Patents by Inventor Ci-moo Shong

Ci-moo Shong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6835594
    Abstract: A metal wiring method for an undercut in a MEMS packaging process includes disposing a MEMS element on a silicon substrate, welding a glass wafer to an upper portion of the silicon substrate having the MEMS element disposed thereon, the glass wafer having a hole formed therein for connecting a metal wiring, depositing a thin metal film for the metal wiring in the hole, and ion-mealing the deposited thin metal film. By the ion-mealing, the method is capable of connecting a metal wiring to a via hole having an undercut.
    Type: Grant
    Filed: October 17, 2003
    Date of Patent: December 28, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ci-moo Shong, Seok-jin Kang, Seok-whan Chung, Moon-chul Lee, Kyu-dong Jung, Jong-seok Kim, Chan-bong Jun, Seog-woo Hong, Jung-ho Kang
  • Publication number: 20040203186
    Abstract: A metal wiring method for an undercut in a MEMS packaging process includes disposing a MEMS element on a silicon substrate, welding a glass wafer to an upper portion of the silicon substrate having the MEMS element disposed thereon, the glass wafer having a hole formed therein for connecting a metal wiring, depositing a thin metal film for the metal wiring in the hole, and ion-mealing the deposited thin metal film. By the ion-mealing, the method is capable of connecting a metal wiring to a via hole having an undercut.
    Type: Application
    Filed: October 17, 2003
    Publication date: October 14, 2004
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ci-moo Shong, Seok-jin Kang, Seok-whan Chung, Moon-chul Lee, Kyu-dong Jung, Jong-seok Kim, Chan-bong Jun, Seog-woo Hong, Jung-ho Kang