce threshold voltage differences among the wordlines.

Abstract: A sense circuit of a memory cell includes a first switch, a sense node, a third switch, a connection node, a fourth switch, and a memory cell coupled in series. A boost driver is coupled to the sense node. A second switch and the connection node are coupled in series. The boost driver outputs a first voltage when the first, second, third, fourth switches are turned on. The third switch is then turned off and the boost driver outputs a second voltage higher than the first voltage such that the voltage level at the sense node is not higher than a system voltage. The third switch is turned on, then turned off and the boost driver outputs an intermediate voltage between the first voltage and the second voltage. A state of the memory cell is determined during output of the intermediate voltage.