Abstract: The invention provides an electrochemical discharge-assisted micro-grinding device for micro-components of brittle and hard materials. The device includes a micro-grinding tool, grinding fluid, a workpiece, an auxiliary electrode, a processing groove, and a pulsed DC power supply; the processing groove is filled with grinding fluid; the micro-grinding tool, the workpiece, and the auxiliary electrode are immersed in the grinding fluid; the micro-grinding tool is composed of a conductive grinding tool base, an electroplating layer, and insulated superabrasives. The micro-grinding tool is connected to the negative electrode of the pulsed DC power supply; the grinding fluid is composed of H2O2, Na2CO3, EDTA-Fe-Na, and deionized water; the workpiece material is brittle and hard; a large number of micro structures need to be produced on the surface of the workpiece.

Abstract: A jet polishing device capable of stably forming a Gaussian removal function includes: an auxiliary mounting mechanism; a jet machining mechanism. The jet machining mechanism is connected with the auxiliary mounting mechanism, the jet machining mechanism includes a rotation driving assembly, a positioning assembly and a jet machining assembly, the positioning assembly includes a linear guide rail, a slide mass, a first laser and a second laser, the rotation driving assembly is connected with the linear guide rail, the slide mass is slidably connected to the linear guide rail, the first laser is fixedly arranged relative to the linear guide rail, the jet machining assembly includes a mounting bracket fixedly connected with the slide mass, a nozzle mounting body rotatably connected to the mounting bracket and a nozzle arranged on the nozzle mounting body, and the second laser is connected with the nozzle mounting body.

Abstract: The present disclosure provides a system and method for controlling a dynamically controllable ultrawide-amplitude and high-response ion source, including: resolving dwell time of ion beam machining during iterative machining; selecting an appropriate velocity V of a movable shaft of a machine tool according to a calculation result of the dwell time; and dynamically calculating process parameters of an ion source according to an initial surface error of an optical component and the velocity V of the movable shaft, and generating a corresponding numerical control (NC) program to machine the optical component. The present disclosure can control the removal function of the ion beam polishing in real time, improve the precision and efficiency of the ion beam polishing, and further reduce the requirement on a movement system of the machine tool and the depth of a damaged layer.

Abstract: The present disclosure provides a system and method for controlling a dynamically controllable ultrawide-amplitude and high-response ion source, including: resolving dwell time of ion beam machining during iterative machining; selecting an appropriate velocity V of a movable shaft of a machine tool according to a calculation result of the dwell time; and dynamically calculating process parameters of an ion source according to an initial surface error of an optical component and the velocity V of the movable shaft, and generating a corresponding numerical control (NC) program to machine the optical component. The present disclosure can control the removal function of the ion beam polishing in real time, improve the precision and efficiency of the ion beam polishing, and further reduce the requirement on a movement system of the machine tool and the depth of a damaged layer.