Patents by Inventor Chwei-Jing Yeh

Chwei-Jing Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230152689
    Abstract: The invention provides a wire grid polarizer and a manufacturing method thereof. The method comprising steps of providing a substrate, forming a conductive layer on the substrate, forming an inverted wire grid structure on the conductive layer by nano-imprint or lithography process, and depositing a metal on the inverted wire grid structure to form a wire grid structure by electroforming or electrodeless coating technology. The conductive layer is transparent to the light wave band of the application. Since the method is an additive process, nano-imprint electroplating, electroforming, or electrodeless coating technology can be used, and the steps are simplified compared with subtractive process. Thus, the invention reduces or eliminates the need for expensive lithography technology, and avoids the use of complicated dry etching process.
    Type: Application
    Filed: November 15, 2021
    Publication date: May 18, 2023
    Inventor: Chwei-Jing YEH
  • Publication number: 20110013339
    Abstract: An assembly of an magnetic capacitor with a packaging comprises: a magnetic capacitor; two packing electrodes, one of the two end electrodes including an upper magnetic casing installed upon a top surface of the capacitor and a lower magnetic casing installed at a lower surface of the capacitor; each of the upper magnetic casing and the lower magnetic casing being formed with extruding pieces which is arranged around a lateral side of the capacitor; and at least one insulation material for isolating magnetic material is arranged within the magnetic capacitor.
    Type: Application
    Filed: July 15, 2009
    Publication date: January 20, 2011
    Inventors: Chung Ping Lai, James-Chyi Lai, Chwei-Jing Yeh, Wei- Kong Liu, Wen-Hsin Peng, Ching-Yu Lu
  • Patent number: 7768864
    Abstract: A non-volatile memory device capable of supplying power is provided. The non-volatile memory device includes an electrical storage device for supplying a stored power, a charging control circuit coupled to the electrical storage device, a non-volatile memory, an input/output (I/O) interface, and a power control circuit. The I/O interface connects an electronic apparatus for transmitting an external power output from the electronic apparatus to the non-volatile memory and the charging control circuit, such that the charging control circuit could control a charging current and a charging voltage of the electrical storage device. The power control circuit converts the stored power into a backup power, and monitors whether a voltage value of the external power is less than a predetermined value. If the result is positive, the power control circuit controls the charging control circuit to stop charging the electrical storage device, and outputs the backup power through the I/O interface.
    Type: Grant
    Filed: September 18, 2008
    Date of Patent: August 3, 2010
    Assignee: Ritek Corporation
    Inventor: Chwei-Jing Yeh
  • Publication number: 20100027365
    Abstract: A non-volatile memory device capable of supplying power is provided. The non-volatile memory device includes an electrical storage device for supplying a stored power, a charging control circuit coupled to the electrical storage device, a non-volatile memory, an input/output (I/O) interface, and a power control circuit. The I/O interface connects an electronic apparatus for transmitting an external power output from the electronic apparatus to the non-volatile memory and the charging control circuit, such that the charging control circuit could control a charging current and a charging voltage of the electrical storage device. The power control circuit converts the stored power into a backup power, and monitors whether a voltage value of the external power is less than a predetermined value. If the result is positive, the power control circuit controls the charging control circuit to stop charging the electrical storage device, and outputs the backup power through the I/O interface.
    Type: Application
    Filed: September 18, 2008
    Publication date: February 4, 2010
    Applicant: RITEK CORPORATION
    Inventor: Chwei-Jing Yeh
  • Patent number: 6904194
    Abstract: An optical switch apparatus is disclosed, which applies to the optical communication system or optical system for switching the optical path. The optical switch apparatus utilizes a servomotor rotates a circle mirror unit which two surfaces are coated or deposited a reflecting film and has a plurality of holes. Thereby the optical signals are transmitted from the fibers pass through the holes for transmitting to the others fibers, or the optical signals reflex to the others fibers via the reflecting film for switching the optical path.
    Type: Grant
    Filed: April 18, 2003
    Date of Patent: June 7, 2005
    Assignee: Alliance Fiber Optics Products
    Inventors: Chia-Hsiung Chang, Li-Wu Chang, Hong-Jueng King, Huei-Pin Huang, Chwei-Jing Yeh
  • Patent number: 6823761
    Abstract: A device for stripping coated optical fiber ribbons, in cooperation with at least an optical fiber ribbon having a protective coating and an optical fiber array substrate having grooves, comprises a heating unit including at least a first trench and a cutting blade for gripping a first portion of the optical fiber ribbon having protective coatings and for heating; a stripping unit having at least a second trench, adjacent to and connected to the first trench, for gripping a second portion of the optical fiber ribbon having the protective coating; a fiber array seat for receiving an optical fiber array substrate; and a linear guiding unit for limitedly guiding the direction of the separation movement between the heating unit and the stripping unit.
