Patents by Inventor Chwan-Hwa Chiang

Chwan-Hwa Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10926292
    Abstract: A frame includes a substrate, a first priming paint layer, a second priming paint layer, a non-conductive vacuum metallized priming paint layer, and a non-conductive vacuum metallized coating layer. The substrate is made by die casting technology of metal powder. The substrate, the first priming paint layer, the second priming paint layer, the non-conductive vacuum metallized priming paint layer, and the non-conductive vacuum metallized coating layer are stacked in the order written. The disclosure also provides a surface treatment method for the frame.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: February 23, 2021
    Assignees: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: Chwan-Hwa Chiang, Chen-Yi Tai, Fei-Long Xiao, Jun Guan
  • Publication number: 20200122194
    Abstract: A frame includes a substrate, a first priming paint layer, a second priming paint layer, a non-conductive vacuum metallized priming paint layer, and a non-conductive vacuum metallized coating layer. The substrate is made by die casting technology of metal powder. The substrate, the first priming paint layer, the second priming paint layer, the non-conductive vacuum metallized priming paint layer, and the non-conductive vacuum metallized coating layer are stacked in the order written. The disclosure also provides a surface treatment method for the frame.
    Type: Application
    Filed: March 6, 2019
    Publication date: April 23, 2020
    Inventors: CHWAN-HWA CHIANG, CHEN-YI TAI, FEI-LONG XIAO, JUN GUAN
  • Publication number: 20200039184
    Abstract: A composite middle frame for use in an electronic communication device includes at least two connecting layers. Each connecting layer is an endless structure. At least one of the connecting layers is made of plastic, and the remaining connecting layers are made of metal.
    Type: Application
    Filed: September 5, 2018
    Publication date: February 6, 2020
    Inventors: CHWAN-HWA CHIANG, ZENG-MAO ZHENG
  • Publication number: 20200021324
    Abstract: A shell for at least one electronic device which is very resilient for everyday purposes and which in addition can restore itself after severe deformations by being heated includes at least one frame, the frame being made in one or more parts out of memory metal. The disclosure also provides a method for manufacturing the shell.
    Type: Application
    Filed: December 29, 2018
    Publication date: January 16, 2020
    Inventors: CHWAN-HWA CHIANG, CHEN-YI TAI, ZENG-MAO ZHENG
  • Publication number: 20190366588
    Abstract: A composite object with more complete and stronger adhesion between the constituent parts includes a substrate and a plastic member formed on a surface of the substrate. The substrate can be made of memory metal. Nano-holes are formed on the surface of the substrate. The composite further includes a combining layer. The combining layer is positioned between the substrate and the plastic member. The nano-holes are at least partially filled with the combining layer, unfilled holes being filled with the plastic constituent in the molten state. The disclosure further provides a method for manufacturing the composite.
    Type: Application
    Filed: February 25, 2019
    Publication date: December 5, 2019
    Inventors: CHWAN-HWA CHIANG, CHEN-YI TAI, ZENG-MAO ZHENG
  • Publication number: 20190368052
    Abstract: A composite toughened against chipping during machining and other operations includes a substrate and a coating layer includes a substrate and a coating layer. The substrate is titanium or titanium alloys. Nano-holes are formed on a surface of the substrate. The coating layer completely fills in the nano-holes and completely covers the surface of the substrate where the nano-holes are not formed. The disclosure further provides a method for making such composite.
    Type: Application
    Filed: November 27, 2018
    Publication date: December 5, 2019
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: CHWAN-HWA CHIANG, CHEN-YI TAI, ZENG-MAO ZHENG
  • Publication number: 20190366603
    Abstract: A composite material includes a metal substrate, and a plastic member formed on a surface of the metal substrate. A material of the metal substrate is titanium or titanium alloys, and an acid treatment leaves nano-holes and protrusions on the surface of the metal substrate. The composite material further includes a combining layer between the metal substrate and the plastic member. The nano-holes are partially filled with the combining layer, the protrusions are partially surrounded by the combining layer. The disclosure further provides a method for making such composite material.
