Abstract: A hybrid plasma source and an operation method thereof, the hybrid plasma source is formed by combining the mechanisms of microwave plasma and transformer coupled plasma for gas dissociation and chemical activation. A reaction chamber of the hybrid plasma source is composed of two microwave resonant chambers and sets of hollow metal tubes, after a high-intensity electric field is generated by the microwave resonant chambers to generate a plasma, a high power and high density plasma generated by the highly-efficient coupling mechanism of the transformer coupled plasma is capable of greatly improving a gas conductance, each set of the hollow metal tubes is driven by each set of ferrite transformer magnetic cores to disperse power, which reduces an energy density of each of the hollow metal tubes and reduces occurrence of plasma entering a contraction mode from a diffusion mode, thereby further improving an operable gas flow rate.

Abstract: Disclosed is an annealing system integrated with laser and microwave. The annealing system is provided with a microwave system, a laser system, and a measurement and control system. The microwave system provides a microwave energy to a first area of a to-be-annealed object for annealing the first area of the to-be-annealed object. The laser system uses a laser to provide a laser energy to a second area of the to-be-annealed object for annealing the second area of the to-be-annealed object. The measurement and control system monitors and controls a power of a microwave and/or a laser. The annealing system is capable of reducing a time required for an overall annealing, and also capable of avoiding cracks or defects caused by large stress differences.

Abstract: Disclosed is an electrical discharge machining apparatus at least comprising a carrier platform and an electrical discharge machining unit. The carrier platform is used to carry at least one to-be-machined object. The electrical discharge machining unit comprises an electrode, a jig and a power supply unit. When the electrical discharge machining unit performs an electrical discharge machining procedure on a machined target area of the to-be-machined object along a machining direction, an electrical discharge section of the electrode and the machined target area of the to-be-machined object move relatively. The invention is capable of improving a machining procedure, saving an overall machining time and saving a time required for electrode replacement.

Abstract: Disclosed is an electrical discharge machining apparatus at least comprising a carrier platform, an electrical discharge machining unit and a repairing device. The carrier platform is used for carrying at least one to-be-machined object. The electrical discharge machining unit comprises at least one electrode and a power supply unit, and is used for performing an electrical discharge machining procedure on a machined target area of the to-be-machined object by the electrode along a machining direction. When there is an area to be repaired on an appearance of the electrode, the repairing device performs a repairing procedure on the electrode, thereby achieving effects of stable electrical discharge and preventing short-circuit problem in the electrical discharge machining procedure.

Abstract: An electrical discharge machining apparatus and an electrical discharge machining method with adjustable machining parameters comprise a carrier and an electrical discharge machining (EDM) unit. The carrier is used for placing a to-be-machined object defined with a machining target area. A discharge electrode of the electrical discharge machining (EDM) unit is used to cut the machining target area of the to-be-machined object along a first cutting direction with at least one machining parameter, the machining parameter is correspondingly adjusted when a specified parameter of the to-be-machined object changes to a first numerical value, thereby using the adjusted machining parameter to perform a second cutting step on the machining target area of the to-be-machined object. A segmented cutting technology for solving a problem that a cutting speed (mm2/min) is slowed down and a total cutting time is prolonged due to changes of the specified parameter of electrical discharge machining cutting.

Abstract: A fast annealing equipment is applicable to the annealing treatment of silicon carbide wafers. The fast annealing equipment comprises a variable frequency microwave power source system, a resonant chamber heating system and a measurement and control system. The variable frequency microwave power source system uses a solid state power amplifier and has the flexibility of fast frequency sweep during heat treatment to compensate for resonant frequency changes due to load effect caused by temperature changes in a material to be annealed. In order to improve an energy efficiency and provide a sufficient microwave energy uniform area, the TM010 resonant chamber structure can be used to anneal 4-inch to 8-inch silicon carbide wafers. The measurement and control system combines software and hardware to form an automatic system with instant feedback to provide further flexibility, stability and reliability for the entire equipment.

Abstract: A hybrid plasma source and an operation method thereof, the hybrid plasma source is formed by combining the mechanisms of microwave plasma and transformer coupled plasma for gas dissociation and chemical activation. A reaction chamber of the hybrid plasma source is composed of two microwave resonant chambers and sets of hollow metal tubes, after a high-intensity electric field is generated by the microwave resonant chambers to generate a plasma, a high power and high density plasma generated by the highly-efficient coupling mechanism of the transformer coupled plasma is capable of greatly improving a gas conductance, each set of the hollow metal tubes is driven by each set of ferrite transformer magnetic cores to disperse power, which reduces an energy density of each of the hollow metal tubes and reduces occurrence of plasma entering a contraction mode from a diffusion mode, thereby further improving an operable gas flow rate.

Abstract: An electrical discharge machining apparatus comprises a carrier and an electrical discharge machining (EDM) unit. The carrier is provided with a jig comprising a carrier plate for carrying a to-be-machined object, and the to-be-machined object is defined with a machining target area. The electrical discharge machining (EDM) unit applies a discharge energy to the machining target area through a discharge electrode with a non-uniform electric field distribution, so that the electric field is concentrated on a traveling direction. The carrier plate has an adhesive layer capable of adhering and fixing the to-be-machined object, capable of avoiding jitter of the to-be-machined object during an electrical discharge machining procedure, and capable of avoiding burrs before an end of the electrical discharge machining procedure, and making the machining target area to be located above the carrier plate to be capable of preventing the jig from hindering the electrical discharge machining procedure.