    Type: Grant
    Filed: April 18, 2003
    Date of Patent: November 30, 2004
    Assignee: Alliance Fiber Optics Products
    Inventors: Chung-I Chiang, Ming-Jen Wang, Kun-Hsien Cheng, Hong-Jueng King, Huei-Pin Huang, Chwei-Jing Yeh
  • Patent number: 6782183
    Abstract: A fiber array module fabrication method. The method includes the steps of: (a) preparing a optical fiber ribbon, a solder/binder coated fiber array substrate, and two holder bases, one holder base having longitudinally extended locating grooves; (b) putting the fiber array substrate in between the holder bases and keeping the longitudinally extended grooves of the fiber array substrate in alignment with the longitudinally extended aligning grooves of the holder base and then loading the optical fiber ribbon in the holder bases and keeping the optical fibers of the fiber ribbon in the locating grooves of the holder base and the fixing grooves of the fiber array substrate; (c) heating the solder or radiating the binder to fixedly secure the optical fibers to the fiber array substrate and the fiber array cover plate, and (d) cutting off the optical fibers and removing the finished fiber array module from the holder bases.
    Type: Grant
    Filed: April 18, 2003
    Date of Patent: August 24, 2004
    Assignee: Alliance Fiber Optics Products
    Inventors: Chung-I Chiang, Ming-Jen Wang, Kun-Hsien Cheng, Hong-Jueng King, Huei-Pin Huang, Chwei-Jing Yeh
  • Publication number: 20040082206
    Abstract: A sturdy parallelepiped housing includes a base including a plurality of spaces with a gigabit interface converter (GBIC) placed in one of the spaces and a plurality of stoppers are fitted against the GBIC; and a cover including a plurality of risers urging against walls in the base. A plurality of threaded holes is further formed in each of the base and the cover so that the housing can be fastened together by fasteners.
    Type: Application
    Filed: July 8, 2003
    Publication date: April 29, 2004
    Applicant: RiTek Corporation
    Inventors: Chia-Hsiung Chang, Hong-Jueng King, Huei-Pin Huang, Chwei-Jing Yeh
  • Publication number: 20040055161
    Abstract: A device for stripping coated optical fiber ribbons, in cooperation with at least an optical fiber ribbon having a protective coating and an optical fiber array substrate having grooves, comprises a heating unit including at least a first trench and a cutting blade for gripping a first portion of the optical fiber ribbon having protective coatings and for heating; a stripping unit having at least a second trench, adjacent to and connected to the first trench, for gripping a second portion of the optical fiber ribbon having the protective coating; a fiber array seat for receiving an optical fiber array substrate; and a linear guiding unit for limitedly guiding the direction of the separation movement between the heating unit and the stripping unit.
    Type: Application
    Filed: April 18, 2003
    Publication date: March 25, 2004
    Applicant: RiTek Corporation
    Inventors: Chung-I Chiang, Ming-Jen Wang, Kun-Hsien Cheng, Hong-Jueng King, Huei-Pin Huang, Chwei-Jing Yeh
  • Publication number: 20030198454
    Abstract: A fiber array module fabrication method is disclosed including the steps of: (a) preparing a optical fiber ribbon, a solder/binder coated fiber array substrate, and two holder bases, one holder base having longitudinally extended locating grooves, (b) putting the fiber array substrate in between the holder bases and keeping the longitudinally extended grooves of the fiber array substrate in alignment with the longitudinally extended aligning grooves of the holder base and then loading the optical fiber ribbon in the holder bases and keeping the optical fibers of the fiber ribbon in the locating grooves of the holder base and the fixing grooves of the fiber array substrate, (c) heating the solder or radiating the binder to fixedly secure the optical fibers to the fiber array substrate and the fiber array cover plate, and (d) cutting off the optical fibers and removing the finished fiber array module from the holder bases.
    Type: Application
    Filed: April 18, 2003
    Publication date: October 23, 2003
    Applicant: RiTek Corporation
    Inventors: Chung-I Chiang, Ming-Jen Wang, Kun-Hsien Cheng, Hong-Jueng King, Huei-Pin Huang, Chwei-Jing Yeh
  • Publication number: 20030198430
    Abstract: An optical switch apparatus is disclosed, which applies to the optical communication system or optical system for switching the optical path. The optical switch apparatus utilizes a servomotor rotates a circle mirror unit which two surfaces are coated or deposited a reflecting film and has a plurality of holes. Thereby the optical signals are transmitted from the fibers pass through the holes for transmitting to the others fibers, or the optical signals reflex to the others fibers via the reflecting film for switching the optical path.
    Type: Application
    Filed: April 18, 2003
    Publication date: October 23, 2003
    Applicant: RiTek Corporation
    Inventors: Chia-Hsiung Chang, Li-Wu Chang, Hong-Jueng King, Huei-Pin Huang, Chwei-Jing Yeh
  • Publication number: 20030194196
    Abstract: A fiber array base block is disclosed for the positioning at least one optical fiber for making a fiber array module, the fiber array base block having parallel grooves in one side for the positioning of optical fibers, and at least one channel disposed below and intersected with the grooves and adapted for producing a vacuum suction force to secure the optical fibers in the grooves as air drawn away from the channel channels.
