Patents by Inventor CK Chin

CK Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mold Compound Dispensing System and Method
    Publication number: 20230173720
    Abstract: A molding compound dispensing system identifies a semiconductor device strip having a substrate with a plurality of segments allocated for die stacks. The system obtains topological data of the identified semiconductor device strip for each of the segments, including data indicative of any semiconductor components in each respective segment. The system determines an amount of molding compound to be applied to each of the segments based on the topological data for each respective segment, and causes a molding compound dispenser to dispense the determined amounts of molding compound at each of the segments.
    Type: Application
    Filed: December 2, 2021
    Publication date: June 8, 2023
    Applicant: Western Digital Technologies, Inc.
    Inventors: Xianlu Cui, Junrong Yan, CK Chin, Tao Shi