Abstract: A combined system and method for computer-controlled bonding and testing of wire connections between integrated circuit chips and substrates, and for automatically adjusting the bonding parameters in response to said testing, comprising the steps of forming a wire connection between said chip and said substrate under computer control to create wire attachments and a wire span; testing said wire connection automatically under computer control to generate test data; and automatically adjusting the bonding parameters of subsequent wire connections responsive to said test data, whereby the number of faulty bonds is reduced to near zero and bonding production downtime is substantially eliminated.