Patents by Inventor Chuyi CHEN

Chuyi CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Image sensor and depth imaging system
    Patent number: 11984461
    Abstract: The present disclosure provides an image sensor, which may include a driving layer, a negative electrode layer formed in the driving layer, a N-region layer formed above the negative electrode layer. The N-region layer includes multiple cylindrical structures formed of semiconductor materials. The image sensor may also include a light absorption layer formed above the N-region layer. The light absorption layer is composed of a multi-layer structure including a P-region layer formed using quantum dot semiconductor materials. The image sensor may further include a positive electrode layer formed above the light absorption layer and configured to receive incoming light signals.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: May 14, 2024
    Assignee: Rockchip Electronics Co., Ltd.
    Inventors: Huabing Xu, Qiang Ni, Gang Wang, Chuyi Chen, Fayao Zheng, Da Xu, Mingpei Liu
  • IMAGE SENSOR AND DEPTH IMAGING SYSTEM
    Publication number: 20220190269
    Abstract: The present disclosure provides an image sensor, which may include a driving layer, a negative electrode layer formed in the driving layer, a N-region layer formed above the negative electrode layer. The N-region layer includes multiple cylindrical structures formed of semiconductor materials. The image sensor may also include a light absorption layer formed above the N-region layer. The light absorption layer is composed of a multi-layer structure including a P-region layer formed using quantum dot semiconductor materials. The image sensor may further include a positive electrode layer formed above the light absorption layer and configured to receive incoming light signals.
    Type: Application
    Filed: November 18, 2021
    Publication date: June 16, 2022
    Applicant: Rockchip Electronics Co., Ltd.
    Inventors: Huabing XU, Qiang NI, Gang WANG, Chuyi CHEN, Fayao ZHENG, Da XU, Mingpei LIU