Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A method of reconstructing transcranial images using a dual-mode ultrasonic phased array includes steps of: controlling channels to emit energy toward an intracranial target point of a patient; respectively generating backscattered radiofrequency (RF) data by using the channels to receive backscattered energy reflected from the intracranial target; and reconstructing an acoustic distribution image based on those backscattered RF data in real-time. Compared with Pre-Treatment Ray Tracing Method, the present invention can display intracranial pressure distribution in real-time; compared with MR Thermometry, the present invention can be applied to low-energy applications without temperature change; and compared with Passive Cavitation Imaging, the present invention can stably present acoustic distribution images without relying on microbubbles.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: A backlight module includes a light source, a first prism sheet disposed on the light source, and a light type adjustment sheet disposed on a side of the first prism sheet away from the light source and including a base and multiple light type adjustment structures. The multiple light type adjustment structures are disposed on the first surface of the base. Each light type adjustment structure has a first structure surface and a second structure surface connected to each other. The first structure surface of each light type adjustment structure and the first surface of the base form a first base angle therebetween, and the second structure surface of each light type adjustment structure and the first surface of the base form a second base angle therebetween. The angle of the first base angle is different from the angle of the second base angle.

Abstract: In some embodiments, the present disclosure relates to a device having a semiconductor substrate including a frontside and a backside. On the frontside of the semiconductor substrate are a first source/drain region and a second source/drain region. A gate electrode is arranged on the frontside of the semiconductor substrate and includes a horizontal portion, a first vertical portion, and a second vertical portion. The horizontal portion is arranged over the frontside of the semiconductor substrate and between the first and second source/drain regions. The first vertical portion extends from the frontside towards the backside of the semiconductor substrate and contacts the horizontal portion of the gate electrode structure. The second vertical portion extends from the frontside towards the backside of the semiconductor substrate, contacts the horizontal portion of the gate electrode structure, and is separated from the first vertical portion by a channel region of the substrate.

Abstract: An integrated circuit device includes a device layer having devices spaced in accordance with a predetermined device pitch, a first metal interconnection layer disposed above the device layer and coupled to the device layer, and a second metal interconnection layer disposed above the first metal interconnection layer and coupled to the first metal interconnection layer through a first via layer. The second metal interconnection layer has metal lines spaced in accordance with a predetermined metal line pitch, and a ratio of the predetermined metal line pitch to predetermined device pitch is less than 1.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A package component and forming method thereof are provided. The package component includes a substrate and a conductive layer. The substrate includes a first surface. The conductive layer is disposed over the first surface. The conductive layer includes a first conductive feature and a second conductive feature. The second conductive feature covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the first conductive feature.

Abstract: A keyboard device includes plural key structures. Each key structure includes a base plate, a keycap, a connecting member and at least one raised structure. The keycap is located over the base plate. The connecting member is arranged between the base plate and the keycap. The keycap is movable upwardly or downwardly relative to the base plate through the connecting member. The connecting member includes at least one first hook part. The raised structure is installed on the base plate. The first hook part is connected with the raised structure. The raised structure includes a top wall, a lateral wall and a perforation. The lateral wall is connected between the top wall and the base plate. The perforation is formed in the lateral wall. The first hook part is penetrated through the perforation and contacted with the top wall.

Abstract: A keyboard device includes plural key structures. Each key structure includes a supporting plate, a keycap, a connecting member and a hook element. The keycap is located over the supporting plate, and movable upwardly or downwardly relative to the supporting plate. The connecting member is connected between the supporting plate and the keycap. The hook element is installed on the supporting plate. The connecting member is connected with the supporting plate through the hook element. The supporting plate is made of a first material with a first specific gravity. The hook element is made of a second material with a second specific gravity. The second specific gravity is higher than the first specific gravity.

Abstract: A keyboard device includes a membrane circuit board, a base plate, a coupling structure and a key structure. The base plate includes a substrate and a protrusion structure. The protrusion structure is bent and protruded upwardly from the substrate. A bent region is formed between the protrusion structure and the substrate. A coupling opening is formed in the bent region. The coupling structure filled in the coupling opening to cover the protrusion structure. The key structure includes a keycap and a connecting element. The connecting element is connected between the keycap and the coupling structure.

Abstract: A keyboard device includes a base plate and a key structure. The key structure includes a keycap, a first connecting element, a second connecting element and a stabilizer bar. The first connecting element and the second connecting element are arranged between the base plate and the keycap and connected with the base plate and the keycap. The stabilizer bar is fixed on the first connecting element and the second connecting element. Since the stabilizer bar does not collide with the base plate to generate the unpleasant noise, the keyboard device of the present invention is capable of reducing the noise. Moreover, since the stabilizer bar is fixed on the first connecting element and the second connecting element, it is not necessary to install hooks corresponding to the stabilizer bar on the keycap and the base plate and the fabricating cost is reduced.

