Patents by Inventor Claes Bjorkman
Claes Bjorkman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20040013338Abstract: An article of manufacture comprising an optical ready substrate made of a first semiconductor layer, an insulating layer on top of the first semiconductor layer, and a second semiconductor layer on top of the insulating layer, wherein the second semiconductor layer has a top surface and is laterally divided into two regions including a first region and a second region, the top surface of the first region being of a quality that is sufficient to permit microelectronic circuitry to be formed therein and the second region including an optical signal distribution circuit formed therein, the optical signal distribution circuit made up of interconnected semiconductor photonic elements and designed to provide signals to the microelectronic circuit to be fabricated in the first region of the second semiconductor layer.Type: ApplicationFiled: October 25, 2002Publication date: January 22, 2004Applicant: Applied Materials, Inc.Inventors: Claes Bjorkman, Lawrence C. West, Dan Maydan, Samuel Broydo
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Publication number: 20030192644Abstract: Apparatus and method for inductively coupling electrical power to a plasma in a semiconductor process chamber. In a first aspect, an array of wedge-shaped induction coils are distributed around a circle. The sides of adjacent coils are parallel, thereby enhancing the radial uniformity of the magnetic field produced by the array. In a second aspect, electrostatic coupling between the induction coils and the plasma is minimized by connecting each induction coil to the power supply so that the turn of wire of the coil which is nearest to the plasma is near electrical ground potential. In one embodiment, the hot end of one coil is connected to the unbalanced output of an RF power supply, and the hot end of the other coil is connected to electrical ground through a capacitor which resonates with the latter coil at the frequency of the RF power supply.Type: ApplicationFiled: May 20, 2003Publication date: October 16, 2003Applicant: Applied Materials, Inc.Inventors: Bryan Y. Pu, Hongching Shan, Claes Bjorkman, Kenny Doan, Mike Welch, Richard Raymond Mett
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Patent number: 6598726Abstract: A banknote handling machine having an infeed part for receiving banknotes deposited by a customer from outside the machine and for identifying the customer, a detector unit for checking the validity of the deposited banknotes, a printing unit for printing information relating to the deposited banknotes and the customer, and a packaging unit for encasing and sealing banknotes suspected of being false in transparent packaging material. Transportation of suspect banknotes to the packaging and printing operations is controlled by a process unit such that customer information and information relating to the suspect banknotes is printed on an inner surface of the transparent packaging material, in mirror-image, in conjunction with operation of the packaging unit to encase and seal the suspect banknotes so that, upon completion, the printed information is properly readable from the outside of the package.Type: GrantFiled: March 29, 2001Date of Patent: July 29, 2003Assignee: Nybohov Development ABInventors: Leif Lundblad, Claes Bjorkman
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Publication number: 20030106646Abstract: Methods and apparatuses for reducing electrical arcing currents or electron emissions to a wafer or to components in a plasma chamber are provided. An insert for use in a process chamber having a wafer support is disclosed. The insert comprises a composite member formed of a first material, such as for example, silicon, and a second material, such as for example, SiO2, having a greater electrical impedance than the first material. The composite member has a surface which is adapted to be disposed adjacent to the wafer support, and which is made of the second material. In one aspect, the process chamber further has an outer member adapted to surround the wafer support. The composite member has a surface which is adapted to be disposed adjacent to the outer member and which is made of the second material. In another aspect, the composite member has a surface which is adapted to be disposed adjacent to a semiconductor wafer and which is made of the second material.Type: ApplicationFiled: March 21, 2002Publication date: June 12, 2003Applicant: Applied Materials, Inc.Inventors: Shawming Ma, Mahmoud Dahimene, Claes Bjorkman
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Patent number: 6568154Abstract: A banknote handling apparatus including a first unit for receiving banknotes deposited from outside the machine, a second unit for checking validity, quality and denomination of the deposited banknotes, and a third unit for bundling and packaging checked banknotes using a packaging device that has a roll carrying transparent packaging material for encasing banknotes in a closed package so that unnoticeable resealing of a banknote package that has been sealed in the apparatus and then broken open is difficult to achieve. A printing device is located above and close to the roll for printing information relating to the content of the banknote package with each bundling/encasing function in mirror image on an inner side of the transparent packaging material taken from the roll so that the content information is durably printed thereon and readable right-way-up from outside the closed package.Type: GrantFiled: April 16, 2001Date of Patent: May 27, 2003Assignee: Nybohov Development ABInventors: Leif Lundblad, Claes Björkman, Gösta Edin
