Patents by Inventor Cindy Kuo

Cindy Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal pad structure over TSV to reduce shorting of upper metal layer
    Patent number: 9530690
    Abstract: Various embodiments of mechanisms for forming a slotted metal pad over a TSV in substrate are provided. The dielectric structures in the slotted metal pad reduce dishing effect during planarization of the slotted metal pad. As a result, the risk of having metal stringers in upper metal level(s) caused by the dishing effect is greatly reduced.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: December 27, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Chuan Tseng, Chia-Wei Liu, Cindy Kuo, Ren-Wei Xiao
  • Metal Pad Structure Over TSV to Reduce Shorting of Upper Metal Layer
    Publication number: 20160056078
    Abstract: Various embodiments of mechanisms for forming a slotted metal pad over a TSV in substrate are provided. The dielectric structures in the slotted metal pad reduce dishing effect during planarization of the slotted metal pad. As a result, the risk of having metal stringers in upper metal level(s) caused by the dishing effect is greatly reduced.
    Type: Application
    Filed: November 3, 2015
    Publication date: February 25, 2016
    Inventors: Chung-Chuan Tseng, Chia-Wei Liu, Cindy Kuo, Ren-Wei Xiao
  • Metal pad structure over TSV to reduce shorting of upper metal layer
    Patent number: 9177914
    Abstract: Various embodiments of mechanisms for forming a slotted metal pad over a TSV in substrate are provided. The dielectric structures in the slotted metal pad reduce dishing effect during planarization of the slotted metal pad. As a result, the risk of having metal stringers in upper metal level(s) caused by the dishing effect is greatly reduced.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: November 3, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Chuan Tseng, Chia-Wei Liu, Cindy Kuo, Ren-Wei Xiao
  • METAL PAD STRUCTURE OVER TSV TO REDUCE SHORTING OF UPPER METAL LAYER
    Publication number: 20140131841
    Abstract: Various embodiments of mechanisms for forming a slotted metal pad over a TSV in substrate are provided. The dielectric structures in the slotted metal pad reduce dishing effect during planarization of the slotted metal pad. As a result, the risk of having metal stringers in upper metal level(s) caused by the dishing effect is greatly reduced.
    Type: Application
    Filed: November 15, 2012
    Publication date: May 15, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Chuan Tseng, Chia-Wei Liu, Cindy Kuo, Ren-Wei Xiao