Patents by Inventor Cillian Burke

Cillian Burke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS SWITCH FOR RF APPLICATIONS
    Publication number: 20240087828
    Abstract: Microelectromechanical systems (MEMS) switches are disclosed. Parallel configurations of back-to-back MEMS switches are disclosed in some embodiments. An isolation connection of constant electrical potential may be made to a midpoint of the back-to-back switches. In some embodiments, a separate MEMS switch is provided as a shunt switch for the main MEMS switch. MEMS switch device configurations having multiple switchable signal paths each coupling a common input electrode to a respective output electrode are also disclosed. The MEMS switch device includes shunt switches each coupling a respective output electrode to a reference potential. The presence of a shunt switch coupled to an output electrode enhances the isolation of the signal path corresponding to that output electrode when the path is open.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Applicant: Analog Devices International Unlimited Company
    Inventors: Padraig Fitzgerald, Philip James Brennan, Jiawen Bai, Michael James Twohig, Bernard Patrick Stenson, Raymond C. Goggin, Mark Schirmer, Paul Lambkin, Donal P. McAuliffe, David Aherne, Cillian Burke, James Lee Lampen, Sumit Majumder
  • Mounting structures for integrated device packages
    Patent number: 11127716
    Abstract: An integrated device package is disclosed. The package can include a carrier and an integrated device die having a front side and a back side. A mounting structure can serve to mount the back side of the integrated device die to the carrier. The mounting structure can comprise a first layer over the carrier and a second element between the back side of the integrated device die and the first layer. The first layer can comprise a first insulating material that adheres to the carrier, and the second element can comprise a second insulating material.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: September 21, 2021
    Assignee: Analog Devices International Unlimited Company
    Inventors: Rigan McGeehan, Cillian Burke, Alan J. O'Donnell
  • MOUNTING STRUCTURES FOR INTEGRATED DEVICE PACKAGES
    Publication number: 20190319011
    Abstract: An integrated device package is disclosed. The package can include a carrier and an integrated device die having a front side and a back side. A mounting structure can serve to mount the back side of the integrated device die to the carrier. The mounting structure can comprise a first layer over the carrier and a second element between the back side of the integrated device die and the first layer. The first layer can comprise a first insulating material that adheres to the carrier, and the second element can comprise a second insulating material.
    Type: Application
    Filed: March 27, 2019
    Publication date: October 17, 2019
    Inventors: Rigan McGeehan, Cillian Burke, Alan J. O'Donnell