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Patent number: 6568346Abstract: Apparatus and method for inductively coupling electrical power to a plasma in a semiconductor process chamber. In a first aspect, an array of wedge-shaped induction coils are distributed around a circle. The sides of adjacent coils are parallel, thereby enhancing the radial uniformity of the magnetic field produced by the array. In a second aspect, electrostatic coupling between the induction coils and the plasma is minimized by connecting each induction coil to the power supply so that the turn of wire of the coil which is nearest to the plasma is near electrical ground potential. In one embodiment, the hot end of one coil is connected to the unbalanced output of an RF power supply, and the hot end of the other coil is connected to electrical ground through a capacitor which resonates with the latter coil at the frequency of the RF power supply.Type: GrantFiled: August 14, 2001Date of Patent: May 27, 2003Assignee: Applied Materials Inc.Inventors: Bryan Y. Pu, Hongching Shan, Claes Bjorkman, Kenny Doan, Mike Welch, Richard Raymond Mett
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Patent number: 6553922Abstract: A safe for valuable documents having a shell protection around the safe for impeding attempts to force an entry thereinto and processor unit actuated in response to damage to the shell protection to initiate a safe protection function. The safe contains a plurality of units for accommodating documents, at least one of which includes a portable safe deposit box that, when placed in the safe, can be electrically connected thereto. The safe deposit box has a protective shell and a destructive device designed to effect local destruction of documents contained in the box. The destructive device operates automatically in response to damage to the protective shell when the safe deposit box is removed from the safe and an attempt is made to force the box open.Type: GrantFiled: May 23, 2001Date of Patent: April 29, 2003Assignee: Nybohov Development ABInventors: Leif Lundblad, Claes Björkman
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Publication number: 20030038111Abstract: A capacitively coupled reactor for plasma etch processing of substrates at subatmospheric pressures includes a chamber body defining a processing volume, a lid provided upon the chamber body, the lid being a first electrode, a substrate support provided in the processing volume and comprising a second electrode, a radio frequency source coupled at least to one of the first and second electrodes, a process gas inlet configured to deliver process gas into the processing volume, and an evacuation pump system having pumping capacity of at least 1600 liters/minute. The greater pumping capacity controls residency time of the process gases so as to regulate the degree of dissociation into more reactive species.Type: ApplicationFiled: September 24, 2002Publication date: February 27, 2003Applicant: Applied Materials, Inc.Inventors: James D. Carducci, Hamid Noorbakhsh, Evans Y. Lee, Bryan Y. Pu, Hongqing Shan, Claes Bjorkman, Siamak Salimian, Paul E. Luscher, Michael D. Welch
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Publication number: 20030037880Abstract: A capacitively coupled reactor for plasma etch processing of substrates at subatmospheric pressures includes a chamber body defining a processing volume, a lid provided upon the chamber body, the lid being a first electrode, a substrate support provided in the processing volume and comprising a second electrode, a radio frequency source coupled at least to one of the first and second electrodes, a process gas inlet configured to deliver process gas into the processing volume, and an evacuation pump system having pumping capacity of at least 1600 liters/minute. The greater pumping capacity controls residency time of the process gases so as to regulate the degree of dissociation into more reactive species.Type: ApplicationFiled: September 24, 2002Publication date: February 27, 2003Applicant: Applied Materials, Inc.Inventors: James D. Carducci, Hamid Noorbakhsh, Evans Y. Lee, Bryan Y. Pu, Hongching Shan, Claes Bjorkman, Siamak Salimian, Paul E. Luscher, Michael D. Welch
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Patent number: 6403491Abstract: A method for etching a dielectric in a thermally controlled plasma etch chamber with an expanded processing window. The method is adapted to incorporate benefits of a the thermal control and high evacuation capability of the chamber. Etchent gases include hydrocarbons, oxygen and inert gas. Explanation is provided for enablling the use of hexafluoro-1,3-butadiene in a capacitively coupled etch plasma. The method is very useful for creating via, self aligned contacts, dual damascene, and other dielectric etch.Type: GrantFiled: November 1, 2000Date of Patent: June 11, 2002Assignee: Applied Materials, Inc.Inventors: Jingbao Liu, Judy Wang, Takehiko Komatsu, Bryan Y Pu, Kenny L Doan, Claes Bjorkman, Melody Chang, Yunsang Kim, Hongching Shan, Ruiping Wang
