Patents by Inventor Cing He Chen

Cing He Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method to improve package and 3DIC yield in underfill process
    Patent number: 8945983
    Abstract: A method embodiment includes forming a packaging unit by attaching a die to a packaging substrate, applying plasma treatment to a first portion of the packaging substrate, wherein the first portion corresponds to a portion of the packaging substrate underneath the die, not applying plasma treatment to a second portion of the packaging substrate, wherein the second portion of the packaging substrate surrounds the first portion of the packaging substrate, and applying an underfill material over the first portion of the packaging substrate.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: February 3, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yen-Hsin Liu, Cing He Chen, Kewei Zuo, Chien Rhone Wang
  • System and Method to Improve Package and 3DIC Yield in Underfill Process
    Publication number: 20140183760
    Abstract: A method embodiment includes forming a packaging unit by attaching a die to a packaging substrate, applying plasma treatment to a first portion of the packaging substrate, wherein the first portion corresponds to a portion of the packaging substrate underneath the die, not applying plasma treatment to a second portion of the packaging substrate, wherein the second portion of the packaging substrate surrounds the first portion of the packaging substrate, and applying an underfill material over the first portion of the packaging substrate.
    Type: Application
    Filed: March 15, 2013
    Publication date: July 3, 2014
    Inventors: Yen-Hsin Liu, Cing He Chen, Kewei Zuo, Chien Rhone Wang