Patents by Inventor Chutao LIN

Chutao LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Rigid-flexible circuit board having flying-tail structure and method for manufacturing same
    Patent number: 9706669
    Abstract: Provided is a method for manufacturing a rigid-flexible circuit board having a flying-tail structure, comprising the following steps: step 1: manufacturing core substrates needed by daughter boards (500), the cord boards needed by each daughter board comprising at least one flexible core substrate (510) and at least one rigid core substrate (520), stacking and laminating the core substrates to manufacture daughter boards, the number of the manufactured daughter boards being equal to the number of second rigid areas (300), and each daughter board comprising a partial first rigid area (110), a flexible area (200), and a second rigid area (300); step 2, stacking the daughter boards obtained in step 1, and pasting polyetherimide covering films (400) on solder-resist areas of adjacent end surfaces of the second rigid areas; and step 3, providing PTFE gaskets (600) between adjacent flexible areas and adjacent second rigid areas, laminating the daughter boards that have been processed in step 2, and laminating the p
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: July 11, 2017
    Assignees: GUANGZHOU FASTPRINT CIRCUIT TECH CO., LTD., SHENZHEN FASTPRINT CIRCUIT TECH CO., LTD., YIXING SILICON VALLEY ELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Xingya Qiu, Chutao Lin, Bei Chen
  • RIGID-FLEXIBLE CIRCUIT BOARD HAVING FLYING-TAIL STRUCTURE AND METHOD FOR MANUFACTURING SAME
    Publication number: 20160324012
    Abstract: Provided is a method for manufacturing a rigid-flexible circuit board having a flying-tail structure, comprising the following steps: step 1: manufacturing core substrates needed by daughter boards (500), the cord boards needed by each daughter board comprising at least one flexible core substrate (510) and at least one rigid core substrate (520), stacking and laminating the core substrates to manufacture daughter boards, the number of the manufactured daughter boards being equal to the number of second rigid areas (300), and each daughter board comprising a partial first rigid area (110), a flexible area (200), and a second rigid area (300); step 2, stacking the daughter boards obtained in step 1, and pasting polyetherimide covering films (400) on solder-resist areas of adjacent end surfaces of the second rigid areas; and step 3, providing PTFE gaskets (600) between adjacent flexible areas and adjacent second rigid areas, laminating the daughter boards that have been processed in step 2, and laminating the p
    Type: Application
    Filed: December 11, 2014
    Publication date: November 3, 2016
    Inventors: Xingya QIU, Chutao LIN, Bei CHEN