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Patent number: 6387288Abstract: An apparatus and method for scavenging etchant species from a plasma formed of etchant gas prior to the etchant gas entering a primary processing chamber of a plasma reactor. There is at least one scavenging chamber, each of which is connected at an inlet thereof to an etchant gas source and at an outlet thereof to a gas distribution device of the primary processing chamber. Each scavenging chamber has a radiation applicator that irradiates the interior of the scavenging chamber and creates a plasma therein from etchant gas flowing through the chamber from the etchant gas source to the gas distribution apparatus of the primary processing chamber. The applicator uses either an inductive discharge, capacitive discharge, direct current (DC) discharge or microwave discharge to irradiate the interior of the scavenging chamber and ignite the plasma. An etchant species scavenging source is also disposed within the scavenging chamber.Type: GrantFiled: April 21, 2000Date of Patent: May 14, 2002Assignee: Applied Materials, Inc.Inventors: Claes Bjorkman, Hongching Shan, Michael Welch
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Publication number: 20010054383Abstract: Apparatus and method for inductively coupling electrical power to a plasma in a semiconductor process chamber. In a first aspect, an array of wedge-shaped induction coils are distributed around a circle. The sides of adjacent coils are parallel, thereby enhancing the radial uniformity of the magnetic field produced by the array. In a second aspect, electrostatic coupling between the induction coils and the plasma is minimized by connecting each induction coil to the power supply so that the turn of wire of the coil which is nearest to the plasma is near electrical ground potential. In one embodiment, the hot end of one coil is connected to the unbalanced output of an RF power supply, and the hot end of the other coil is connected to electrical ground through a capacitor which resonates with the latter coil at the frequency of the RF power supply.Type: ApplicationFiled: August 14, 2001Publication date: December 27, 2001Applicant: Applied Materials, Inc.Inventors: Bryan Y. Pu, Hongching Shan, Claes Bjorkman, Kenny Doan, Mike Welch, Richard Raymond Mett
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Patent number: 6273022Abstract: Apparatus and method for inductively coupling electrical power to a plasma in a semiconductor process chamber. In a first aspect, an array of induction coils is distributed over a geometric surface having a circular transverse section. Each coil has a transverse section which is wedge-shaped so that the adjacent sides of any two adjacent coils in the array are approximately parallel to a radius of the circular transverse section of the geometric surface. The sides of adjacent coils being parallel enhances the radial uniformity of the magnetic field produced by the coil array. In a second aspect, electrostatic coupling between the induction coils and the plasma is minimized by connecting each induction coil to the power supply so that the turn of wire of the coil which is nearest to the plasma is near electrical ground potential. In one embodiment, the near end of each coil connects directly to electrical ground. In second and third embodiments, two coils are connected in series at the near end of each coil.Type: GrantFiled: March 14, 1998Date of Patent: August 14, 2001Assignee: Applied Materials, Inc.Inventors: Bryan Y. Pu, Hongching Shan, Claes Bjorkman, Kenny Doan, Mike Welch, Richard Raymond Mett
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Publication number: 20010009139Abstract: An apparatus and method for controlling a plasma in a plasma processing system. The apparatus comprises a wafer support pedestal surrounded by a process kit that is driven by an RF signal. Both an electrode (cathode) in the pedestal and the process kit are driven with an RF signal to establish a primary plasma above the pedestal and a secondary plasma above the process kit.Type: ApplicationFiled: March 1, 2001Publication date: July 26, 2001Inventors: Hongqing Shan, Claes Bjorkman, Paul Luscher, Richard Mett, Michael Welch
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Patent number: 6232236Abstract: An apparatus and method for controlling a plasma in a plasma processing system. The apparatus comprises a wafer support pedestal surrounded by a process kit that is driven by an RF signal. Both an electrode (cathode) in the pedestal and the process kit are driven with an RF signal to establish a primary plasma above the pedestal and a secondary plasma above the process kit.Type: GrantFiled: August 3, 1999Date of Patent: May 15, 2001Assignee: Applied Materials, Inc.Inventors: Hongqing Shan, Claes Bjorkman, Paul Luscher, Richard Mett, Michael Welch
