Patents by Inventor CJ Hwang

CJ Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Finger metal-insulator-metal capacitor device with local interconnect
    Publication number: 20040084707
    Abstract: The present invention includes a method of constructing a novel capacitor and geometry for the capacitor. The method and device include forming a multilayer structure having what generally can be described as a wave shape. Particular aspects of the present invention are described in the claims, specification and drawings.
    Type: Application
    Filed: October 28, 2003
    Publication date: May 6, 2004
    Applicant: Macronix International Co., Ltd.
    Inventors: Lenvis Liu, CJ Hwang
  • Finger metal-insulator-metal capacitor with local interconnect
    Publication number: 20030155603
    Abstract: The present invention includes a method of constructing a novel capacitor and geometry for the capacitor. The method and device include forming a multilayer structure having what generally can be described as a wave shape. Particular aspects of the present invention are described in the claims, specification and drawings.
    Type: Application
    Filed: February 15, 2002
    Publication date: August 21, 2003
    Inventors: Lenvis Liu, CJ Hwang