Abstract: A frame includes a substrate, a first priming paint layer, a second priming paint layer, a non-conductive vacuum metallized priming paint layer, and a non-conductive vacuum metallized coating layer. The substrate is made by die casting technology of metal powder. The substrate, the first priming paint layer, the second priming paint layer, the non-conductive vacuum metallized priming paint layer, and the non-conductive vacuum metallized coating layer are stacked in the order written. The disclosure also provides a surface treatment method for the frame.

Abstract: A frame includes a substrate, a first priming paint layer, a second priming paint layer, a non-conductive vacuum metallized priming paint layer, and a non-conductive vacuum metallized coating layer. The substrate is made by die casting technology of metal powder. The substrate, the first priming paint layer, the second priming paint layer, the non-conductive vacuum metallized priming paint layer, and the non-conductive vacuum metallized coating layer are stacked in the order written. The disclosure also provides a surface treatment method for the frame.

Abstract: A composite middle frame for use in an electronic communication device includes at least two connecting layers. Each connecting layer is an endless structure. At least one of the connecting layers is made of plastic, and the remaining connecting layers are made of metal.

Abstract: A shell for at least one electronic device which is very resilient for everyday purposes and which in addition can restore itself after severe deformations by being heated includes at least one frame, the frame being made in one or more parts out of memory metal. The disclosure also provides a method for manufacturing the shell.

Abstract: A composite toughened against chipping during machining and other operations includes a substrate and a coating layer includes a substrate and a coating layer. The substrate is titanium or titanium alloys. Nano-holes are formed on a surface of the substrate. The coating layer completely fills in the nano-holes and completely covers the surface of the substrate where the nano-holes are not formed. The disclosure further provides a method for making such composite.

Abstract: A composite material includes a metal substrate, and a plastic member formed on a surface of the metal substrate. A material of the metal substrate is titanium or titanium alloys, and an acid treatment leaves nano-holes and protrusions on the surface of the metal substrate. The composite material further includes a combining layer between the metal substrate and the plastic member. The nano-holes are partially filled with the combining layer, the protrusions are partially surrounded by the combining layer. The disclosure further provides a method for making such composite material.

Abstract: A composite object with more complete and stronger adhesion between the constituent parts includes a substrate and a plastic member formed on a surface of the substrate. The substrate can be made of memory metal. Nano-holes are formed on the surface of the substrate. The composite further includes a combining layer. The combining layer is positioned between the substrate and the plastic member. The nano-holes are at least partially filled with the combining layer, unfilled holes being filled with the plastic constituent in the molten state. The disclosure further provides a method for manufacturing the composite.

Abstract: A method for making a metal-and-resin composite, including: providing a metal substrate made of stainless steel; forming a plurality of nano pores on a surface of the metal substrate by chemical etching the metal substrate; forming an intermediate layer on the metal substrate by dipping the metal substrate in a coupling agent solution, the intermediate layer filling at least portion of each nano pore; and forming a resin member by placing the metal substrate in a mold and molding molten resin on a surface of the intermediate layer, the resin member covering and bonding with the intermediate layer, treating the metal substrate with a coupling solution having a silane compound coupling agent to make the intermediate layer.

Abstract: A metal-and-resin composite includes a metal substrate having a plurality of nano pores, an intermediate layer formed on the metal substrate, and a resin member. The intermediate layer fills at least portion of each nano pore. The resin member covers and bonds with the intermediate layer, thus to bond with the metal substrate.

Abstract: A housing includes a main portion and at least one insulating portion. The main portion includes two portions, an inner surface and an outer surface opposite to the inner surface. The inner surface defines at least one groove. The outer surface defines at least one gap that is coupled to the at least one groove. The at least one insulating portion is corresponding to the at least one groove and each insulating portion is filled in one groove. The two portions of the main portion are positioned at two sides of the at least one gap and the two portions are insulated by the at least one gap and the at least one insulating portion.

Abstract: A housing used in an electronic device having an antenna, the housing includes a base and a non-conductive film. The base defines a slot corresponding to the antenna and forms a surface enclosing the slot. The non-conductive film is formed on a surface of the base, the non-conductive film is configured to be coupled to the antenna and insulated the antenna from the base. An electronic device employing the housing and a manufacture method of the housing are also provided.

Abstract: A housing includes a main portion and at least one insulating portion. The main portion includes two portions, an inner surface and an outer surface opposite to the inner surface. The inner surface defines at least one groove. The outer surface defines at least one gap that is coupled to the at least one groove. The at least one insulating portion is corresponding to the at least one groove and each insulating portion is filled in one groove. The two portions of the main portion are positioned at two sides of the at least one gap and the two portions are insulated by the at least one gap and the at least one insulating portion.

Abstract: A housing includes a substrate and a decorative layer deposited on the substrate. The decorative layer includes chromium, iron, aluminum, chromium oxide, ferric oxide, and aluminum oxide. The chromium oxide, ferric oxide, and aluminum oxide distribute evenly among the chromium, iron, and aluminum respectively, such that the chromium, iron, and aluminum atoms are separated from each other. The decorative layer is electrically non-conductive and electromagnetically transmissive and gives the housing a mirror-like black and metallic appearance. An electronic device using the housing is also described.

Abstract: A metal-and-resin composite includes a metal substrate having a plurality of nano pores, an intermediate layer formed on the metal substrate, and a resin member. The intermediate layer fills at least portion of each nano pore. The resin member covers and bonds with the intermediate layer, thus to bond with the metal substrate.

Abstract: A metal-resin composite includes a metal member, a connecting layer formed on the metal member and a resin member. The connecting layer has a plurality of micro-pores and is made of inorganic material. The resin member is filled into the micro-pores and covered on a surface of the connecting layer to bond with the metal member.

Abstract: A metal-resin composite includes a metal member and a resin member, the metal member has a plurality of metal posts formed on a surface of the metal member, the resin member is filled spaces between adjacent metal posts and covers the surface of the metal member to bond with the metal member.

Abstract: A housing for an electronic device includes a ceramic base comprising ceramic material, at least one electronic element embedded in the ceramic base, and a buffer layer made of resin. The ceramic base includes an inner surface. The buffer layer is formed on the inner surface. A method for making the housing is also provided.

Abstract: A metal-and-resin composite includes a metal substrate, an anodic oxide layer defining nano pores formed on the substrate, an intermediate layer including coupling agent formed on the surface of the anodic oxide layer, and a resin article covering and coupled to the intermediate layer.

Abstract: A liquid coating composition to protect electronic elements on a circuit board includes a heat curable resin composition, a photocurable resin, a photoinitiator, a curing agent, and a solvent. The heat curable resin composition includes poly(acrylic acid) oligomer and at least one compound selected from the group consisting of an epoxy resin and polyester polyol. The curing agent includes at least one compound selected from the group consisting of dicarboxylic anhydride and isocyanate. A method for applying and solidifying the liquid coating composition to form a cured film on a substrate and a resulting composite structure are also provided.

Abstract: A housing for an electronic device includes a ceramic base comprising ceramic material, at least one electronic element embedded in the ceramic base, and a buffer layer made of resin. The ceramic base includes an inner surface. The buffer layer is formed on the inner surface. A method for making the housing is also provided.