Abstract: A key structure includes a base plate, a triggering element, a keycap and a scissors-type connecting element. The base plate includes an open-type hook and a bulge. The scissors-type connecting element includes a first frame and a second frame. The first frame includes a first base post and an elastic contact part. Due to the structure of the open-type hook, the first frame can be easily assembled with the base plate. Moreover, it is not necessary to retain the gap between the first base posit and the open-type hook. While the first frame is swung, the elastic contact part is pushed by the corresponding bulge. Consequently, the first base post is not detached from the base plate.

Abstract: A keyboard device includes a base plate, a connecting element and a keycap. The connecting element is connected with a hook of the keycap and the base plate. The keycap includes an elastic structure, a first hooking part and a second hooking part. The elastic structure hook is installed on an inner surface of the keycap. The first hooking part is arranged beside a first side of the elastic structure. The second hooking part is arranged beside a second side of the elastic structure. While the connecting element is assembled with the keycap, the first hooking part and the second hooking part are pushed by the connecting element and the keycap is bent in response to the elasticity of the elastic structure. Consequently, the first hooking part is moved away from the second hooking part.

Abstract: A key structure includes a base plate, a triggering element, a keycap and a scissors-type connecting element. The base plate includes an open-type hook and a bulge. The scissors-type connecting element includes a first frame and a second frame. The first frame includes a first base post and an elastic contact part. Due to the structure of the open-type hook, the first frame can be easily assembled with the base plate. Moreover, it is not necessary to retain the gap between the first base posit and the open-type hook. While the first frame is swung, the elastic contact part is pushed by the corresponding bulge. Consequently, the first base post is not detached from the base plate.

Abstract: A keyboard device includes a key structure, a switch circuit board, a base plate and a buffering strip. The key structure includes a keycap and a stabilizer bar. The stabilizer bar is connected with the keycap. A first end of the buffering strip is fixed in a first coupling structure of the keycap. A second end of the buffering strip is fixed in a second coupling structure of the keycap. The buffering strip is contacted with the stabilizer bar and filled in a gap between the stabilizer bar and the first coupling structure. Since the possibility of resulting in the collision between the stabilizer bar and the keycap is minimized, the keycap device is capable of reducing noise.

Abstract: A keyboard device includes a key structure, a switch circuit board, a base plate and a buffering strip. The key structure includes a keycap and a stabilizer bar. The stabilizer bar is connected with the keycap. A first end of the buffering strip is fixed in a first coupling structure of the keycap. A second end of the buffering strip is fixed in a second coupling structure of the keycap. The buffering strip is contacted with the stabilizer bar and filled in a gap between the stabilizer bar and the first coupling structure. Since the possibility of resulting in the collision between the stabilizer bar and the keycap is minimized, the keycap device is capable of reducing noise.

Abstract: A method for assembling a keyboard device includes the following steps. Firstly, a keyboard base and a cursor moving module are provided. Then, the cursor moving module is initially assembled with the keyboard base according to a supporting plate of the cursor moving module. Then, a laser welding process is performed on a junction between the supporting plate and the keyboard base. Consequently, the cursor moving module and the keyboard base are combined together. By the assembling method of the present invention, no protrusion structures are formed on the inner surface of the keyboard base. Consequently, the thickness of the keyboard device is not decreased, and the slimness of the keyboard device is achieved.

Abstract: The present invention provides a key structure and a manufacturing method thereof. The key structure includes a keycap made of a first material and a graphics made of a second material. A part of the graphics is filled in a groove that extends downwards from an upper surface of the keycap, and an other part of the graphics is exposed outside the groove for press, and the graphics is molded by means of a resin dispensing process. In addition, the present invention further provides a keyboard devices that applies the foregoing key structure.

Abstract: The present invention provides a keyboard, which includes a plurality of key structures. Each of the key structures includes an elastic piece, a filling piece, a membrane circuit board, and a movable support structure. The elastic piece is used for press by a user to trigger the membrane circuit board. The movable support structure is connected to the filling piece, and is located in an accommodating space defined by the elastic piece, so as to improve an overall structural strength. The elastic piece coats the filling piece and is co-injection molded with the filling piece; hardness of the filling piece is greater than that of the elastic piece, so as to improve hand feelings of pressing the elastic piece.