Abstract: An electronic device includes a carrier substrate with an electronic IC chip mounted on top of the carrier substrate. An encapsulation block on top of the front face of the carrier substrate embeds the IC chip. The encapsulation block has a through-void for positioning and confinement that extends through the encapsulation block to the top of the carrier substrate. At least one electronic component is positioned within the through-void and mounted to the top of the carrier substrate. Solder bumps or pads are located within the through-void to electrically connect the at least one electronic component to the carrier substrate.

Abstract: An electronic device includes a carrier substrate with an electronic IC chip mounted on top of the carrier substrate. An encapsulation block on top of the front face of the carrier substrate embeds the IC chip. The encapsulation block has a through-void for positioning and confinement that extends through the encapsulation block to the top of the carrier substrate. At least one electronic component is positioned within the through-void and mounted to the top of the carrier substrate. Solder bumps or pads are located within the through-void to electrically connect the at least one electronic component to the carrier substrate.

Abstract: A support substrate has a mounting face and a connection face opposite to the mounting face. An electronic chip is mounted to the mounting face and a matrix of connectors is mounted to the connection face. The support substrate includes an interconnection structure formed by a pair of conductive interconnection tracks that electrically connect the electronic chip to the matrix of connectors and circulate differential signals. The two interconnection tracks of the pair of conductive interconnection tracks extend facing each other at different depths of the support substrate. An isolation structure in the support substrate laterally isolates the pair of conductive interconnection tracks. Isolation plates above and below the pair of conductive interconnection tracks provide further isolation.

Abstract: An electronic device includes a carrier substrate with an electronic IC chip mounted on top of the carrier substrate. An encapsulation block on top of the front face of the carrier substrate embeds the IC chip. The encapsulation block has a through-void for positioning and confinement that extends through the encapsulation block to the top of the carrier substrate. At least one electronic component is positioned within the through-void and mounted to the top of the carrier substrate. Solder bumps or pads are located within the through-void to electrically connect the at least one electronic component to the carrier substrate.

Abstract: A device for regulating a voltage of an electric current supplying an integrated circuit resting on a substrate. The integrated circuit comprises a ground terminal and a power supply terminal able to receive the electric current. The regulation device comprises a first cover covering the integrated circuit, a second cover covering the integrated circuit. The first cover is electrically connected to the power supply terminal of the integrated circuit. The second cover is electrically connected to the ground terminal of the integrated circuit. The first cover and the second cover are connected together by a capacitive connection.

Abstract: An electronic device includes a carrier substrate with an electronic IC chip mounted on top of the carrier substrate. An encapsulation block on top of the front face of the carrier substrate embeds the IC chip. The encapsulation block has a through-void for positioning and confinement that extends through the encapsulation block to the top of the carrier substrate. At least one electronic component is positioned within the through-void and mounted to the top of the carrier substrate. Solder bumps or pads are located within the through-void to electrically connect the at least one electronic component to the carrier substrate.

Abstract: A coupling circuit, including: a coupler including a first conductive line and a second conductive line coupled to the first one; at each end of the second line of the coupler, a two-output signal splitter; and at each output of each splitter, a filtering function.

Abstract: A passive integrated circuit formed on a substrate, including contact areas of a conductive material specifically capable of receiving bonding pads, wherein the conductive material further creates connections between regions of a lower metallization level.

Abstract: A coupling circuit, including: a coupler including a first conductive line and a second conductive line coupled to the first one; at each end of the second line of the coupler, a two-output signal splitter; and at each output of each splitter, a filtering function.

Abstract: A multiband coupling circuit including: a number of paths equal to the number of frequency bands, each path having a first terminal and a second terminal; a third terminal and a fourth terminal; a number of distributed couplers equal to the number of paths, all couplers being identical and sized according to the highest frequency band, and each coupler including a first conductive line between first and second ports connected to the first and second terminals of the concerned path, and a second conductive line coupled to the first one between third and fourth ports; a first set of attenuations between the third ports of the couplers and the third terminal of the circuit; and an array of filters between the fourth ports of the coupler and the fourth terminal of the circuit.

Abstract: A distributed coupler including a first line intended to convey a radio signal between its two ends and a second line intended to sample, by coupling, part of the signal, wherein: one of the lines is formed on an insulating substrate; and the other line is formed in a lead frame supporting the substrate, one line being above the other.

Abstract: A distributed multiband coupling circuit including: a number n of first and of second terminals equal to the number of frequency bands; a third terminal and a fourth terminal; a number n of distributed couplers equal to the number of frequency bands, all couplers being identical and sized according to the highest frequency band, and each coupler including a first conductive line between first and second ports intended to convey a signal to be transmitted in the concerned frequency band, and a second conductive line coupled to the first one between third and fourth ports; a first set of resistive splitters in cascade between the third ports of the couplers, a terminal of the splitter associated with the first coupler being connected to the third terminal of the coupling circuit; and a second set of resistive splitters in cascade between the fourth ports of the couplers, a terminal of the splitter associated with the first coupler being connected to the fourth terminal of the coupling circuit.

Abstract: A balun including on the common-mode side, an inductive element in series with a first capacitive element between a first common-mode access terminal and the ground; and on the differential-mode side, two inductive windings in series having first respective ends defining differential access terminals and having second common ends connected to ground, second capacitive elements being respectively connected in parallel on the differential-mode windings.

Abstract: A multiband coupling circuit including: a number of paths equal to the number of frequency bands, each path having a first terminal and a second terminal; a third terminal and a fourth terminal; a number of distributed couplers equal to the number of paths, all couplers being identical and sized according to the highest frequency band, and each coupler including a first conductive line between first and second ports connected to the first and second terminals of the concerned path, and a second conductive line coupled to the first one between third and fourth ports; a first set of attenuations between the third ports of the couplers and the third terminal of the circuit; and an array of filters between the fourth ports of the coupler and the fourth terminal of the circuit.

Abstract: A distributed coupler including a first line intended to convey a radio signal between its two ends and a second line intended to sample, by coupling, part of the signal, wherein: one of the lines is formed on an insulating substrate; and the other line is formed in a lead frame supporting the substrate, one line being above the other.

Abstract: A passive integrated circuit formed on a substrate, including contact areas of a conductive material specifically capable of receiving bonding pads, wherein the conductive material further creates connections between regions of a lower metallization level.

Abstract: A distributed multiband coupling circuit including: a number n of first and of second terminals equal to the number of frequency bands; a third terminal and a fourth terminal; a number n of distributed couplers equal to the number of frequency bands, all couplers being identical and sized according to the highest frequency band, and each coupler including a first conductive line between first and second ports intended to convey a signal to be transmitted in the concerned frequency band, and a second conductive line coupled to the first one between third and fourth ports; a first set of resistive splitters in cascade between the third ports of the couplers, a terminal of the splitter associated with the first coupler being connected to the third terminal of the coupling circuit; and a second set of resistive splitters in cascade between the fourth ports of the couplers, a terminal of the splitter associated with the first coupler being connected to the fourth terminal of the coupling circuit.

Abstract: A balun including on the common-mode side, an inductive element in series with a first capacitive element between a first common-mode access terminal and the ground; and on the differential-mode side, two inductive windings in series having first respective ends defining differential access terminals and having second common ends connected to ground, second capacitive elements being respectively connected in parallel on the differential-mode windings.