Patents by Inventor Chunyun Huang

Chunyun Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9315893
    Abstract: A vapor deposition device has a plurality of moving plates between the cooling plate and moving vapor deposition source is controlled by the blowout panel. Moreover, when the vapor deposition materials absorbed by the blowout panel are up to the predetermined value, the moving plates are rotated around their axis simultaneously by the linkage to form a new blowout panel for performing the subsequent vapor deposition process. Consequently, the adsorption ability of the blowout board is greatly improved, and the crack and peeling off of the blowout panel caused by absorbing too many vapor deposition materials are avoided. Hence, the volume production of the evaporative coating equipment is improved.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: April 19, 2016
    Assignee: EVERDISPLAY OPTRONICS (SHANGHAI) LIMITED
    Inventor: ChunYun Huang
  • Patent number: 8986457
    Abstract: An evaporation source assembly used for depositing film on a substrate is provided, the evaporation source assembly comprises: a body comprising a top element, a bottom element and side walls defining a hollow chamber together, the bottom element comprises a plurality of inlet openings communicating with the chamber; a plurality of nozzles located at the top element and communicate with the chamber; a plurality of evaporators for containing and evaporating the evaporating material, which are positioned below the body and correspond to inlet openings respectively; each evaporator has an opening through which the evaporators is connected with corresponding inlet openings; and a plurality of connecting pipes for connecting the opening of the evaporators with the inlet openings, the connecting pipes are tapered pipes with a broad top and a narrow bottom to improve the vapor pressure of the evaporating material in the body to reach pressure balance.
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: March 24, 2015
    Assignee: Everdisplay Optronics (Shanghai) Limited
    Inventors: Chinchih Lin, Haoyu Chou, Chunyun Huang
  • Publication number: 20140345530
    Abstract: A vapor deposition device has a plurality of moving plates between the cooling plate and moving vapor deposition source is controlled by the blowout panel. Moreover, when the vapor deposition materials absorbed by the blowout panel are up to the predetermined value, the moving plates are rotated around their axis simultaneously by the linkage to form a new blowout panel for performing the subsequent vapor deposition process. Consequently, the adsorption ability of the blowout board is greatly improved, and the crack and peeling off of the blowout panel caused by absorbing too many vapor deposition materials are avoided. Hence, the volume production of the evaporative coating equipment is improved.
    Type: Application
    Filed: May 16, 2014
    Publication date: November 27, 2014
    Applicant: EverDisplay Optronics (Shanghai) Limited
    Inventor: ChunYun Huang
  • Publication number: 20140290579
    Abstract: The disclosure discloses a single point linear evaporation source system comprising a body, an evaporator and two guiding plates. The body comprises an elongated chamber, and the surface of the body towards the substrate is provided with a plurality of nozzles communicating with the chamber for ejecting evaporating vapor towards the substrate. The evaporator comprises an opening portion communicating with the chamber. Two guiding plates are disposed inclinedly at two ends of the chamber, and the periphery of the guiding plates are in sealing connection with the body, and the distance between two ends of the two guiding plates adjacent to the substrate is larger than the distance between two ends of the two guiding plates adjacent to the evaporator. The disclosure improves the balance performance of the vapor pressure inside the chamber, and improves the uniformity of the film deposited on the substrate.
    Type: Application
    Filed: July 30, 2013
    Publication date: October 2, 2014
    Applicant: EverDisplay Optronics (Shanghai) Limited
    Inventors: Chinchih Lin, Haoyu Chou, Chunyun Huang
  • Publication number: 20140295600
    Abstract: An evaporation source assembly used for depositing film on a substrate is provided, the evaporation source assembly comprises: a body comprising a top element, a bottom element and side walls defining a hollow chamber together, the bottom element comprises a plurality of inlet openings communicating with the chamber; a plurality of nozzles located at the top element and communicate with the chamber; a plurality of evaporators for containing and evaporating the evaporating material, which are positioned below the body and correspond to inlet openings respectively; each evaporator has an opening through which the evaporators is connected with corresponding inlet openings; and a plurality of connecting pipes for connecting the opening of the evaporators with the inlet openings, the connecting pipes are tapered pipes with a broad top and a narrow bottom to improve the vapor pressure of the evaporating material in the body to reach pressure balance.
    Type: Application
    Filed: July 30, 2013
    Publication date: October 2, 2014
    Applicant: EverDisplay Optronics (Shanghai) Limited
    Inventors: Chinchih Lin, Haoyu Chou, Chunyun Huang