Abstract: In an example of the disclosure, first and second print jobs are received at a printer. The first and second print jobs each include production frames. The first and second print jobs are printed with a media roll change occurring during printing. A first finishing device information nonproduction (“FDIN”) frame and a second FDIN frame are printed. The first and second FDIN frames include coded information regarding the first print job and the second print job, respectively. The coded information is for reading by a scanner at a finishing device. A press calibration nonproduction (“PCN”) frame that includes a printer calibration diagnostic is printed. A scanner at the printer is caused to capture the printer calibration diagnostic. A calibration operation is performed at the printer utilizing data or attributes captured from the printer calibration diagnostic.

Abstract: In an example of the disclosure, first and second print jobs are received at a printer. The first and second print jobs each include production frames. The first and second print jobs are printed with a media roll change occurring during printing. A first finishing device information nonproduction (“FDIN”) frame and a second FDIN frame are printed. The first and second FDIN frames include coded information regarding the first print job and the second print job, respectively. The coded information is for reading by a scanner at a finishing device. A press calibration nonproduction (“PCN”) frame that includes a printer calibration diagnostic is printed. A scanner at the printer is caused to capture the printer calibration diagnostic. A calibration operation is performed at the printer utilizing data or attributes captured from the printer calibration diagnostic.

Abstract: A fluid ejection device includes a substrate; a plurality of resistors on the substrate with separation of between 4 and 8 microns between adjacent resistors; an adhesion layer applied over the plurality of resistors; and a layer of silicon carbide (SiC) applied directly over the adhesion layer such that the silicon carbide is between adjacent resistors. A method of forming a fluid ejection device includes forming resistors and conductive traces attached to a substrate; depositing an adhesion layer over the resistors; depositing a silicon carbide (SiC) coating directly over the adhesion layer; and forming an epoxy layer over silicon carbide layer.