Abstract: The invention is a method and apparatus for encapsulating semiconductor dies via stencil printing in which, after the dies have been stencil printed with encapsulant and prior to removal of the stencil from the dies, the edges of the encapsulating material are partially cured in order to prevent or minimize slump of the encapsulant in the time period between removal of the stencil and full curing of the encapsulant. In particular, the stencil can be provided with a plurality of light pipes that terminate at the edges of the apertures within which the dies are placed. Ultraviolet (UV) or other curing light is provided through the light pipes to the edges of the encapsulating material. Some general or localized heating can be provided to enhance or accelerate the light curing of the edges of the encapsulant, but without substantially curing the remainder of the encapsulating material.

Abstract: The present invention is a method and apparatus for encapsulating semiconductor dies and other devices using stencil printing techniques. The apparatus includes a pressurized vessel for containing encapsulation material, the apparatus having a head including a slot through which the encapsulating material escapes into the apertures of the stencil. The head is angularly adjustable relative to the stencil and thus relative to the streets between the semiconductor dies that are in the apertures of the stencil so that the head can be adjusted to the optimal angle for filling both the vertical and horizontal streets between the dies and minimizing the creation of voids in the encapsulant. The method involves encapsulating semiconductor dies using a pressurized stencil printing machine having a slot through which the encapsulating material is forced into the apertures in the stencil and wherein the slot is at a large angle relative to both the vertical and horizontal streets.

Abstract: The present invention is a method and apparatus for encapsulating semiconductor dies and other devices using stencil printing techniques. The apparatus includes a pressurized vessel for containing encapsulation material, the apparatus having a head including a slot through which the encapsulating material escapes into the apertures of the stencil. The head is angularly adjustable relative to the stencil and thus relative to the streets between the semiconductor dies that are in the apertures of the stencil so that the head can be adjusted to the optimal angle for filling both the vertical and horizontal streets between the dies and minimizing the creation of voids in the encapsulant. The method involves encapsulating semiconductor dies using a pressurized stencil printing machine having a slot through which the encapsulating material is forced into the apertures in the stencil and wherein the slot is at a large angle relative to both the vertical and horizontal streets.

Abstract: The invention is a method and apparatus for encapsulating semiconductor dies via stencil printing in which, after the dies have been stencil printed with encapsulant and prior to removal of the stencil from the dies, the edges of the encapsulating material are partially cured in order to prevent or minimize slump of the encapsulant in the time period between removal of the stencil and full curing of the encapsulant. In particular, the stencil can be provided with a plurality of light pipes that terminate at the edges of the apertures within which the dies are placed. Ultraviolet (UV) or other curing light is provided through the light pipes to the edges of the encapsulating material. Some general or localized heating can be provided to enhance or accelerate the light curing of the edges of the encapsulant, but without substantially curing the remainder of the encapsulating material.