    Type: Application
    Filed: April 11, 2003
    Publication date: October 16, 2003
    Applicant: RiTek Corporation
    Inventors: Chung-I Chiang, Ming-Jen Wang, Kun-Hsien Cheng, Hong-Jueng King, Huei-Pin Huang, Chwei-Jing Yeh
  • Publication number: 20030194494
    Abstract: ABSTRACT OF THE DISCLOSURE A method for forming the soldering layer of fiber array substrate surface has been disclosed herein. A plurality of fiber array bases having V-shape grooves are formed on a substrate, and a solder layer is formed on the whole substrate via chemical plating method of following steps: forming a layer of nickel/chromium (Ni/Cr) alloy or aluminum (Al) metal on said substrate through evaporation or sputtering; treating said surface of said substrate having V-shape grooves with a sensitizing solution for plating said surface with Sn2+, wherein said sensitizing solution comprises deionized water and SnCl2; treating said sensitized surface of said substrate with an activating solution for precipitating catalytic element Pd0 on said surface, wherein said sensitizing solution comprises 2 to 10 g/l of PdCl2 and 0.01 to 0.1 M HCl; and (E) immersing said treated surface into an electroless nickel plating solution to form a nickel metal layer on said treated surface.
    Type: Application
    Filed: April 11, 2003
    Publication date: October 16, 2003
    Applicant: RiTek Corporation
    Inventors: Chung-I Chiang, Ming-Jen Wang, Kun-Hsien Cheng, Hong-Jueng King, Huei-Pin Huang, Chwei-Jing Yeh
  • Publication number: 20030194197
    Abstract: A fiber array module is constructed by using low-temperature solders or metal as fastening means to fixedly secure optical fibers in grooves between a fiber array substrate and a top cover plate covered on the fiber array substrate over the optical fibers.
    Type: Application
    Filed: April 11, 2003
    Publication date: October 16, 2003
    Applicant: RiTek Corporation
    Inventors: Chung-I Chiang, Ming-Jen Wang, Kun-Hsien Cheng, Hong-Jueng King, Huei-Pin Huang, Chwei-Jing Yeh
  • Patent number: 6513786
    Abstract: A mold structure includes an upper mold and a lower mold. The upper mold is installed with an upper mold core, and the lower mold is installed with a lower mold core. A mold cavity is formed between the upper mold core and lower mold core. A mother plate disposed in the mold cavity is replaceably coupled to one of the mold cores. The mother plate includes a glass substrate with a metal film thereon. The metal film defines a pattern that is transferred to the plastic material molded in the mold cavity.
    Type: Grant
    Filed: November 28, 2000
    Date of Patent: February 4, 2003
    Assignee: Ritek Corporation
    Inventor: Chwei-Jing Yeh
  • Publication number: 20030007447
    Abstract: A hybrid optical disc recording medium has concurrently a hybrid read-only area and a rewritable area on an optical substrate. The substrate of the read-only area has pre-pits, and the substrate of the rewritable area has pre-grooves. The pre-pits and the pre-grooves have the same depth. Thus when making the stampers for producing the hybrid optical disc, the technical problems of difficult to control the yields that incur to conventional techniques of different depths of the pits and the grooves can be effectively resolved. Experiments and test results indicate that the hybrid optical disc recording medium of the invention that have the same depth for the pits and the grooves, and extended grooves, can generate signals to meet the standards of the specifications.
    Type: Application
    Filed: June 14, 2002
    Publication date: January 9, 2003
    Inventors: Chwei-Jing Yeh, Shyh-Yeu Wang, Min-Chung Chiu, Chi-Tsung Hsu
  • Patent number: 6411574
    Abstract: A coding method for high-capacity storage medium is provided. The the physical location of the code is arranged in an annulus area at inner side of the inner most edge of the compact disk and/or the lead-in area such that the storage medium is accessible in the existing CD-R/CD-RW. The recording time of the existing CD-R/CD-RW can be expended from 80 to 100 minutes.
    Type: Grant
    Filed: September 14, 1999
    Date of Patent: June 25, 2002
    Assignee: Ritek Corporation
    Inventors: Chien-Fang Su, Chwei-Jing Yeh
  • Patent number: 6348250
    Abstract: An optical recording medium is provided that includes a spirally grooved polymer substrate, a recording layer, a reflecting layer, and a protection layer. The recording layer includes one or a mixture of phthalocyanine dyes. The phthalocyanine dye includes a bicyclo-alkyl substituent, providing solubility in any of a plurality of solvents that will not damage the surface of the substrate.
    Type: Grant
    Filed: October 27, 1999
    Date of Patent: February 19, 2002
    Assignee: Ritek Corporation
    Inventors: Shyh-Yeu Wang, Jen-Hua Chung, Chwei-Jing Yeh