Patents by Inventor Cindy M. Reidsema

Cindy M. Reidsema has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5450290
    Abstract: The present invention provides an improved circuit board for mounting integrated circuit chips and a technique for manufacturing the circuit board. The board permits direct chip attachment to the circuit board by providing the necessary geometry for the footprint pattern of the chip connections without the necessity of multi-level packaging using chip carriers. The circuit board includes a substrate with plated through holes, and a film of photoresist dielectric material disposed on the substrate. The dielectric material is photo patterned to form vias which are then filled with conductive material. Electrical connection pads are formed on the exposed surface of the film of dielectric material in the pattern of the chip footprint to be mounted thereon.
    Type: Grant
    Filed: February 14, 1994
    Date of Patent: September 12, 1995
    Assignee: International Business Machines Corporation
    Inventors: Christina M. Boyko, Francis J. Bucek, Richard W. Carpenter, Voya R. Markovich, Darleen Mayo, Cindy M. Reidsema, Joseph G. Sabia
  • Patent number: 5230782
    Abstract: The total organic content (TOC) of an aqueous composition is reduced to 200 ppm or less by subjecting the composition to electrolysis whereby the pH of the composition at the start of the electrolysis is about 1.8 to about 7 to thereby electrolytically decompose organic materials contained in the aqueous composition.
    Type: Grant
    Filed: July 22, 1991
    Date of Patent: July 27, 1993
    Assignee: International Business Machines Corporation
    Inventors: Francis J. Downes, Jr., Oscar A. Moreno, Cindy M. Reidsema, Joseph E. Varsik