Abstract: Disclosed is a thermoplastic polyester elastomer, which is formed by reacting 100 parts by weight of polyester and 0.01 to 2 parts by weight of an epoxy resin with two epoxy groups, wherein the polyester is formed by reacting a parts by mole of a hard-segment diol, b parts by mole of a soft-segment diol, and 1 part by mole of a diacid, wherein 1?a?3 and 0.005?b?1.5.

Abstract: Disclosed is a thermoplastic polyester elastomer, which is formed by reacting 100 parts by weight of ester and 0.01 to 2 parts by weight of an epoxy resin with two epoxy groups, wherein the ester is formed by reacting a parts by mole of a hard-segment diol, b parts by mole of a soft-segment diol, and 1 part by mole of a diacid, wherein 1?a?3 and 0.005?b?1.5.

Abstract: A method for packaging a light emitting diode is provided. The steps comprise: providing a material; drying the material; feeding the material into a feeding inlet; and providing a mold with pre-embedded light diodes. The material enters the feeding inlet and is injected into the mold by pressing a screw, allowing the material to combine with the light emitting diode.

Abstract: The disclosed is a copolymer having a formula as: R1 is a combination of naphthalene, phenylene, butyl, and hexyl. R2 is a combination of ethylene, cyclohexlene, 2-methylpropyl, and neopentyl. n is a number of 1500 to 3000. The copolymer has a transparency greater than 80%, a thermal resistance greater than 100° C., a moisture absorption less than 0.5 wt %, and yellowing under UV/climate resistance greater than 1000 hours.

Abstract: The disclosed is a copolymer having a formula as: R1 is a combination of naphthalene, phenylene, butyl, and hexyl. R2 is a combination of ethylene, cyclohexlene, 2-methylpropyl, and neopentyl. n is a number of 1500 to 3000. The copolymer has a transparency greater than 80%, a thermal resistance greater than 100, a moisture absorption less than 0.5 wt %, and yellowing under UV/climate resistance greater than 1000 hours, such that the copolymer is adapted to be applied in packaging material for light emitting devices.

Abstract: A method for packaging a light emitting diode is provided. The steps comprise: providing a material; drying the material; feeding the material into a feeding inlet; and providing a mold with pre-embedded light diodes. The material enters the feeding inlet and is injected into the mold by pressing a screw, allowing the material to combine with the light emitting diode.

Abstract: The disclosed is a blend including 20 to 80 parts by weight of polycarbonate, 20 to 80 parts by weight of polyarylate, and 20 to 80 parts by weight of copolymer having a formula as below: wherein R1 is a combination of at least two of ethylene, cyclohexlene dimethylene, 2-methyl propyl, and neopentyl. R2 is a combination of at least two of naphthalene, phenylene, butyl, and hexyl. n is a number of 1500 to 3000. The blend has high transparency, high thermal resistance, and high yellowing resistance under UV/climate, such that the blend is suitable to be applied in packaging material for light emitting device.

Abstract: The disclosed is a copolymer having a formula as: R1 is a combination of naphthalene, phenylene, butyl, and hexyl. R2 is a combination of ethylene, cyclohexene, 2-methylpropyl, and neopentyl. n is a number of 1500 to 3000. The copolymer has a transparency greater than 80%, a thermal resistance greater than 100° C., a moisture absorption less than 0.5 wt %, and yellowing under UV/climate resistance greater than 1000 hours, such that the copolymer is adapted to be applied in packaging material for light emitting devices.