Patents by Inventor Cindy Colinge

Cindy Colinge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for bonding and debonding films using a high-temperature polymer
    Publication number: 20040102020
    Abstract: The invention relates to a semiconductor structure that is formed by delaminating a semiconductor substrate and by bonding the top section of the substrate to a transfer substrate. Delaminating is carried out by causing a polymer film to achieve greater adhesion that an embrittlement layer in the semiconductor substrate.
    Type: Application
    Filed: July 16, 2003
    Publication date: May 27, 2004
    Inventors: Brian Roberds, Cindy Colinge, Brian Doyle
  • Method for bonding and debonding films using a high-temperature polymer
    Patent number: 6638835
    Abstract: The invention relates to a semiconductor structure that is formed by delaminating a semiconductor substrate and by bonding the top section of the substrate to a transfer substrate. Delaminating is carried out by causing a polymer film to achieve greater adhesion that an embrittlement layer in the semiconductor substrate.
    Type: Grant
    Filed: December 11, 2001
    Date of Patent: October 28, 2003
    Assignee: Intel Corporation
    Inventors: Brian Roberds, Cindy Colinge, Brian Doyle
  • Method for bonding and debonding films using a high-temperature polymer
    Publication number: 20030170424
    Abstract: The invention relates to a semiconductor structure that is formed by delaminating a semiconductor substrate and by bonding the top section of the substrate to a transfer substrate. Delaminating is carried out by causing a polymer film to achieve greater adhesion that an embrittlement layer in the semiconductor substrate.
    Type: Application
    Filed: April 11, 2003
    Publication date: September 11, 2003
    Inventors: Brian Roberds, Cindy Colinge, Brian Doyle
  • Method for bonding and debonding films using a high-temperature polymer
    Publication number: 20030108715
    Abstract: The invention relates to a semiconductor structure that is formed by delaminating a semiconductor substrate and by bonding the top section of the substrate to a transfer substrate. Delaminating is carried out by causing a polymer film to achieve greater adhesion that an embrittlement layer in the semiconductor substrate.
    Type: Application
    Filed: December 11, 2001
    Publication date: June 12, 2003
    Applicant: Intel Corporation
    Inventors: Brian Roberds, Cindy Colinge, Brian Doyle