Abstract: This multilayer component (11) for encapsulating an element (12) which is sensitive to air and/or moisture comprises an organic polymer layer (1) and at least one barrier stack (2). The barrier stack (2) comprises at least three successive thin layers (21-23) having alternately lower and higher degrees of crystallinity, the ratio of the degree of crystallinity of a layer of higher degree of crystallinity to the degree of crystallinity of a layer of lower degree of crystallinity being greater than or equal to 1.1.

Abstract: This layered element (11) for encapsulating an element (12) that is sensitive to air and/or moisture, especially an element that collects or emits radiation such as a photovoltaic cell or an organic light-emitting diode, comprises a polymer layer (1) and a barrier layer (2) against at least one face (1A) of the polymer layer. The barrier layer (2) has a moisture vapor transfer rate of less than 10?2 g/m2 per day and consists of a multilayer of at least two thin hydrogenated silicon nitride layers (21, 22, 23, 24) having alternately lower and higher densities.

Abstract: The present disclosure is directed to transparent infra-red (IR) reflective and/or low emissivity composite films which contain an ALD metal oxide based layer. Specific embodiments of the present disclosure are directed to an IR reflective composite film comprising: a transparent substrate layer comprising a polymer; one or more metal based layers; one or more silver based layers; one or more metal oxide based layers; and an ALD metal oxide based layer.

Abstract: A device includes an organic polymer layer and an electrode positioned against the polymer layer, the electrode being constituted by a transparent stack of thin layers including an alternation of n thin metallic layers and of (n+1) antireflection coatings, with n?1, where each thin metallic layer is placed between two antireflection coatings. At least one of the two antireflection coatings located at the ends of the constituent stack of the electrode includes a stack that is a barrier to moisture and gases, the layers of the or each barrier stack having alternately lower and higher densities.

Abstract: A process for manufacturing a hydrophobic glazing by: (i) forming a carbon-rich SiOxCy layer at a surface of a mineral glass substrate via CVD by contacting the surface with a stream containing C2H4, SiH4, and CO2 with an C2H4/SiH4 ratio of less than or equal to 3.3 by volume, at a temperature of between 600° C. and 680° C.; (ii) forming a SiO2 layer or a carbon-poor silicon oxycarbide layer with a mean C/Si ratio of less than 0.2 on the carbon-rich SiOxCy layer, thereby obtaining a layered substrate; (iii) annealing and/or shaping the layered substrate at a temperature of between 580° C. and 700° C.; (iv) activating the SiO2 layer or the carbon-poor silicon oxycarbide layer by plasma treatment or acidic or basic chemical treatment; and (v) grafting, by covalent bonding, a fluorinated hydrophobic agent to the surface of the SiO2 layer or the carbon-poor silicon oxycarbide layer.

Abstract: The invention relates to a glazing comprising a transparent glass substrate containing ions of at least one alkali metal and a transparent layer made of silicon oxycarbide (SiOxCy) having a total thickness E with (a) a carbon-rich deep zone, extending from a depth P3 to a depth P4, where the C/Si atomic ratio is greater than or equal to 0.5, and (b) a carbon-poor surface zone, extending from a depth P1 to a depth P2, where the C/Si atomic ratio is less than or equal to 0.4, with P1<P2<P3<P4 and (P2?P1)+(P4?P3)<E the distance between P1 and P2 representing from 10% to 70% of the total thickness E of the silicon oxycarbide layer and the distance between P3 and P4 representing from 10% to 70% of the total thickness E of the silicon oxycarbide layer.

Abstract: The invention relates to a glazing comprising a transparent glass substrate containing ions of at least one alkali metal and a transparent layer mad of silicon oxycarbide (SiOxCy) having a total thickness E with (a) a carbon-rich deep zone, extending from a depth P3 to a depth P4, where the C/Si atomic ratio is greater than or equal to 0.5, and (b) a carbon-poor surface zone, extending from a depth P1 to a depth P2, where the C/Si atomic ratio is less than or equal to 0.4, with P1<P2<P3<P4 and (P2-P1)+(P4-P3)<E the distance between P1 and P2 representing from 10% to 70% of the total thickness E of the silicon oxycarbide layer and the distance between P3 and P4 representing from 10% to 70% of the total thickness E of the silicon oxycarbide layer.

Abstract: The invention relates to a process for the manufacture of a hydrophobic glazing comprising the following successive stages: (a) formation of a carbon-rich silicon oxycarbide (SiOxCy) layer at the surface of a substrate made of mineral glass by chemical vapor deposition (CVD) over at least a portion of the surface of said substrate by bringing said surface into contact with a stream of reactive gases comprising ethylene (C2H4), silane (SiH4) and carbon dioxide (CO2) at a temperature of between 600° C. and 680° C., the ethylene/silane (C2H4/SiH4) ratio by volume during stage (a) being less than or equal to 3.3, (b) formation of an SiO2 layer on the silicon oxycarbide layer deposited in stage (a) or (b?) formation of a carbon-poor silicon oxycarbide layer exhibiting a mean C/Si ratio of less than 0.2, (c) annealing and/or shaping the substrate obtained on conclusion of stage (b) or (b?) at a temperature of between 580° C. and 700° C.

