Patents by Inventor Clair M. Webb

Clair M. Webb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS OF FORMING UNDER DEVICE INTERCONNECT STRUCTURES
    Publication number: 20140264739
    Abstract: Methods of forming microelectronic interconnect under device structures are described. Those methods and structures may include forming a device layer in a first substrate, forming at least one routing layer in a second substrate, and then coupling the first substrate with the second substrate, wherein the first substrate is bonded to the second substrate.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 18, 2014
    Inventors: Patrick Morrow, Don Nelson, Clair M. Webb, Kimin Jun, Il-Seok Son