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Patent number: 6113731Abstract: A plasma chamber having a magnet which produces a magnetic field such that, within a region parallel to and adjacent to the workpiece, the direction of the magnetic field is approximately the vector cross product of (i) the gradient of the magnitude of the magnetic field, and (ii) a vector extending perpendicularly from the workpiece surface toward the plasma. Alternatively, the plasma chamber includes a north magnetic pole and a south magnetic pole located at distinct azimuths around the periphery of the workpiece. The azimuth of the south magnetic pole relative to the north magnetic pole is clockwise around the central axis, and each magnetic pole faces a direction which is more toward than away from a central axis of the workpiece area. An additional aspect of the invention is a plasma chamber having a rotating magnetic field produced by electromagnets spaced around the periphery of the workpiece which receive successive fixed amounts of electrical current during successive time intervals.Type: GrantFiled: January 2, 1997Date of Patent: September 5, 2000Assignee: Applied Materials, Inc.Inventors: Hongching Shan, Roger Lindley, Claes Bjorkman, Xue Yu Qian, Richard Plavidal, Bryan Pu, Ji Ding, Zongyu Li, Kuang-Han Ke, Michael Welch
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Patent number: 6074514Abstract: An apparatus and method for scavenging etchant species from a plasma formed of etchant gas prior to the etchant gas entering a primary processing chamber of a plasma reactor. There is at least one scavenging chamber, each of which is connected at an inlet thereof to an etchant gas source and at an outlet thereof to a gas distribution device of the primary processing chamber. Each scavenging chamber has a radiation applicator that irradiates the interior of the scavenging chamber and creates a plasma therein from etchant gas flowing through the chamber from the etchant gas source to the gas distribution apparatus of the primary processing chamber. The applicator uses either an inductive discharge, capacitive discharge, direct current (DC) discharge or microwave discharge to irradiate the interior of the scavenging chamber and ignite the plasma. An etchant species scavenging source is also disposed within the scavenging chamber.Type: GrantFiled: February 9, 1998Date of Patent: June 13, 2000Assignee: Applied Materials, Inc.Inventors: Claes Bjorkman, Hongching Shan, Michael Welch
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Patent number: 5420922Abstract: A system for safe transmission of a message with positive identification of the sender includes on the transmitter side telefax-type message-transmitting apparatus (10) and encryption means (22) for encrypting transmission signals from the telefax apparatus prior to transmission, and includes on the receiver side decryption means (25) for decrypting incoming signals prior to their receipt in telefax-type apparatus (20), and message enveloping and message gathering means (21) for safe storage of messages received by the telefax apparatus (20) in an enveloped form within a closed casing (11). Activating means (23) on the transmitter side includes a card reader (231) and keyboard (232) and is intended to activate the encryption means (22) in response to signals from the card reader (231) and the keyboard (232). Control means (24) on the receiver side function are adapted to activate the decryption means (25) in response to signals emanating from the card reader (231) and the keyboard (232).Type: GrantFiled: February 17, 1994Date of Patent: May 30, 1995Assignee: Nybo Seal System ABInventors: Leif Lundblad, Claes Bjorkman, Lars Eklund
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Patent number: 5246527Abstract: An arrangement for welding foil webs includes two coacting cog wheels, between which the foil webs are advanced, and a heat source. The heat source is comprised of a heating wire which is placed in the close proximity of the coacting parts of the cog wheels and the ends of which are connected to a current source which functions to heat the wire to a temperature above the softening temperature of the foil webs. The cog wheels will therewith function as a web-advancing mechanism and also as part of a web-welding mechanism.Type: GrantFiled: May 20, 1992Date of Patent: September 21, 1993Assignee: NYBO Seal System A.B.Inventors: Claes Bjorkman, Leif Lundblad, Tord Pettersson
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Patent number: 5199247Abstract: An arrangement for enveloping an object located between two heat weldable webs of enveloping material includes two coacting welding jaws for joining the webs together in their transversal direction on mutually opposite sides of the object. The welding jaws extend in the transverse direction of the webs, across the whole width thereof. One of the jaws is a wire-carrying jaw which supports a freely extending heating wire, and the other jaw is forked and has two legs. The jaws are moveable between a starting position on opposite sides of the webs, and a web welding position in which the webs are held together with the free ends of the fork legs in abutment with one side of the webs and with the heating wire located at the mouth region of the fork gap and in abutment with the other side of the webs. The wire functions to weld said material webs together and to melt-off the webs within the weld region.Type: GrantFiled: May 20, 1992Date of Patent: April 6, 1993Assignee: Nybo Seal System ABInventors: Claes Bjorkman, Leif Lundblad, Tord Pettersson