    Type: Application
    Filed: October 31, 2018
    Publication date: December 5, 2019
    Inventors: CHWAN-HWA CHIANG, CHEN-YI TAI, ZENG-MAO ZHENG
  • Publication number: 20190193370
    Abstract: A method for making a metal-and-resin composite, including: providing a metal substrate made of stainless steel; forming a plurality of nano pores on a surface of the metal substrate by chemical etching the metal substrate; forming an intermediate layer on the metal substrate by dipping the metal substrate in a coupling agent solution, the intermediate layer filling at least portion of each nano pore; and forming a resin member by placing the metal substrate in a mold and molding molten resin on a surface of the intermediate layer, the resin member covering and bonding with the intermediate layer, treating the metal substrate with a coupling solution having a silane compound coupling agent to make the intermediate layer.
    Type: Application
    Filed: March 5, 2019
    Publication date: June 27, 2019
    Inventors: CHWAN-HWA CHIANG, BAO-SHEN ZHANG, CHIEH-HSIANG WANG
  • Patent number: 10259189
    Abstract: A metal-and-resin composite includes a metal substrate having a plurality of nano pores, an intermediate layer formed on the metal substrate, and a resin member. The intermediate layer fills at least portion of each nano pore. The resin member covers and bonds with the intermediate layer, thus to bond with the metal substrate.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: April 16, 2019
    Assignees: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO, FIH (HONG KONG) LIMITED
    Inventors: Chwan-Hwa Chiang, Bao-Shen Zhang, Chieh-Hsiang Wang
  • Patent number: 9639118
    Abstract: A housing includes a main portion and at least one insulating portion. The main portion includes two portions, an inner surface and an outer surface opposite to the inner surface. The inner surface defines at least one groove. The outer surface defines at least one gap that is coupled to the at least one groove. The at least one insulating portion is corresponding to the at least one groove and each insulating portion is filled in one groove. The two portions of the main portion are positioned at two sides of the at least one gap and the two portions are insulated by the at least one gap and the at least one insulating portion.
    Type: Grant
    Filed: August 14, 2015
    Date of Patent: May 2, 2017
    Assignees: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: Chwan-Hwa Chiang, Chieh-Hsiang Wang, Bao-Shen Zhang, Chen-Yi Tai
  • Publication number: 20160344090
    Abstract: A housing used in an electronic device having an antenna, the housing includes a base and a non-conductive film. The base defines a slot corresponding to the antenna and forms a surface enclosing the slot. The non-conductive film is formed on a surface of the base, the non-conductive film is configured to be coupled to the antenna and insulated the antenna from the base. An electronic device employing the housing and a manufacture method of the housing are also provided.
    Type: Application
    Filed: October 22, 2015
    Publication date: November 24, 2016
    Inventors: CHWAN-HWA CHIANG, CHIEH-HSIANG WANG, BAO-SHEN ZHANG, CHEN-YI TAI
  • Publication number: 20160327981
    Abstract: A housing includes a main portion and at least one insulating portion. The main portion includes two portions, an inner surface and an outer surface opposite to the inner surface. The inner surface defines at least one groove. The outer surface defines at least one gap that is coupled to the at least one groove. The at least one insulating portion is corresponding to the at least one groove and each insulating portion is filled in one groove. The two portions of the main portion are positioned at two sides of the at least one gap and the two portions are insulated by the at least one gap and the at least one insulating portion.
    Type: Application
    Filed: August 14, 2015
    Publication date: November 10, 2016
    Inventors: CHWAN-HWA CHIANG, CHIEH-HSIANG WANG, BAO-SHEN ZHANG, CHEN-YI TAI
  • Patent number: 9468114
    Abstract: A housing includes a substrate and a decorative layer deposited on the substrate. The decorative layer includes chromium, iron, aluminum, chromium oxide, ferric oxide, and aluminum oxide. The chromium oxide, ferric oxide, and aluminum oxide distribute evenly among the chromium, iron, and aluminum respectively, such that the chromium, iron, and aluminum atoms are separated from each other. The decorative layer is electrically non-conductive and electromagnetically transmissive and gives the housing a mirror-like black and metallic appearance. An electronic device using the housing is also described.
