Patents by Inventor Cindy Chia-Wen Chiu

Cindy Chia-Wen Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Covered microchamber structures
    Patent number: 7514045
    Abstract: A microchamber structure (100) comprising a base layer (120), a lid layer (130), and at least one microchamber (140) having a cross-sectional shape with a depth (d) of less than 1000 microns and a width (w) of less than 1000 microns. The base layer (120) includes a depression (122) and the lid layer (104) includes a projection (132) positioned within the depression (122) to together define the cross-sectional shape of the microchamber (140).
    Type: Grant
    Filed: January 17, 2003
    Date of Patent: April 7, 2009
    Assignee: Avery Dennison Corporation
    Inventors: Craig S. Corcoran, Cindy Chia-Wen Chiu, William J. Jaecklein, Dong-Tsai Hseih, Eng-Pi Chang, Le-Hoa Hong, Zhisong Huang, Michael Lang, Ronald Sieloff, Philip Yi Zhi Chu
  • Sheet having microsized architecture
    Publication number: 20040126538
    Abstract: A sheet (20) for use in microfluidic, microelectronic, micromechanical, and/or microoptical applications requiring through-flow, through-conductivity, through-transmission, and/or other through patterns. The sheet (20) includes micro-sized architecture including at least one via (22) extending through the thickness of the layer of thermoplastic material. The via-defining walls in the thermoplastic layer are formed by the thermoplastic material flowing around a projection and then solidifying around the projection.
    Type: Application
    Filed: January 17, 2003
    Publication date: July 1, 2004
    Inventors: Craig S. Corcoran, William J. Jaecklein, Robert M. Pricone, W. Scott Thielman, Cindy Chia-Wen Chiu, David Hsein-Pin Chen
  • Anisotropically conductive film
    Publication number: 20030178221
    Abstract: An anisotropically conductive structure for providing electrical interconnection between electronic components, and the process for making such anisotropically conductive structure. The anisotropically conductive structure includes a dielectric matrix having a substantially uniform thickness; and a plurality of conductive elements embedded in the dielectric matrix.
    Type: Application
    Filed: February 20, 2003
    Publication date: September 25, 2003
    Inventors: Cindy Chia-Wen Chiu, Hsiao Ken Chuang
  • Covered microchamber structures
    Publication number: 20030180190
    Abstract: A microchamber structure (100) comprising a base layer (120), a lid layer (130), and at least one microchamber (140) having a cross-sectional shape with a depth (d) of less than 1000 microns and a width (w) of less than 1000 microns. The base layer (120) includes a depression (122) and the lid layer (104) includes a projection (132) positioned within the depression (122) to together define the cross-sectional shape of the microchamber (140).
    Type: Application
    Filed: January 17, 2003
    Publication date: September 25, 2003
    Inventors: Craig S. Corcoran, Cindy Chia-Wen Chiu, William J. Jaecklein, Dong-Tsai Hseih, Eng-Pi Chang, Le-Hoa Hong, Zhisong Huang, Michael Lang, Ronald Sieloff, Philip Yi Zhi Chu
  • Anisotropically conductive film
    Publication number: 20030155656
    Abstract: An anisotropically conductive structure for providing electrical interconnection between electronic components, and the process for making such anisotropically conductive structure. The anisotropically conductive structure includes a dielectric matrix having a substantially uniform thickness; an array of vias extending into or through the matrix; a plurality of conductive elements, wherein individual via contains at least one conductive element; a first adhesive layer adhered to the first major surface of the matrix; and optionally, a second adhesive layer adhered to the second major surface of the matrix.
    Type: Application
    Filed: January 17, 2003
    Publication date: August 21, 2003
    Inventors: Cindy Chia-Wen Chiu, David Hsein-Pin Chen, Philip Yi Zhi Chu, Hsiao Ken Chuang, H. Paul Barker