Abstract: An electrical discharge machining apparatus and an electrical discharge machining method with adjustable machining parameters comprise a carrier and an electrical discharge machining (EDM) unit. The carrier is used for placing a to-be-machined object defined with a machining target area. A discharge electrode of the electrical discharge machining (EDM) unit is used to cut the machining target area of the to-be-machined object along a first cutting direction with at least one machining parameter, the machining parameter is correspondingly adjusted when a specified parameter of the to-be-machined object changes to a first numerical value, thereby using the adjusted machining parameter to perform a second cutting step on the machining target area of the to-be-machined object. A segmented cutting technology for solving a problem that a cutting speed (mm2/min) is slowed down and a total cutting time is prolonged due to changes of the specified parameter of electrical discharge machining cutting.

Abstract: A non-contact processing device and a non-contact processing method are used to perform a processing procedure on a solid structure. The non-contact processing device of the invention uses an electromagnetic radiation source to provide energy to the solid structure to cause qualitative changes or defects in the solid structure, that is, to form a modified layer. A separation energy source is used to apply a separation energy on the solid structure with the modified layer in a non-contact manner. With stress, structural strength, lattice pattern or hardness of the modified layer being different from that of other non-processing areas, the solid structure can be rapidly separated or thinned at the modified layer.

Abstract: Disclosed is an annealing system integrated with laser and microwave. The annealing system is provided with a microwave system, a laser system, and a measurement and control system. The microwave system provides a microwave energy to a first area of a to-be-annealed object for annealing the first area of the to-be-annealed object. The laser system uses a laser to provide a laser energy to a second area of the to-be-annealed object for annealing the second area of the to-be-annealed object. The measurement and control system monitors and controls a power of a microwave and/or a laser. The annealing system is capable of reducing a time required for an overall annealing, and also capable of avoiding cracks or defects caused by large stress differences.

Abstract: A processing device and a processing method for a solid structure are used to perform a processing procedure on the solid structure. The processing device for the solid structure of the invention provides energy to the solid structure by various electromagnetic radiation sources to cause the solid structure to generate qualitative changes or defects, that is, to form a modified layer. Stress and/or hardness of the modified layer are/is different from that of other non-processed areas.

Abstract: A sealing disc for vacuum closure suitable for using in reciprocating movement to an open position or a closed position to open or seal a valve port of an all-metal valve is disclosed. A sealing plate of the sealing disc is formed with a first sealing surface. When the sealing disc is in the closed position, the first sealing surface directly abuts against the valve port of the all-metal vacuum valve. A vacuum sealability can be improved and a service lifetime can be prolonged through compensating movement and adjusting movement between two metallic sealing surfaces abutting each other.

Abstract: A method of forming graphene flower is provided, which includes introducing a hydrocarbon gas and an assistance gas into transformer-coupled plasma equipment, and providing a medium-frequency electromagnetic wave to the hydrocarbon gas and the assistance gas by the transformer-coupled plasma equipment to dissociate the hydrocarbon gas, and the dissociated hydrocarbon gas is re-combined to form the graphene flower, wherein the hydrocarbon gas is dissociated at a ratio of greater than 95%.

Abstract: A method of forming graphene flower is provided, which includes introducing a hydrocarbon gas and an assistance gas into transformer-coupled plasma equipment, and providing a medium-frequency electromagnetic wave to the hydrocarbon gas and the assistance gas by the transformer-coupled plasma equipment to dissociate the hydrocarbon gas, and the dissociated hydrocarbon gas is re-combined to form the graphene flower, wherein the hydrocarbon gas is dissociated at a ratio of greater than 95%.

Abstract: A method of forming graphene flower is provided, which includes introducing a hydrocarbon gas and an assistance gas into transformer-coupled plasma equipment, and providing a medium-frequency electromagnetic wave to the hydrocarbon gas and the assistance gas by the transformer-coupled plasma equipment to dissociate the hydrocarbon gas, and the dissociated hydrocarbon gas is re-combined to form the graphene flower, wherein the hydrocarbon gas is dissociated at a ratio of greater than 95%.

Abstract: Disclosed is an apparatus for manufacturing graphene sheets. The apparatus includes a gas tube, and a hydrocarbon gas source connected to a front part of the gas tube for providing a hydrocarbon gas through the gas tube. The apparatus also includes a microwave generator to generate a microwave passing a middle part of the gas tube through a waveguide tube to form a microwave plasma torch from the hydrocarbon gas, wherein the hydrocarbon gas is cracked by the microwave plasma torch to form graphene sheets. The apparatus includes a tube collector connected to a back part of the gas tube for collecting the graphene sheets.

Abstract: A circuit board and a method for manufacturing the same are disclosed. The circuit board of the present invention comprises: a carrier board, wherein a first circuit layer is disposed on at least one surface of the carrier board, and the first circuit layer comprises plural conductive pads; a protein dielectric layer disposed on the surface of the carrier board and the first circuit layer, wherein the protein dielectric layer has plural openings to expose the conductive pads; and a second circuit layer disposed on a surface of the protein dielectric layer, wherein the second circuit layer comprises plural first conductive vias, and each first conductive via is correspondingly formed in the opening and electrically connects to the conductive pad.

Abstract: The present invention relates to a Schottky diode with a diamond rod, which comprises: a substrate with a gate layer formed thereon; a patterned insulating layer disposed on the gate layer, wherein the patterned insulating layer comprises a first contact region and a second contact region; a diamond rod disposed on the patterned insulating layer, wherein a first end of the diamond rod connects to the first contact region, and a second end of the diamond rod connects to the second contact region; a first electrode corresponding to the first contact region of the patterned insulating layer, and covering the first end of the diamond rod; and a second electrode corresponding to the second contact region of the patterned insulating layer, and covering the second end of the diamond rod, and a method for manufacturing the same.