Patents by Inventor Chusheng Qi

Chusheng Qi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130089700
    Abstract: A composite board having a sorghum stalk material component and a thermoplastic binder component is disclosed together with a corresponding method of manufacture. To prepare the composite board, the sorghum stalk material is harvested, dried and refined into fibers, particles or slit-stalks. In some cases, the stalk material is first combined with a thermosetting binder such PMDI. Next, the stalk material is arranged into one or more layers and then combined with a thermoplastic binder, such as HDPE film, in a stack. In some instances, recycled HDPE may be used. The stack is thermocompressed in a press at a preselected temperature to compress the sorghum and thermoplastic binder to a preselected board thickness. The board is then cooled to below the softening temperature of the thermoplastic resin. After cooling, the board can be cut or trimmed to its final desired dimensions.
    Type: Application
    Filed: October 4, 2012
    Publication date: April 11, 2013
    Inventors: Michael Warren Hurst, Chusheng Qi, Michael Wolcott, Vikram Yadama
  • Publication number: 20130089699
    Abstract: A composite board having a sorghum stalk material component and a binder component is disclosed together with a corresponding method of manufacture. To prepare the composite board, the sorghum stalk material is harvested, dried and refined into fibers. The fibers are then combined with a binder such as a thermosetting resin. The resin coated fibers are then arranged into a stack having several layers. Within each layer, the resin coated fibers are aligned along a predetermined layer axis. Next, the stack is thermocompressed in a press at a preselected temperature to compress the resin coated fibers to a preselected board thickness.
    Type: Application
    Filed: October 4, 2012
    Publication date: April 11, 2013
    Inventors: Michael Warren Hurst, Chusheng Qi, Vikram Yadama