Patents by Inventor Chye Eng Soh

Chye Eng Soh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for decapping integrated circuit packages
    Patent number: 6917011
    Abstract: The invention relates to a method and apparatus for decapping integrated circuit packages. The invention involves irradiating an IC package with laser radiation, typically in the UV-IR spectra and of short pulse duration. The irradiation results in ablation of the molding compound. The invention also provides real-time monitoring and process control of the decapping process and fluid-flow removal of ablation debris. Using the invention, decapping can be performed without causing damage to the internal IC structure. Furthermore, decapping in a liquid can prevent oxidization of the molding compound by ambient air.
    Type: Grant
    Filed: July 10, 2002
    Date of Patent: July 12, 2005
    Assignee: Advanced Micro Devices PTE Ltd.
    Inventors: Ming Hui Hong, Yong Feng Lu, Wen Dong Song, Zhihong Mai, Kok Tong Thiam, Chye Eng Soh
  • Method and apparatus for decapping integrated circuit packages
    Publication number: 20030010761
    Abstract: The invention relates to a method and apparatus for decapping integrated circuit packages. The invention involves irradiating an IC package with laser radiation, typically in the UV-IR spectra and of short pulse duration. The irradiation results in ablation of the molding compound. The invention also provides real-time monitoring and process control of the decapping process and fluid-flow removal of ablation debris. Using the invention, decapping can be performed without causing damage to the internal IC structure. Furthermore, decapping in a liquid can prevent oxidisation of the molding compound by ambient air.
    Type: Application
    Filed: July 10, 2002
    Publication date: January 16, 2003
    Inventors: Ming Hui Hong, Yong Feng Lu, Wen Dong Song, Zhihong Mai, Kok Tong Thiam, Chye Eng Soh