Patents by Inventor Ciprian Marcoci
Ciprian Marcoci has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140259643Abstract: A method of manufacturing a substrate includes providing a substrate with a cavity and a post in the cavity, dispensing an elastic filling material in the cavity, inserting a magnetic core including a core hole such the post extends through the core hole, curing the elastic filling material, forming holes in the substrate outside of the cavity and in the post, and forming via-in-via structures in the holes.Type: ApplicationFiled: March 15, 2013Publication date: September 18, 2014Applicant: MULTI-FINELINE ELECTRONIX, INC.Inventor: Ciprian Marcoci
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Publication number: 20100146782Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: ApplicationFiled: February 23, 2010Publication date: June 17, 2010Applicant: MULTI-FINELINE ELECTRONIX, INC.Inventors: Ronald W. Whittaker, Joe D. Guerra, Ciprian Marcoci
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Publication number: 20100127814Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: ApplicationFiled: December 16, 2009Publication date: May 27, 2010Applicant: Multi-Fineline Electronix, Inc.Inventors: Ronald W. Whittaker, Joe D. Guerra, Ciprian Marcoci
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Patent number: 7690110Abstract: A method for making plural plated through holes in a single circuit board via is provided. The method includes plating copper in the walls of said circuit board via to form a first plated through hole and applying a thin layer of first adhesive promotor to the surface of said plated via. The method further includes vacuum depositing an organic layer having a high dielectric strength unto said layer of first adhesive promoter and applying a second layer of adhesive promoter over said organic layer. The method even further includes plating copper over said second layer of adhesive promoter to form a second plated through hole in said circuit board via.Type: GrantFiled: August 24, 2007Date of Patent: April 6, 2010Assignee: Multi-Fineline Electronix, Inc.Inventors: Ronald W. Whittaker, Joe D Guerra, Ciprian Marcoci
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Patent number: 7656263Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: GrantFiled: September 18, 2008Date of Patent: February 2, 2010Assignee: Multi-Fineline Electronix, Inc.Inventors: Ronald W. Whittaker, Joe D. Guerra, Ciprian Marcoci
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Patent number: 7602272Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: GrantFiled: August 24, 2007Date of Patent: October 13, 2009Assignee: Multi-Fineline Electronix, Inc.Inventors: Ronald W. Whittaker, Joe D Guerra, Ciprian Marcoci
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Publication number: 20090015364Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: ApplicationFiled: September 18, 2008Publication date: January 15, 2009Inventors: Ronald W. Whittaker, Joe D. Guerra, Ciprian Marcoci
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Patent number: 7436282Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: GrantFiled: July 6, 2007Date of Patent: October 14, 2008Assignee: Multi-Fineline Electronix, Inc.Inventors: Ronald W. Whittaker, Joe D. Guerra, Ciprian Marcoci
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Publication number: 20080017404Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: ApplicationFiled: August 24, 2007Publication date: January 24, 2008Inventors: Ronald Whittaker, Joe Guerra, Ciprian Marcoci
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Publication number: 20070294888Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: ApplicationFiled: August 24, 2007Publication date: December 27, 2007Inventors: Ronald Whittaker, Joe Guerra, Ciprian Marcoci
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Publication number: 20070290783Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: ApplicationFiled: July 6, 2007Publication date: December 20, 2007Applicant: Multi-Fineline Electronix, Inc.Inventors: Ronald Whittaker, Joe Guerra, Ciprian Marcoci
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Patent number: 7271697Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: GrantFiled: December 7, 2005Date of Patent: September 18, 2007Assignee: Multi-Fineline ElectronixInventors: Ronald W. Whittaker, Joe D Guerra, Ciprian Marcoci
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Publication number: 20060152322Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: ApplicationFiled: December 7, 2005Publication date: July 13, 2006Inventors: Ronald Whittaker, Joe Guerra, Ciprian Marcoci