Abstract: One example device includes a first housing portion defining a first coupling surface; a second housing portion defining a second coupling surface, the first housing portion coupled to the second housing portion to form a housing, the first housing portion and the second housing portion defining an opening, the opening intersecting the first coupling surface and the second coupling surface; a first gasket positioned between the first coupling surface and the second coupling surface, the first gasket providing a first seal between the first housing portion and the second housing portion, a printed circuit board (“PCB”) disposed within the housing and coupled to at least one of the first or second housing portions; an electrical connector electrically coupled to the printed circuit board and positioned within the opening; and a second gasket positioned between the electrical connector and the housing, the second gasket providing a second seal between the electrical connector and the housing, wherein the first g

Abstract: Embodiments relate to an implantable device. Specifically, a device includes a flexible connection component that includes a set of conductive filaments that connect a set of electrodes (or traces connected to the electrodes) and circuitry that receives and/or transmits electronic signals from and/or to the electrodes.

Abstract: The present disclosure relates to implantable neuromodulation devices and methods of fabrication, and in particular to a separable high density connectors for implantable neuromodulation devices. Particularly, aspects of the present disclosure are directed to a medical device comprising an electronics module and a header for connecting the electronics module to a lead assembly. The header includes: a housing that includes (i) a cavity having a central axis or plane and an internal surface, and (ii) an opening aligned with the central axis or plane of the cavity, an array of retractable contacts extending from the internal surface towards the central axis or plane of the cavity, and an array of connection terminals on the housing, where each connection terminal of the array of connection terminals is: (i) electrically connected to the electronics module, and (ii) electrically connectable to a retractable contact of the array of retractable contacts.

Abstract: A test fixture (20) for testing continuity in at least one electrode of a neuromodulation device. The test fixture may comprise a substrate (22), at least one electrically conductive pad (24a) disposed on the substrate for reducing pressure applied to the at least one electrode when the electrically conductive pad makes contact with an exposed surface of the electrode, and a wire (26a) extending from the at least one electrically conductive pad. The pad may be formed of a non-abrasive material, such as conductive foam or smooth metal. The substrate may be a probe formed with a number of slots for holding pads and routing wires, a mandrel with openings for holding pads and routing wires, and a flexible circuit with exposed smooth metal surfaces. The test fixture may be suitable for testing cuff-like and paddle-like devices.

Abstract: The present disclosure relates to implantable neuromodulation devices and methods of fabrication, and in particular to a separable high density connectors for implantable neuromodulation devices. Particularly, aspects of the present disclosure are directed to a medical device comprising an electronics module and a header for connecting the electronics module to a lead assembly. The header includes: a housing that includes (i) a cavity having a central axis or plane and an internal surface, and (ii) an opening aligned with the central axis or plane of the cavity, an array of retractable contacts extending from the internal surface towards the central axis or plane of the cavity, and an array of connection terminals on the housing, where each connection terminal of the array of connection terminals is: (i) electrically connected to the electronics module, and (ii) electrically connectable to a retractable contact of the array of retractable contacts.

Abstract: A implantable neural electrode assembly is described. The implantable neural electrode assembly includes a plurality of open-ended rings alternatingly connected to a spine. An inner layer of the open-ended rings is formed from a drug-loaded material (e.g., silicone that has been loaded with a steroid) and an outer layer is formed from a drug-free material. One or more electrode assemblies are connected to the inner layer and oriented towards a center of a cylinder defined by the plurality of open-ended rings.

Abstract: A neural delivery device for delivery a neural interface device into an abdominal cavity for implantation within a patient, wherein the neural delivery device is configured to be inserted through a sealed port of an insertion tube, and wherein the neural delivery device comprises an opening at a distal end of the neural delivery device for the neural interface device.

Abstract: An implantable neural interface system comprising: at least one electrode; a spine providing a passage for electrical conductors connectable to a pulse generator and the at least one electrode; at least one arm extending from the spine, wherein the electrode is positioned on the arm; and a strain relief feature configured to reduce strain in relative movement of portions of neural interface system to accommodate a curvature in an axis of a target on or in which the neural interface is provided.