Abstract: The invention relates to a process for obtaining a hydrophobic coating on a substrate, preferably consisting of a glass material, a ceramic or a glass-ceramic, said process being characterized in that it comprises: a) a first deposition step, consisting in applying a primer first layer essentially consisting of the silicon oxycarbide SiOxCy type on said substrate, said primer layer having an RMS surface roughness of greater than 4 nm; b) an activation step, in which said SiOxCy primer layer is activated by a plasma of a gas chosen from the noble gases of the Ar or He type and the gases N2, O2 or H2O or by a plasma of a mixture of these gases; and c) a second deposition step, in which a hydrophobic coating comprising at least one fluorocompound, preferably a fluoroalkylsilane, is deposited on said first layer. The invention also relates to hydrophobic glazing comprising or formed by a substrate as defined above, this glazing being in particular used as glazing for transport vehicles or for buildings.

Abstract: This substrate (11) for a device (50) that collects or emits radiation comprises a transparent polymer layer (1) and a barrier layer (2) on at least one face (1A) of the polymer layer. The barrier layer (2) consists of an antireflection multilayer of at least two thin transparent layers (21, 22, 23, 24) having both alternately lower and higher refractive indices and alternately lower and higher densities, wherein each thin layer (21, 22, 23, 24) of the constituent multilayer of the barrier layer (2) is an oxide, nitride or oxynitride layer.

Abstract: A device includes an organic polymer layer and an electrode positioned against the polymer layer, the electrode being constituted by a transparent stack of thin layers including an alternation of n thin metallic layers and of (n+1) antireflection coatings, with n?1, where each thin metallic layer is placed between two antireflection coatings. At least one of the two antireflection coatings located at the ends of the constituent stack of the electrode includes a stack that is a barrier to moisture and gases, the layers of the or each barrier stack having alternately lower and higher densities.

Abstract: This multilayer component (11) for encapsulating an element (12) which is sensitive to air and/or moisture comprises an organic polymer layer (1) and at least one barrier stack (2). The barrier stack (2) comprises at least one sequence of layers consisting of a retention layer (22) sandwiched between two high-activation-energy layers (21, 23), in which: for each of the two high-activation-energy layers (21, 23), the difference in activation energy for water vapor permeation between, on the one hand, a reference substrate coated with the high-activation-energy layer and, on the other hand, this same reference substrate when bare is greater than or equal to 20 kJ/mol; and the ratio of the effective water vapor diffusivity in the retention layer (22) on a reference substrate to the water vapor diffusivity in this same reference substrate when bare is strictly less than 0.1.

Abstract: This multilayer component (11) for encapsulating an element (12) which is sensitive to air and/or moisture comprises an organic polymer layer (1) and at least one barrier stack (2). The barrier stack (2) comprises at least three successive thin layers (21-23) having alternately lower and higher degrees of crystallinity, the ratio of the degree of crystallinity of a layer of higher degree of crystallinity to the degree of crystallinity of a layer of lower degree of crystallinity being greater than or equal to 1.1.

Abstract: This layered element (11) for encapsulating an element (12) that is sensitive to air and/or moisture, especially an element that collects or emits radiation such as a photovoltaic cell or an organic light-emitting diode, comprises a polymer layer (1) and a barrier layer (2) against at least one face (1A) of the polymer layer. The barrier layer (2) has a moisture vapor transfer rate of less than 10?2 g/m2 per day and consists of a multilayer of at least two thin hydrogenated silicon nitride layers (21, 22, 23, 24) having alternately lower and higher densities.

Abstract: This substrate (11) for a device (50) that collects or emits radiation comprises a transparent polymer layer (1) and a barrier layer (2) on at least one face (1A) of the polymer layer. The barrier layer (2) consists of an antireflection multilayer of at least two thin transparent layers (21, 22, 23, 24) having both alternately lower and higher refractive indices and alternately lower and higher densities, wherein each thin layer (21, 22, 23, 24) of the constituent multilayer of the barrier layer (2) is an oxide, nitride or oxynitride layer.

Abstract: The invention relates to a process for obtaining a hydrophobic coating on a substrate, preferably consisting of a glass material, a ceramic or a glass-ceramic, said process being characterized in that it comprises: a) a first deposition step, consisting in applying a primer first layer essentially consisting of the silicon oxycarbide SiOxCy type on said substrate, said primer layer having an RMS surface roughness of greater than 4 nm; b) an activation step, in which said SiOxCy primer layer is activated by a plasma of a gas chosen from the noble gases of the Ar or He type and the gases N2, O2 or H2O or by a plasma of a mixture of these gases; and c) a second deposition step, in which a hydrophobic coating comprising at least one fluorocompound, preferably a fluoroalkylsilane, is deposited on said first layer. The invention also relates to hydrophobic glazing comprising or formed by a substrate as defined above, this glazing being in particular used as glazing for transport vehicles or for buildings.