Abstract: Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.

Abstract: A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.

Abstract: A spatial light modulator comprises an integrated optical compensation structure, e.g., an optical compensation structure arranged between a substrate and a plurality of individually addressable light-modulating elements, or an optical compensation structure located on the opposite side of the light-modulating elements from the substrate. The individually addressable light-modulating elements are configured to modulate light transmitted through or reflected from the transparent substrate. Methods for making such spatial light modulators involve fabricating an optical compensation structure over a substrate and fabricating a plurality of individually addressable light-modulating elements over the optical compensation structure. The optical compensation structure may be a passive optical compensation structure.

Abstract: A display array which can reduce the row connections between the display and the driver circuit and methods of manufacturing and operating the same are disclosed. In one embodiment, a display device comprises an array of MEMS display elements and a plurality of voltage dividers coupled to the array and configured to provide row output voltages to drive the array, wherein each row is connected to at least two inputs joined by a voltage divider.

Abstract: An interferometric modulator array device with backlighting is disclosed. The interferometric modulator array device comprises a plurality of interferometric modulator elements, wherein each of the interferometric modulator elements comprises an optical cavity. The interferometric modulator array includes an optical aperture region, and at least one reflecting element is positioned so as to receive light passing through the optical aperture region and reflect at least a portion of the received light to the cavities of the interferometric modulator elements. In some embodiments, the interferometric modulator elements may be separated from each other such that an optical aperture region is formed between adjacent interferometric modulator elements.

Abstract: Embodiments of an interferometric modulator are disclosed having various enhancements and features including a conductive bus. In certain embodiments, the interferometric modulator has a first conductive layer suspended over a second electrode layer. In certain embodiments, a second conductive layer is provided over the first conductive layer. One of the first and/or second conductive buses may further connect to the first electrode layer and/or the second electrode layer. Other disclosed features can be incorporated into embodiments of the interferometric modulator to improve response time, power consumption, and image resolution.

Abstract: A displaying apparatus that includes a plurality of electromechanical system elements arranged in rows. The electromechanical system elements of each of the rows are further arranged in subrows. The subrows of each row are electrically connected. Certain of the electromechanical system elements have a hysteresis stability window that is nested with another hysteresis stability window of certain others of the electromechanical system elements. A method of manufacturing a displaying apparatus that includes forming a plurality of electromechanical system elements arranged in rows. The electromechanical system elements of each of the rows are further arranged in subrows. The subrows of each row are electrically connected. Certain of the electromechanical system elements have a hysteresis stability window that is nested with another hysteresis stability window of certain others of the electromechanical system elements.

Abstract: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, both rivets and posts may be used. In certain embodiments, these support structures are formed from rigid inorganic materials, such as metals or oxides. In certain embodiments, etch barriers may also be deposited to facilitate the use of materials in the formation of support structures which are not selectively etchable with respect to other components within the MEMS device.

Abstract: Various embodiments include interferometric optical modulators comprising a substrate layer having a thickness between about 0.1 mm to about 0.45 mm thick and a method for manufacturing the same. The interferometric modulator can be integrated together with a diffuser in a display device. The thin substrate permits use of a thicker diffuser. The thinner substrate may increase resolution and reduce overall thickness of the inteferometric modulator. The thicker diffuser may provide increased diffusion and durability.

Abstract: An interferometric light modulating device having two viewing surfaces is provided. In some embodiments, the device can generate two distinct images, one on each side of the device, simultaneously.

Abstract: An interferometric modulator is formed having a dielectric with charge persistence. The interferometric modulator is addressed by a method making advantageous use of the charge persistence property, wherein the interferometric modulator is pre-charged in such a way that the pre-charging is not observable to a viewer, and the actuation voltage threshold of the imod is significantly lowered. Subsequently the interferometric modulator may be actuated with a significantly lower actuation voltage, thereby saving power.

Abstract: A microelectromechanical (MEMS) device includes a substrate, a movable element over the substrate, and an actuation electrode above the movable element. The movable element includes a deformable layer and a reflective element. The deformable layer is spaced from the reflective element.

Abstract: Embodiments of an interferometric modulator are disclosed having various enhancements and features including a conductive bus. In certain embodiments, the interferometric modulator has a first conductive layer suspended over a second electrode layer. In certain embodiments, a second conductive layer is provided over the first conductive layer. One of the first and/or second conductive buses may further connect to the first electrode layer and/or the second electrode layer. Other disclosed features can be incorporated into embodiments of the interferometric modulator to improve response time, power consumption, and image resolution.

Abstract: The width and location of a hysteresis window of an interferometric modulator may be altered by adjusting various physical characteristics of the interferometric modulator. Thus, depending on the particular application for which the interferometric modulators are manufactured, the width and location of the hysteresis window may be altered. For example, in some applications, reducing the power required to operate an array of interferometric modulators may be an important consideration. In other applications, the speed of the interferometric modulators may be of more importance, where the speed of an interferometric modulator, as used herein, refers to the speed of actuating and relaxing the moveable mirror. In other applications, the cost and ease of manufacturing may be of most importance. Systems and methods are introduced that allow selection of a width and location of a hysteresis window by adjusting various physical characteristics.

Abstract: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.

Abstract: Various embodiments include interferometric optical modulators comprising a substrate layer having a thickness between about 0.1 mm to about 0.45 mm thick and a method for manufacturing the same. The interferometric modulator can be integrated together with a diffuser in a display device. The thin substrate permits use of a thicker diffuser. The thinner substrate may increase resolution and reduce overall thickness of the interferometric modulator. The thicker diffuser may provide increased diffusion and durability.

Abstract: A microelectromechanical (MEMS) device includes a substrate, a movable element over the substrate, and an actuation electrode above the movable element. The movable element includes a deformable layer and a reflective element. The deformable layer is spaced from the reflective element.

Abstract: Disclosed are apparatus and methods for fabricating a static interferometric display device. A plurality of sputtering modules is used to form static interferometric elements on a substrate. These elements each have a plurality of interferometric sub-elements that each has an interferometric stack. A first sub-element of each element is formed so that an interferometric modulation of light due to the first element's stack transmits at a first color, and a second sub-element of each element is formed so that a second color is transmitted. The sub-elements of each element are arranged with respect to each other so that all of the elements appear as a third color to a user if all the sub-elements of each element are left unmasked. A printing system is then used to mask one or more sub-elements of one or more elements so as to form, with the elements, a static image having multiple colors.

Abstract: An interferometric modulator is provided having a faster deformation time constant on actuation than relaxation time constant upon release from actuation. In some embodiments, apertures are formed in a mechanical membrane to decrease pressure, including liquid and/or gas pressures, on the membrane when actuated. In other embodiments, a dampening layer is disposed in close proximity above the membrane to apply greater downward pressure on the membrane and therefore slow the motion of the membrane when released from an actuated state. Other embodiments comprise structures, such as a heating element or vacuum device, to manipulate pressures above and/or below the mechanical membrane to affect the mechanical persistence of the display device.

Abstract: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, both rivets and posts may be used. In certain embodiments, these support structures are formed from rigid inorganic materials, such as metals or oxides. In certain embodiments, etch barriers may also be deposited to facilitate the use of materials in the formation of support structures which are not selectively etchable with respect to other components within the MEMS device.