Abstract: In embodiments a neural interface comprising at least one C-ring portion can be used to apply a pressure in a range of 0 mmHg to 30 mmHg to a target tissue arranged within the C-ring portion and comprising at least one electrode arranged on the at least one C-ring portion.

Abstract: The present disclosure relates to implantable neuromodulation devices and methods of fabrication, and in particular to a separable high density connectors for implantable neuromodulation devices. Particularly, aspects of the present disclosure are directed to a medical device comprising an electronics module and a header for connecting the electronics module to a lead assembly. The header includes: a housing that includes (i) a cavity having a central axis or plane and an internal surface, and (ii) an opening aligned with the central axis or plane of the cavity, an array of retractable contacts extending from the internal surface towards the central axis or plane of the cavity, and an array of connection terminals on the housing, where each connection terminal of the array of connection terminals is: (i) electrically connected to the electronics module, and (ii) electrically connectable to a retractable contact of the array of retractable contacts.

Abstract: A method for use in making an electrode assembly (20) comprises the steps of applying an electrode (24) on a first layer of material (22); laser welding a lead (23) to the electrode; applying an adhesive backfill (26) over the electrode and the lead; and applying a second layer of material (28) over the adhesive backfill and a portion of the first layer to prevent a leakage path between the electrode and the second layer.

Abstract: One example device includes a first housing portion defining a first coupling surface; a second housing portion defining a second coupling surface, the first housing portion coupled to the second housing portion to form a housing, the first housing portion and the second housing portion defining an opening, the opening intersecting the first coupling surface and the second coupling surface; a first gasket positioned between the first coupling surface and the second coupling surface, the first gasket providing a first seal between the first housing portion and the second housing portion, a printed circuit board (“PCB”) disposed within the housing and coupled to at least one of the first or second housing portions; an electrical connector electrically coupled to the printed circuit board and positioned within the opening; and a second gasket positioned between the electrical connector and the housing, the second gasket providing a second seal between the electrical connector and the housing, wherein the first g

Abstract: A test fixture (20) for testing continuity in at least one electrode of a neuromodulation device. The test fixture may comprise a substrate (22), at least one electrically conductive pad (24a) disposed on the substrate for reducing pressure applied to the at least one electrode when the electrically conductive pad makes contact with an exposed surface of the electrode, and a wire (26a) extending from the at least one electrically conductive pad. The pad may be formed of a non-abrasive material, such as conductive foam or smooth metal. The substrate may be a probe formed with a number of slots for holding pads and routing wires, a mandrel with openings for holding pads and routing wires, and a flexible circuit with exposed smooth metal surfaces. The test fixture may be suitable for testing cuff-like and paddle-like devices.

Abstract: The present disclosure relates to thin-film lead assemblies and neural interfaces, and methods of microfabricating thin-film lead assemblies and neural interfaces. Particularly, aspects of the present disclosure are directed to a thin-film neural interface that includes a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, one or more of conductive traces formed on a portion of the supporting structure, one or more electrodes formed on the front side of the supporting structure in electrical connection with the one or more conductive traces, and a backing formed on the back side of the supporting structure. The supporting structure comprises one or more features to facilitate mechanical adhesion between the supporting structure and the backing.

Abstract: Embodiments relate to an implantable device. Specifically, a device includes a flexible connection component that includes a set of conductive filaments that connect a set of electrodes (or traces connected to the electrodes) and circuitry that receives and/or transmits electronic signals from and/or to the electrodes.

Abstract: The present disclosure relates to a method for installing a cuff around a target biological structure. The method may include inserting a guidewire through an incision in a patient underneath an exterior surface of a target biological structure, guiding a ramp device over the guidewire to a position underneath the target biological structure such that the target biological structure is partly supported by the ramp device, guiding a cuff deployment tool over the guidewire to the ramp device, the cuff deployment tool comprising an interior volume and a cuff positioned within the interior volume, and causing the cuff from the cuff deployment tool to deploy such that the cuff moves from within the interior volume to an extended position. At least part of the cuff is positioned between the ramp device and the target biological structure in the extended position.