    Type: Grant
    Filed: July 10, 2013
    Date of Patent: October 11, 2016
    Assignee: FIH (Hong Kong) Limited
    Inventors: Chwan-Hwa Chiang, Chieh-Hsiang Wang
  • Publication number: 20160159029
    Abstract: A metal-and-resin composite includes a metal substrate having a plurality of nano pores, an intermediate layer formed on the metal substrate, and a resin member. The intermediate layer fills at least portion of each nano pore. The resin member covers and bonds with the intermediate layer, thus to bond with the metal substrate.
    Type: Application
    Filed: January 30, 2015
    Publication date: June 9, 2016
    Inventors: CHWAN-HWA CHIANG, BAO-SHEN ZHANG, CHIEH-HSIANG WANG
  • Publication number: 20160107419
    Abstract: A metal-resin composite includes a metal member, a connecting layer formed on the metal member and a resin member. The connecting layer has a plurality of micro-pores and is made of inorganic material. The resin member is filled into the micro-pores and covered on a surface of the connecting layer to bond with the metal member.
    Type: Application
    Filed: January 5, 2015
    Publication date: April 21, 2016
    Inventors: CHWAN-HWA CHIANG, CHIEH-HSIANG WANG
  • Publication number: 20160107342
    Abstract: A metal-resin composite includes a metal member and a resin member, the metal member has a plurality of metal posts formed on a surface of the metal member, the resin member is filled spaces between adjacent metal posts and covers the surface of the metal member to bond with the metal member.
    Type: Application
    Filed: January 13, 2015
    Publication date: April 21, 2016
    Inventors: CHWAN-HWA CHIANG, CHIEH-HSIANG WANG, BAO-SHEN ZHANG
  • Patent number: 9232659
    Abstract: A housing for an electronic device includes a ceramic base comprising ceramic material, at least one electronic element embedded in the ceramic base, and a buffer layer made of resin. The ceramic base includes an inner surface. The buffer layer is formed on the inner surface. A method for making the housing is also provided.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: January 5, 2016
    Assignee: FIH (Hong Kong) Limited
    Inventors: Chwan-Hwa Chiang, Chieh-Hsiang Wang
  • Publication number: 20150197048
    Abstract: A metal-and-resin composite includes a metal substrate, an anodic oxide layer defining nano pores formed on the substrate, an intermediate layer including coupling agent formed on the surface of the anodic oxide layer, and a resin article covering and coupled to the intermediate layer.
    Type: Application
    Filed: October 23, 2014
    Publication date: July 16, 2015
    Inventors: CHWAN-HWA CHIANG, CHIEH-HSIANG WANG, BAO-SHEN ZHANG
  • Publication number: 20150024213
    Abstract: A liquid coating composition to protect electronic elements on a circuit board includes a heat curable resin composition, a photocurable resin, a photoinitiator, a curing agent, and a solvent. The heat curable resin composition includes poly(acrylic acid) oligomer and at least one compound selected from the group consisting of an epoxy resin and polyester polyol. The curing agent includes at least one compound selected from the group consisting of dicarboxylic anhydride and isocyanate. A method for applying and solidifying the liquid coating composition to form a cured film on a substrate and a resulting composite structure are also provided.
    Type: Application
    Filed: July 11, 2014
    Publication date: January 22, 2015
    Inventors: CHWAN-HWA CHIANG, CHIEH-HSIANG WANG
  • Publication number: 20150003028
    Abstract: A housing for an electronic device includes a ceramic base comprising ceramic material, at least one electronic element embedded in the ceramic base, and a buffer layer made of resin. The ceramic base includes an inner surface. The buffer layer is formed on the inner surface. A method for making the housing is also provided.
    Type: Application
    Filed: December 6, 2013
    Publication date: January 1, 2015
    Applicant: FIH (HONG KONG) LIMITED
    Inventors: CHWAN-HWA CHIANG, CHIEH-HSIANG WANG