Abstract: To enhance the adhesion force between a lead frame and a molding compound of a surface mount semiconductor device, a lead frame having two opposite sides, with at least one tilt flap for locking a molding compound extending from one side and a reduced portion of the lead frame extending from the opposite side, and a surface mount semiconductor device having the same, are disclosed. The at least one tilt flap and the reduced portion are formed on the lead frame such that the adhesion force between the lead frame and the molding compound is enhanced.

Abstract: To provide a robust soldering process for a top finger of a surface mount device, a lead frame having a top finger and a semiconductor device having the same are disclosed, wherein the top finger comprises a groove and the groove is provided at the bottom surface of the top finger that establishes contact with a die and adjacent to the contact position between the top finger and die so as to prevent solder from overflowing onto a chip passivation ring, reducing the stress on the die and increasing the reliability.