Abstract: An example embodiment includes optoelectronic module. The optoelectronic module may include a lens assembly, a module board, heat-generating components, and a thermally conductive plate. The lens assembly may be secured to the module board. The module board may include a printed circuit board (PCB). The heat-generating components may be mounted to the PCB. The thermally conductive plate may be secured to a surface of the module board. The thermally conductive plate may define an opening that receives at least a portion of the lens assembly. The thermally conductive plate may be configured to absorb at least a portion of thermal energy generated during operation of the heat-generating components and to transfer the thermal energy away from the heat-generating components.

Abstract: An example embodiment includes optoelectronic module. The optoelectronic module may include a lens assembly, a module board, heat-generating components, and a thermally conductive plate. The lens assembly may be secured to the module board. The module board may include a printed circuit board (PCB). The heat-generating components may be mounted to the PCB. The thermally conductive plate may be secured to a surface of the module board. The thermally conductive plate may define an opening that receives at least a portion of the lens assembly. The thermally conductive plate may be configured to absorb at least a portion of thermal energy generated during operation of the heat-generating components and to transfer the thermal energy away from the heat-generating components.

Abstract: An example embodiment includes optoelectronic module. The optoelectronic module may include a lens assembly, a module board, heat-generating components, and a thermally conductive plate. The lens assembly may be secured to the module board. The module board may include a printed circuit board (PCB). The heat-generating components may be mounted to the PCB. The thermally conductive plate may be secured to a surface of the module board. The thermally conductive plate may define an opening that receives at least a portion of the lens assembly. The thermally conductive plate may be configured to absorb at least a portion of thermal energy generated during operation of the heat-generating components and to transfer the thermal energy away from the heat-generating components.

Abstract: An example embodiment includes a snap-mountable optoelectronic module. The module includes a frame, a cover, and a module latch. The frame includes two or more post blocks that each defines a module latch receiver. The cover is configured to at least partially enclose an inner assembly and includes a module latch recess. The module latch includes pivots and a latch portion. The pivots are received in the module latch receivers such that the module latch is configurable in an unlatched position and in a latched position. In the unlatched position, the latch portion is disengaged from the module latch recess. In the latched position, the latch portion is engaged with the module latch recess to retain the cover relative to the frame.

Abstract: An example embodiment includes a thermal management system for an active cable connector. The system includes a shell and a back plate. The shell defines a cavity and includes multiple heat-transfer areas on an internal shell surface. A first heat-transfer area is positioned with respect to a first heat-generating component to absorb a first portion of thermal energy generated by the first heat-generating component. The back plate is positioned with respect to the first heat-generating component to absorb a second portion of the thermal energy generated by the first heat-generating component. The back plate is further positioned proximate to a second heat-transfer area to transfer the second portion of the thermal energy to the shell.

Abstract: An example embodiment includes a snap-mountable optoelectronic module. The module includes a frame, a cover, and a module latch. The frame includes two or more post blocks that each defines a module latch receiver. The cover is configured to at least partially enclose an inner assembly and includes a module latch recess. The module latch includes pivots and a latch portion. The pivots are received in the module latch receivers such that the module latch is configurable in an unlatched position and in a latched position. In the unlatched position, the latch portion is disengaged from the module latch recess. In the latched position, the latch portion is engaged with the module latch recess to retain the cover relative to the frame.

Abstract: An example embodiment includes optoelectronic module. The optoelectronic module may include a lens assembly, a module board, heat-generating components, and a thermally conductive plate. The lens assembly may be secured to the module board. The module board may include a printed circuit board (PCB). The heat-generating components may be mounted to the PCB. The thermally conductive plate may be secured to a surface of the module board. The thermally conductive plate may define an opening that receives at least a portion of the lens assembly. The thermally conductive plate may be configured to absorb at least a portion of thermal energy generated during operation of the heat-generating components and to transfer the thermal energy away from the heat-generating components.

Abstract: An example embodiment includes a cable clip. The cable clip is configured to maintain engagement of an optical interface with a lens assembly included in an optoelectronic module. The cable clip includes a forward section, a clip body, a connector retention mechanism, a lens latch, and a release lever. The clip body is connected to the forward section at a clip shoulder. The connector retention mechanism is configured to retain the optical interface and extends from the clip body. The lens latch is positioned at a first end. The lens latch is configured to latch the lens assembly when a portion of the optical interface is received within the lens assembly. The release lever is connected to the forward section. The release lever is configured to unlatch the lens latch from the lens assembly in response to application of an actuation force above a particular threshold magnitude.

Abstract: An example embodiment includes a thermal management system for an active cable connector. The system includes a shell and a back plate. The shell defines a cavity and includes multiple heat-transfer areas on an internal shell surface. A first heat-transfer area is positioned with respect to a first heat-generating component to absorb a first portion of thermal energy generated by the first heat-generating component. The back plate is positioned with respect to the first heat-generating component to absorb a second portion of the thermal energy generated by the first heat-generating component. The back plate is further positioned proximate to a second heat-transfer area to transfer the second portion of the thermal energy to the shell.

Abstract: An example embodiment includes a cable clip. The cable clip is configured to maintain engagement of an optical interface with a lens assembly included in an optoelectronic module. The cable clip includes a forward section, a clip body, a connector retention mechanism, a lens latch, and a release lever. The clip body is connected to the forward section at a clip shoulder. The connector retention mechanism is configured to retain the optical interface and extends from the clip body. The lens latch is positioned at a first end. The lens latch is configured to latch the lens assembly when a portion of the optical interface is received within the lens assembly. The release lever is connected to the forward section. The release lever is configured to unlatch the lens latch from the lens assembly in response to application of an actuation force above a particular threshold magnitude.