Abstract: A melt adhesive containing 20 to 90 wt % of at least one polyamide having a molecular weight (Mw) from 10,000 to 250,000 g/mol; 1 to 25 wt % of at least one organic or inorganic salt; 0 to 60 wt % of further additives, wherein the adhesive has a softening point from 100° C. to 220° C. Additionally described is a process for reversible adhesive bonding of substrates, wherein the adhesive bond is released under tension after application of an electrical voltage.

Abstract: Silver-plated copper particles in which any exposed copper not plated with silver are coated with a polymer or with a chelating compound capable of preventing oxidation of the exposed copper. A method for preventing oxidation of any exposed copper on silver-plated copper particles and for improving the conductivity of silver-plated copper particles comprises coating a polymer or a copper-chelating compound onto the exposed copper on the silver-plated copper particles.

Abstract: Provided is a complex of hydrogen peroxide and at least one compound represented by Formula I: wherein X is: —C(R3)3, —C?C(R3), —O(R3), —N(R3)2, or —S(R3); and R1, R2, and R3 are each independently selected from H, alkyl, alkenyl, alkynyl, aralkyl, aryl, heteroaryl heteroarylalkyl, heterocyclyl, and cycloalkyl, or R2 and an R3 are optionally taken together to form an alicyclic ring. Also provided are anaerobic cure systems and curable compositions employing the complexes described herein.

Abstract: The present invention relates to one-part cationically curable compositions with storage stability, wherein cure is independent of external stimuli such as heat and UV irradiation. In particular, the present invention provides for compositions with a long shelf life that will cure only upon application of the composition to the target surface, i.e. the surface is involved in initiating cure of the cationically curable component. Suitable compositions comprise those for curing on a surface comprising carbon-halogen covalent bonds comprising a cationically curable component and a non-halide silver salt. The present invention also relates to a primer capable of promoting cure of cationically curable non-halide silver salt compositions.

Abstract: Provided is a complex of hydrogen peroxide and at least one compound represented by Formula I: wherein X is: —C(R3)3, —C?C(R3), —O(R3), —N(R3)2, or —S(R3); and R1, R2, and R3 are each independently selected from H, alkyl, alkenyl, alkynyl, aralkyl, aryl, heteroaryl heteroarylalkyl, heterocyclyl, and cycloalkyl, or R2 and an R3 are optionally taken together to form an alicyclic ring. Also provided are anaerobic cure systems and curable compositions employing the complexes described herein.

Abstract: The present invention provides a variety of interrelated methods of coating non-random and ordered arrays of particles, as well as films containing such arrays. The present invention also relates to the coated non-random and ordered arrays of particles and films prepared therefrom. The coated non-random and ordered arrays are obtained by the use of ferrofluid compositions which may be curable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between conductors.

Abstract: Calixarene and oxacalixarene derivatives of the formula IV: ##STR1## wherein m'+m"=0-8n=0-8m'.gtoreq.1/2(m'+m")3.ltoreq.m'+m"+n.ltoreq.8if n=0, m'+m".gtoreq.4R.sup.3 is H, halogen, or hydrocarbyl, aryl, hydrocarbylaryl or a substituted derivative thereof and R.sup.3 may be the same or different on each aryl group;R.sup.15 is H or hydrocarbyl, aryl, hydrocarbylaryl or a substituted derivative thereof;X is selected from ##STR2## wherein R.sup.7 and R.sup.8 which may be the same or different are H or hydrocarbyl (including a cycloaliphatic ring formed by R.sup.7 and R.sup.8 together), aryl, hydrocarbylaryl or a substituted derivative thereof; R.sup.9 is --OH, --NH.sub.2, --NHC(O)NH.sub.2 or --NHAr, wherein Ar is aryl or a substituted derivative thereof,n' is 0 or 1.Use of the compounds for sequestration of metals is also described.